Common Contracts
6 similar Credit Facility Agreement contracts by Iec Electronics Corp
M&T Bank FIFTH AMENDED AND RESTATED Credit Facility AgreementCredit Facility Agreement • February 12th, 2016 • Iec Electronics Corp • Printed circuit boards • New York
FOURTH AMENDED AND RESTATED CREDIT FACILITY AGREEMENTCredit Facility Agreement • January 25th, 2013 • Iec Electronics Corp • Printed circuit boards • New York
This FOURTH AMENDED AND RESTATED CREDIT FACILITY AGREEMENT (this “Agreement”) is made as of January 18, 2013 by and among IEC ELECTRONICS CORP., a corporation formed under the laws of the State of Delaware (“Borrower”) and MANUFACTURERS AND TRADERS TRUST COMPANY (“Lender”), a New York banking corporation, with offices at 255 East Avenue, Rochester, New York 14604. This Agreement evidences in part obligations evidenced by, and amends and restates in its entirety the Third Amended and Restated Credit Facility Agreement made between the Borrower and Lender, dated as of December 17, 2010, as amended (“Prior Agreement”). All references to the Prior Agreement in any Loan Document made or delivered in connection with the Prior Agreement shall be deemed to be references to the Prior Agreement as amended and restated by this Agreement.
THIRD AMENDED AND RESTATED CREDIT FACILITY AGREEMENTCredit Facility Agreement • December 23rd, 2010 • Iec Electronics Corp • Printed circuit boards • New York
This THIRD AMENDED AND RESTATED CREDIT FACILITY AGREEMENT (“Agreement”) is made as of December 17, 2010 by and among IEC ELECTRONICS CORP., a corporation formed under the laws of the State of Delaware (“Borrower”) and MANUFACTURERS AND TRADERS TRUST COMPANY (“Lender”), a New York banking corporation, with offices at 255 East Avenue, Rochester, New York 14604. This Agreement evidences in part obligations evidenced by, and amends and restates in its entirety the Second Amended and Restated Credit Facility Agreement made between the Borrower and Lender, dated July 30, 2010, as amended (“Prior Agreement”). All references to the Prior Agreement in any Loan Document made or delivered in connection with the Prior Agreement shall be deemed to be references to the Prior Agreement as amended and restated by this Agreement.
SECOND AMENDED AND RESTATED CREDIT FACILITY AGREEMENTCredit Facility Agreement • August 5th, 2010 • Iec Electronics Corp • Printed circuit boards • New York
This SECOND AMENDED AND RESTATED CREDIT FACILITY AGREEMENT (“Agreement”) is made as of July 30, 2010 by and among IEC ELECTRONICS CORP., a corporation formed under the laws of the State of Delaware (“Borrower”) and MANUFACTURERS AND TRADERS TRUST COMPANY (“Lender”), a New York banking corporation, with offices at 255 East Avenue, Rochester, New York 14604. This Agreement evidences in part obligations evidenced by, and amends and restates in its entirety the Amended and Restated Credit Facility Agreement made between the Borrower and Lender, dated December 16, 2009, as amended (“Prior Agreement”). All references to the Prior Agreement in any Loan Document made or delivered in connection with the Prior Agreement shall be deemed to be references to the Prior Agreement as amended and restated by this Agreement.
AMENDED AND RESTATED CREDIT FACILITY AGREEMENTCredit Facility Agreement • December 23rd, 2009 • Iec Electronics Corp • Printed circuit boards • New York
This AMENDED AND RESTATED CREDIT FACILITY AGREEMENT (“Agreement”) is made as of December 16, 2009 by and among IEC ELECTRONICS CORP., a corporation formed under the laws of the State of Delaware (“Borrower”) and MANUFACTURERS AND TRADERS TRUST COMPANY (“Lender”), a New York banking corporation, with offices at 255 East Avenue, Rochester, New York 14604. This Agreement evidences in part obligations evidenced by, and amends and restates in its entirety, the Credit Facility Agreement dated May 30, 2008, as amended, made between the Borrower and Lender (“Prior Agreement”). All references to the Prior Agreement in any Loan Document made or delivered in connection with the Prior Agreement shall be deemed to be references to the Prior Agreement as amended and restated by this Agreement.
CREDIT FACILITY AGREEMENTCredit Facility Agreement • July 30th, 2008 • Iec Electronics Corp • Printed circuit boards • New York
The Applicable Unused Fee shall be fixed at Level III on the date of this Agreement. Effective on the first annual anniversary of the date of this Agreement, the Level applicable to Unused Fees will be established based upon the Debt to EBITDARS ratio as of the last day of the measurement period ending on March 31, 2009. Thereafter, changes, if any, in the Level applicable to Unused Fees will be effective on the tenth (10th) day following each date on which the Borrower’s Quarterly Covenant Compliance Sheet (“QCC Sheet”) is required to be delivered to the Lender pursuant to Section 11.4, based upon the Debt to EBITDARS Ratio shown therein. In the event that any QCC Sheet is not delivered by the date required, pricing will revert to Level I until the tenth (10th) day following the date of delivery of the delayed QCC Sheet, on which tenth day pricing will be adjusted to the applicable level shown by the QCC Sheet.
