Vishay Intertechnology Inc Sample Contracts

AND
Credit Agreement • March 15th, 2004 • Vishay Intertechnology Inc • Electronic components & accessories • Michigan
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TRUSTEE
Indenture • June 18th, 2001 • Vishay Intertechnology Inc • Electronic components & accessories • New York
Exhibit 1.2
Purchase Agreement • May 24th, 2000 • Vishay Intertechnology Inc • Electronic components & accessories • New York
RECITALS
Voting Agreement • September 6th, 2001 • Vishay Intertechnology Inc • Electronic components & accessories • Delaware
AND ___________________________________ as Trustee Indenture
Vishay Intertechnology Inc • April 6th, 2000 • Electronic components & accessories • New York
2.25% Convertible Senior Notes due 2025
Indenture • June 13th, 2018 • Vishay Intertechnology Inc • Electronic components & accessories • New York

INDENTURE, dated as of June 12, 2018, between VISHAY INTERTECHNOLOGY, INC., a Delaware corporation, as issuer (the "Company", as more fully set forth in Section 1.01), and HSBC BANK USA, NATIONAL ASSOCIATION, as trustee (the "Trustee", as more fully set forth in Section 1.01).

RECITALS
Joinder Agreement • March 17th, 1998 • Vishay Intertechnology Inc • Electronic components & accessories • Michigan
RECITALS
Credit Agreement • May 25th, 2004 • Vishay Intertechnology Inc • Electronic components & accessories • Michigan
RECITALS
Vishay Intertechnology Inc • March 17th, 1998 • Electronic components & accessories • Michigan
VISHAY INTERTECHNOLOGY, INC. AND HSBC BANK USA, NATIONAL ASSOCIATION, as Trustee INDENTURE Dated as of September 12, 2023
Vishay Intertechnology Inc • September 12th, 2023 • Electronic components & accessories • New York

INDENTURE, dated as of September 12, 2023, between VISHAY INTERTECHNOLOGY, INC., a Delaware corporation, as issuer (the “Company”, as more fully set forth in Section 1.01), and HSBC BANK USA, NATIONAL ASSOCIATION, as trustee (the “Trustee”, as more fully set forth in Section 1.01).

Contract
Credit Agreement • August 8th, 2013 • Vishay Intertechnology Inc • Electronic components & accessories • New York
INDENTURE
Indenture • November 5th, 2003 • Vishay Intertechnology Inc • Electronic components & accessories • New York
ARTICLE I
Consulting and Non-Competition Agreement • March 15th, 2004 • Vishay Intertechnology Inc • Electronic components & accessories • New York
ARTICLE I DEFINITIONS
Put and Call Agreement • December 23rd, 2002 • Vishay Intertechnology Inc • Electronic components & accessories • New York
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The purpose of this letter agreement (this “Confirmation”) is to confirm the terms and conditions of the call option transaction entered into between [DEALER] (“Dealer”) and Vishay Intertechnology, Inc. (“Counterparty”) as of the Trade Date specified...
Vishay Intertechnology Inc • September 12th, 2023 • Electronic components & accessories

The definitions and provisions contained in the 2002 ISDA Equity Derivatives Definitions (the “Equity Definitions”), as published by the International Swaps and Derivatives Association, Inc. (“ISDA”) are incorporated into this Confirmation. In the event of any inconsistency between the Equity Definitions and this Confirmation, this Confirmation shall govern. Certain defined terms used herein are based on terms that are defined in the Offering Memorandum dated September 7, 2023 (the “Offering Memorandum”) relating to the 2.25% Convertible Senior Notes due 2030 (as originally issued by Counterparty, the “Convertible Notes” and each USD 1,000 principal amount of Convertible Notes, a “Convertible Note”) issued by Counterparty in an aggregate initial principal amount of USD 650,000,000 (as increased by up to an aggregate principal amount of USD 100,000,000 if and to the extent that the Initial Purchasers (as defined below) exercise their option to purchase additional Convertible Notes pursu

AND
Term Revolving Credit Agreement • March 17th, 1998 • Vishay Intertechnology Inc • Electronic components & accessories • Michigan
MASTER SEPARATION AND DISTRIBUTION AGREEMENT between VISHAY INTERTECHNOLOGY, INC. and VISHAY PRECISION GROUP, INC.
Master Separation and Distribution Agreement • June 23rd, 2010 • Vishay Intertechnology Inc • Electronic components & accessories • New York

This Master Separation and Distribution Agreement (this “Agreement”) is entered into as of June 22, 2010, by and between Vishay Intertechnology, Inc., a corporation organized under the laws of the State of Delaware (“Vishay”), and Vishay Precision Group, Inc., a corporation organized under the laws of the State of Delaware (“VPG”).

EMPLOYMENT AGREEMENT
Employment Agreement • February 29th, 2024 • Vishay Intertechnology Inc • Electronic components & accessories • Pennsylvania

THIS EMPLOYMENT AGREEMENT (this “Agreement”) is entered into on February 27, 2024, by and between VISHAY INTERTECHNOLOGY, INC., a Delaware corporation (“Vishay”), and MICHAEL S. O’SULLIVAN (“Executive”).

Form of Executive Officer Restricted Stock Unit Agreement
Restricted Stock Unit Agreement • May 21st, 2014 • Vishay Intertechnology Inc • Electronic components & accessories • Delaware

The Company has adopted and maintains the Vishay Intertechnology, Inc. 2007 Stock Incentive Program, as amended and restated, (the "Program") to enhance the long-term performance of the Company and to provide selected individuals with an incentive to improve the growth and profitability of the Company by acquiring a proprietary interest in the success of the Company.

CREDIT AGREEMENT dated as of December 1, 2010 among VISHAY INTERTECHNOLOGY, INC., The Subsidiary Borrowers Party Hereto, The Lenders Party Hereto and JPMORGAN CHASE BANK, N.A., as Administrative Agent COMERICA BANK and BANK LEUMI USA, as Joint...
Credit Agreement • December 1st, 2010 • Vishay Intertechnology Inc • Electronic components & accessories • New York

Page ARTICLE I Definitions SECTION 1.01. Defined Terms 1 SECTION 1.02. Types of Loans and Borrowings 36 SECTION 1.03. Terms Generally 36 SECTION 1.04. Accounting Terms; GAAP; Pro Forma Calculations 37 ARTICLE II The Credits SECTION 2.01. Commitments 38 SECTION 2.02. Loans and Borrowings 38 SECTION 2.03. Requests for Borrowings 39 SECTION 2.04. Swingline Loans 40 SECTION 2.05. Letters of Credit 41 SECTION 2.06. Funding of Borrowings 47 SECTION 2.07. Interest Elections 48 SECTION 2.08. Termination and Reduction of Commitments 49 SECTION 2.09. Repayment of Loans; Evidence of Debt 50 SECTION 2.10. Prepayment of Loans 50 SECTION 2.11. Fees 51 SECTION 2.12. Interest 52 SECTION 2.13. Alternate Rate of Interest 53 SECTION 2.14. Increased Costs 53 SECTION 2.15. Break Funding Payments 55 SECTION 2.16. Taxes 56 SECTION 2.17. Payments Generally; Pro Rata Treatment; Sharing of Setoffs 59 SECTION 2.18. Mitigation Obligations; Replacement of Lenders 61 SECTION 2.19. Defaulting Lenders 62 SECTION 2.20

The purpose of this letter agreement (this “Confirmation”) is to confirm the terms and conditions of the call option transaction entered into between [DEALER] (“Dealer”) and Vishay Intertechnology, Inc. (“Counterparty”) as of the Trade Date specified...
Vishay Intertechnology Inc • September 12th, 2023 • Electronic components & accessories

The definitions and provisions contained in the 2002 ISDA Equity Derivatives Definitions (the “Equity Definitions”), as published by the International Swaps and Derivatives Association, Inc. (“ISDA”) are incorporated into this Confirmation. In the event of any inconsistency between the Equity Definitions and this Confirmation, this Confirmation shall govern. Certain defined terms used herein are based on terms that are defined in the Offering Memorandum dated September 7, 2023 (the “Offering Memorandum”) relating to the 2.25% Convertible Senior Notes due 2030 (as originally issued by Counterparty, the “Convertible Notes” and each USD 1,000 principal amount of Convertible Notes, a “Convertible Note”) issued by Counterparty in an aggregate initial principal amount of USD 650,000,000 (as increased by an aggregate principal amount of USD 100,000,000 pursuant to the exercise by the Initial Purchasers (as defined below) of their option to purchase additional Convertible Notes pursuant to the

AMENDED AND RESTATED EMPLOYMENT AGREEMENT
Employment Agreement • May 15th, 2009 • Vishay Intertechnology Inc • Electronic components & accessories • Delaware

THIS AMENDED AND RESTATED EMPLOYMENT AGREEMENT (this “Agreement”) is made this 13th day of May, 2009, by and between VISHAY INTERTECHNOLOGY, INC., a Delaware corporation (“Vishay”), and DR. FELIX ZANDMAN (the “Executive”).

VOTING AGREEMENT
Voting Agreement • August 30th, 2011 • Vishay Intertechnology Inc • Electronic components & accessories • Delaware

This VOTING AGREEMENT is made as of December 29, 2010, among the Zandman Representative (as defined below) and the several stockholders of Vishay Intertechnology, Inc., a Delaware corporation (the “Corporation”) whose names are subscribed below (the “Existing Stockholders”), and the individuals whose names are subscribed below under the heading “Potential Stockholders” (together with the Existing Stockholders, the “Stockholders”).

Vishay Intertechnology, Inc. Executive Officer Restricted Stock Unit Agreement
Officer Restricted Stock Unit Agreement • February 14th, 2020 • Vishay Intertechnology Inc • Electronic components & accessories • Delaware

The Company has adopted and maintains the Vishay Intertechnology, Inc. 2007 Stock Incentive Program, as amended and restated, (the “Program”) to enhance the long-term performance of the Company and to provide selected individuals with an incentive to improve the growth and profitability of the Company by acquiring a proprietary interest in the success of the Company.

PLEDGE AND SECURITY AGREEMENT
Pledge and Security Agreement • November 4th, 2008 • Vishay Intertechnology Inc • Electronic components & accessories • New York

Pursuant to the Loan Agreement dated as of the date hereof (as amended, supplemented or modified from time to time, the “Loan Agreement”; capitalized terms used but not defined herein shall have the meanings given such terms in the Loan Agreement) by and among Kemet Electronics Corporation, as Borrower, and Secured Party, Secured Party has agreed to make a Loan to Borrower. In order to induce Secured Party to make the Loan, Grantor has agreed to grant a continuing Lien on the Collateral to secure the Obligations (as hereinafter defined). Accordingly, Grantor hereby agrees as follows:

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