Wafer Bank definition

Wafer Bank means a wafer bank maintained by NXP Group at one or more NXP Plants for the storage of partly manufactured (but not yet completed, pre-tested, assembled and final-tested) ROM-coded Products.
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Wafer Bank means an inventory of Wafers manufactured by TSMC and held in inventory prior to metallization for release and purchase by IDT in accordance with the terms and conditions of this Agreement.
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Examples of Wafer Bank in a sentence

  • The Wafer Bank will be arranged such that inventory carried in the Wafer Bank shall, for financial accounting purposes, be inventory of SMIC.

  • Should CUSTOMER place a production lot on hold for reasons other than yield improvement and the Wafer Bank Plan as listed in Exhibit C, CUSTOMER shall pay HSA a hold fee of one hundred dollars ($100) for each calendar day that a Production Lot is held.

  • Schedule 5 sets out the Parties’ agreement with regard to NXP Wafer Bank storage.

  • IDT may from time to time submit written requests to TSMC that specify the type and quantity of Wafers to be released from the Wafer Bank and further processing instructions (the “Release Requests”).

  • The Wafer Bank will be arranged such that inventory carried in the Wafer Bank will be deemed inventory of TSMC for financial accounting purposes.

  • NXP will maintain an NXP Wafer Bank in order to store all NXP ROM-Coded Products.

  • On a daily basis, TSMC will provide IDT with data feeds regarding with the work in process, including information such as the purchase order number, the Release Request number, Lot number, total number of process steps, number of process steps completed, process step name (provided that the process step name for Wafers at the Wafer Bank shall be “Wafer Bank”), total number of masking steps, number of masking steps completed, start date, expected ship date and committed ship date.

  • Notwithstanding the foregoing, the total of number of Wafers in the Wafer Bank during any calendar quarter shall be equal to or less than fifty percent (50%) of the volume of Wafers set forth in the Current Forecast for the following quarter as requested by IDT for each TSMC Facility.

  • The Borrower shall, subject to the priorities of payment set forth in Section 4.01, pay such Lender the amount shown as due on any such certificate on later of (i) first Settlement Date occurring after the Borrower’s receipt of such certificate and (ii) ten (10) Business Days after the Borrower’s receipt of such certificate.

  • NXP Group shall maintain a Wafer Bank consistent with generally accepted industry practices in order to store all ROM-coded Wafers in accordance with current practices, and subject to Trident approval of Wafer starts.