NXP B.V. NXP FUNDING LLC as Issuers EACH OF THE GUARANTORS PARTY HERETO and DEUTSCHE BANK TRUST COMPANY AMERICAS, as Trustee $750,000,000 3.75% Senior Notes due 2018 SENIOR INDENTURE Dated as of May 20, 2013NXP Semiconductors N.V. • February 28th, 2014 • Semiconductors & related devices • New York
INDENTURE dated as of May 20, 2013, among NXP B.V. (the “Company”), NXP Funding LLC (the “Co-Issuer” and, together with the Company, the “Issuers”), the Guarantors (as defined herein) and Deutsche Bank Trust Company Americas, as trustee (the “Trustee”).
NXP B.V. NXP FUNDING LLC as Issuers EACH OF THE GUARANTORS PARTY HERETO and DEUTSCHE BANK TRUST COMPANY AMERICAS, as Trustee $500,000,000 3.50% Senior Notes due 2016 SENIOR INDENTURE Dated as of September 24, 2013Senior Indenture • February 28th, 2014 • NXP Semiconductors N.V. • Semiconductors & related devices • New York
INDENTURE dated as of September 24, 2013, among NXP B.V. (the “Company”), NXP Funding LLC (the “Co-Issuer” and, together with the Company, the “Issuers”), the Guarantors (as defined herein) and Deutsche Bank Trust Company Americas, as trustee (the “Trustee”).
NXP B.V. NXP FUNDING LLC as Issuers EACH OF THE GUARANTORS PARTY HERETO and DEUTSCHE BANK TRUST COMPANY AMERICAS, as Trustee $500,000,000 5.75% Senior Notes due 2023 SENIOR INDENTURE Dated as of March 12, 2013Note Guarantee Supplement • February 28th, 2014 • NXP Semiconductors N.V. • Semiconductors & related devices • New York
INDENTURE dated as of March 12, 2013, among NXP B.V. (the “Company”), NXP Funding LLC (the “Co-Issuer” and, together with the Company, the “Issuers”), the Guarantors (as defined herein) and Deutsche Bank Trust Company Americas, as trustee (the “Trustee”).
Agreement on Lease of Standard Plant Basement of Export Processing Zone Administration, Ministry of Economic AffairsNXP Semiconductors N.V. • February 28th, 2014 • Semiconductors & related devices
Whereas both parties agree that Party A leases to Party B the basement located at 106 Inner Ring (south) Road, Nanzi Processing Zone, both parties hereby reach the following agreement as follows:
