AGREEMENT AND MUTUAL RELEASEAgreement and Mutual Release • December 29th, 2005 • Sanmina-Sci Corp • Printed circuit boards
Contract Type FiledDecember 29th, 2005 Company IndustryThis Agreement and Mutual Release (“Agreement”) is made by and between Sanmina-SCI Corporation, for itself and on behalf of all its subsidiaries and affiliates hereinafter referred to as the (“Company”) and Randy W. Furr, hereinafter referred to as (“Executive”).
REVOLVING TRADE RECEIVABLES PURCHASE AGREEMENT among SANMINA-SCI MAGYARORSZAG ELEKTRONIKAI GYARTO KFT and SANMINA-SCI SYSTEMS DE MEXICO, S.A. DE C.V., as Originators SANMINA-SCI CORPORATION and SANMINA-SCI UK LTD., as Servicers, THE SEVERAL BANKS AND...Receivables Purchase Agreement • December 29th, 2005 • Sanmina-Sci Corp • Printed circuit boards • New York
Contract Type FiledDecember 29th, 2005 Company Industry JurisdictionREVOLVING TRADE RECEIVABLES PURCHASE AGREEMENT (this “Agreement”), dated as of September 23, 2005 among Sanmina-SCI Magyarorszag Elektronikai Gyarto Kft, a limited liability company incorporated under the laws of the Republic of Hungary (“Sanmina Hungary”) and Sanmina-SCI Systems de Mexico S.A. de C.V., a sociedad anonima de capital variable organized and existing under the laws of the United Mexican States (“Sanmina Mexico”), as originators hereunder (Sanmina Hungary and Sanmina Mexico being, collectively, the “Originators”), and Sanmina-SCI Corporation, a Delaware corporation (“Sanmina-SCI”) and Sanmina-SCI UK Ltd., a company organized and existing with limited liability under the laws of England and Wales (“Sanmina United Kingdom”), as servicers hereunder (Sanmina-SCI and Sanmina United Kingdom being, collectively, the “Servicers”), the several banks and other financial institutions or entities from time to time parties to this Agreement (the “Purchasers”) and DEUTSCHE BANK AG NEW Y
ContractFirst Supplemental Indenture • December 29th, 2005 • Sanmina-Sci Corp • Printed circuit boards • New York
Contract Type FiledDecember 29th, 2005 Company Industry JurisdictionFIRST SUPPLEMENTAL INDENTURE (this “Supplemental Indenture”), dated as of September 30, 2005, among Sanmina-SCI USA, Inc., a Delaware corporation (the “Guaranteeing Subsidiary”), Sanmina-SCI Corporation, a Delaware corporation (the “Company”), and U.S. Bank National Association, as trustee under the indenture referred to below (the “Trustee”).
AMENDMENT NO. 1 TO CREDIT AND GUARANTY AGREEMENTCredit and Guaranty Agreement • December 29th, 2005 • Sanmina-Sci Corp • Printed circuit boards • New York
Contract Type FiledDecember 29th, 2005 Company Industry JurisdictionThis Amendment No. 1 to Credit and Guaranty Agreement (this “Amendment”), dated as of February 15, 2005, is made by Sanmina-SCI Corporation, a Delaware corporation (the “Company”), each of the subsidiaries of the Company listed on the signature pages hereto (the “Guarantors”), the Lenders party hereto, Citibank, N.A., as Collateral Agent (the “Collateral Agent”), and Citicorp USA, Inc., as Administrative Agent (the “Administrative Agent”).
3% Convertible Subordinated Notes Due 2007Sanmina-Sci Corp • December 29th, 2005 • Printed circuit boards • New York
Company FiledDecember 29th, 2005 Industry JurisdictionSUPPLEMENTAL INDENTURE No. 3 (this “Third Supplemental Indenture”), dated as of October 7, 2005, between SCI Systems, Inc., a corporation duly organized and existing under the laws of the State of Delaware (the “Company”), Sanmina-SCI USA, Inc., a corporation duly organized and existing under the laws of the State of Delaware (the “Subsidiary Guarantor”) and J.P. Morgan Trust Company, National Association (successor in interest to Bank One Trust Company, National Association), a national banking association duly organized and existing under the laws of the United States of America, as Trustee (the “Trustee”).
ContractSecond Supplemental Indenture • December 29th, 2005 • Sanmina-Sci Corp • Printed circuit boards • New York
Contract Type FiledDecember 29th, 2005 Company Industry JurisdictionSECOND SUPPLEMENTAL INDENTURE (this “Supplemental Indenture”), dated as of September 30, 2005, among Sanmina-SCI USA, Inc., a Delaware corporation (the “Guaranteeing Subsidiary”), Sanmina-SCI Corporation, a Delaware corporation (the “Company”), and U.S. Bank National Association (as successor to State Street Bank and Trust Company of California, N.A.), as trustee under the indenture referred to below (the “Trustee”).
ContractFirst Supplemental Indenture • December 29th, 2005 • Sanmina-Sci Corp • Printed circuit boards • New York
Contract Type FiledDecember 29th, 2005 Company Industry JurisdictionFIRST SUPPLEMENTAL INDENTURE (this “Supplemental Indenture”), dated as of July 21, 2003, among Newisys, Inc., a Delaware corporation (the “Guaranteeing Subsidiary”), Sanmina-SCI Corporation, a Delaware corporation (the “Company”) and U.S. Bank National Association (as successor to State Street Bank and Trust Company of California, N.A.), as trustee under the indenture referred to below (the “Trustee”).