OCLARO, INC. EXECUTIVE SEVERANCE AND RETENTION AGREEMENTExecutive Severance and Retention Agreement • February 6th, 2014 • Oclaro, Inc. • Semiconductors & related devices • Delaware
THIS EXECUTIVE SEVERANCE AND RETENTION AGREEMENT (the “Agreement”) by and between Oclaro, Inc., a Delaware corporation (the “Company”), and David Teichmann (the “Executive”) is made as January 1, 2014, (the “Effective Date”).
CONFIDENTIAL SEPARATION AGREEMENT AND RELEASE OF CLAIMSConfidential Separation Agreement • February 6th, 2014 • Oclaro, Inc. • Semiconductors & related devices • California
This Confidential Separation Agreement and Release of Claims (the “Agreement”) is entered into as of this 7th day of November, 2013 by and between Oclaro, Inc., a Delaware corporation (“Company”) and Jerry Turin (“Executive”). Company and Executive are sometimes referred to herein individually as a “Party” and collectively as the “Parties.” This Agreement was originally provided to Executive for his review on October 17, 2013.
CONFIDENTIAL SEPARATION AGREEMENT AND RELEASE OF CLAIMSConfidential Separation Agreement and Release of Claims • February 6th, 2014 • Oclaro, Inc. • Semiconductors & related devices • California
This Confidential Separation Agreement and Release of Claims (the “Agreement”) is entered into as of January 9, 2014 by and between Oclaro, Inc., a Delaware corporation (“Company”) and Catherine Hunt Rundle (“Executive”). Company and Executive are sometimes referred to herein individually as a “Party” and collectively as the “Parties.”
OCLARO, INC. EXECUTIVE SEVERANCE AND RETENTION AGREEMENTExecutive Severance and Retention Agreement • February 6th, 2014 • Oclaro, Inc. • Semiconductors & related devices • Delaware
THIS EXECUTIVE SEVERANCE AND RETENTION AGREEMENT by and between Oclaro, Inc., a Delaware corporation (the “Company”), Oclaro Technology Limited, a company registered in England under registered number 02298887 (the “Subsidiary”) and Adrian Meldrum (the “Executive”) is made as of 18th November 2013 (the “Effective Date”).
