0000945436-01-500020 Sample Contracts

PLEDGE AGREEMENT
Pledge Agreement • November 14th, 2001 • Memc Electronic Materials Inc • Semiconductors & related devices • New York

PLEDGE AGREEMENT (as amended, modified or supplemented from time to time, this "Pledge Agreement"), dated as of September 28, 2001, made by MEMC Electronic Materials, Inc., a Delaware corporation ("MEMC" or the "Pledgor") to E.ON AG, a company organized under the laws of the Republic of Germany (the "Pledgee"), for the benefit of the Secured Creditors (as defined below). Except as otherwise defined herein, capitalized terms used herein and defined in the Credit Agreement (as defined below) shall be used herein as therein defined.

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EURO 55,000,000 AMENDED AND RESTATED CREDIT AGREEMENT Dated as of September 22, 2001
Credit Agreement • November 14th, 2001 • Memc Electronic Materials Inc • Semiconductors & related devices • New York

WHEREAS, Borrower and Finance are parties to a Credit Agreement dated as of September 22, 2000 (the "Credit Agreement") pursuant to which Finance agreed to extend up to Euro 80,000,000 of credit to Borrower on a term basis;

AMENDMENT NO. 1 TO THE SECOND AMENDED AND RESTATED REVOLVING CREDIT AGREEMENT
Revolving Credit Agreement • November 14th, 2001 • Memc Electronic Materials Inc • Semiconductors & related devices • New York

AMENDMENT NO. 1 TO THE SECOND AMENDED AND RESTATED REVOLVING CREDIT AGREEMENT, dated as of September 28, 2001 (this "Amendment"), to the Second Amended and Restated Revolving Credit Agreement, dated as of September 4, 2001, among MEMC ELECTRONIC MATERIALS, INC. ("MEMC") and MEMC PASADENA, INC., as Borrowers, and E.ON AG, as Initial Lender and as Agent (as amended, modified or supplemented from time to time, the "Second Amended Credit Agreement").

AMENDMENT NO. 1 TO THE SECURITY AGREEMENT
The Security Agreement • November 14th, 2001 • Memc Electronic Materials Inc • Semiconductors & related devices • New York

AMENDMENT NO. 1 TO THE SECURITY AGREEMENT, dated September 4, 2001 (this "Amendment"), to the Amended and Restated Security Agreement, dated as of July 26, 2001, among MEMC ELECTRONIC MATERIALS, INC. ("MEMC"), MEMC Pasadena, Inc. and E.ON AG, as the initial lender and agent (the "Security Agreement").

AMENDED AND RESTATED SECURITY AGREEMENT
Security Agreement • November 14th, 2001 • Memc Electronic Materials Inc • Semiconductors & related devices • New York

THIS AMENDED AND RESTATED SECURITY AGREEMENT, dated as of July 26, 2001, is made by MEMC Electronic Materials, Inc. ("MEMC"), a Delaware corporation, and MEMC Pasadena, Inc. ("MEMC Pasadena"), a Delaware corporation, (each, an "Assignor" and collectively, the "Assignors") in favor of E.ON AG, as Agent (the "Agent"), for the benefit of the Secured Creditors (as defined below). Except as otherwise defined herein, capitalized terms used herein and defined in the Credit Agreement (as defined below) shall be used herein as so defined.

AMENDED AND RESTATED COMPANY GUARANTY AGREEMENT
Company Guaranty Agreement • November 14th, 2001 • Memc Electronic Materials Inc • Semiconductors & related devices • New York

AMENDED AND RESTATED COMPANY GUARANTY AGREEMENT dated as of September 22, 2001, between MEMC ELECTRONIC MATERIALS, INC., a Delaware corporation ("MEMC" or the "Guarantor"), and E.ON INTERNATIONAL FINANCE B.V., a company organized under the laws of the Netherlands ("Finance"), as Agent and as Initial Lender (as defined in the Credit Agreement referred to below).

SECOND AMENDED AND RESTATED REVOLVING CREDIT AGREEMENT Dated as of September 4, 2001
Revolving Credit Agreement • November 14th, 2001 • Memc Electronic Materials Inc • Semiconductors & related devices • New York

MEMC ELECTRONIC MATERIALS, INC., a Delaware corporation ("MEMC"), and MEMC PASADENA, INC., a Delaware corporation ("MEMC Pasadena"), as borrowers (each, a "Borrower" and collectively, the "Borrowers"), and E.ON AG, a company formed under the laws of the Federal Republic of Germany ("E.ON"), as the initial lender (the "Initial Lender") and as agent (together with any successor appointed pursuant to Article VIII, the "Agent") for the Lenders (as hereinafter defined), hereby agree as follows:

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