Detailed Unit Process Descriptions Sample Clauses

Detailed Unit Process Descriptions a. New Copper Metallization Step IBM recently introduced a new, innovate copper metallization step into the manufacturing process to provide interconnection of the device circuits. It is anticipated that as the next generation of semiconductor technology is introduced into the Burlington manufacturing facility over the next three years, that usage of the copper metallization step will expand by a factor of ten to twenty times the present production rates. The manufacturing process involves the use of a copper plating process to deposit a layer of metal on the wafer. The plating process uses a specialized tool which brings only one side of the wafer into contact with a copper plating solution and applies an electrical current to plate copper onto the wafer surface. The wafer is then rinsed. The wafer is exposed to less than a gallon of plating solution, which is recirculated within the tool from a 40 gallon reservoir, during the plating step. Approximately 0.070 grams of plating solution, containing 0.001 milligram of copper is carried over to the rinse step and approximately one gallon of rinsewater is used per wafer. Present projections for the wafer throughput of this process show that the mass of copper and the volume of rinsewater will likely increase from 0.7 grams per day and 675 gallons per day in the fourth quarter of 1998 to 5.7 grams per day and 5500 gallons per day when the process is fully deployed in the year 2001 (Table 1, page 16) .
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