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provided, however, that in the event AMD introduces a tape-out of any Other Future Products, FoundryCo shall have a right of first refusal in accordance with the process set forth in Exhibit B to manufacture such Other Future Product (including the first tape-out of such Other Future Product), subject to Qualification of such Other Future Product at such <strong>Process Node</strong>.", "AMD shall provide FoundryCo, in writing and updated on a monthly basis, a non-binding, rolling [****] month forecast of its monthly volume requirements for Wafers for Embedded Products on a Product by Product basis, identified by specific technology and <strong>Process Node</strong> for the Embedded Products listed.", "Each party commits to, and the parties agree to work together to, establish FoundryCo\u2019s ability to manufacture Chipset Products via a [****]nm bulk silicon process at the [****]nm <strong>Process Node</strong> and at all future smaller <strong>Process Nodes</strong> for which AMD may purchase Chipset Products, with Specifications to be agreed upon in advance by the parties in writing.", "Beginning on the Effective Date, AMD shall provide FoundryCo, in writing on a monthly basis a non-binding, rolling [****] month forecast of its monthly volume requirements for MPU Products on a Product by Product basis, identified by specific technology and <strong>Process Node</strong> for the MPU Products listed.", "AMD and FoundryCo each commits to, and the parties agree to work together to, [****] manufacture GPU Products via a high volume bulk process at the [****]nm <strong>Process Node</strong> and at all future smaller <strong>Process Nodes</strong>, with Specifications to be agreed [****] = Certain confidential information contained in this document, marked by brackets, has been omitted and filed separately with the Securities and Exchange Commission pursuant to Rule 24b-2 of the Securities Exchange Act of 1934, as amended.", "The Manufacturing Plan shall address various manufacturing issues, including the DRAM Products to be manufactured, a loading plan (by Design ID and <strong>Process Node</strong> for the DRAM Products to be produced, including, if applicable, a breakout of the DRAM Products, by Design ID and <strong>Process Node</strong>, to be produced for any Persons other than the Purchaser) and weekly loading and output (including, if applicable, a breakout, by Design ID and <strong>Process Node</strong>, the wafers designated for any Persons other than the Purchaser).", "In lieu of the forecasting requirements of Section 5.1 of the Original WSA, AMD will provide FoundryCo, in writing on a monthly basis, with a non-binding, rolling [****] forecast of its monthly volume requirements for [****] MPU Products, [****] MPU Products, GPU Products, Chipset Products and Other Future Products, identified by <strong>Process Node</strong>.", "Micron is developing and/or has developed technology for a 20nm <strong>Process Node</strong> for the manufacture of DRAM Products.", "Micron is developing and/or has developed technology for a 1Y <strong>Process Node</strong> for the manufacture of DRAM Products."], "related": [["process-weight", "Process weight", "Process weight"], ["node", "Node", "Node"], ["process-gas", "Process Gas", "Process Gas"], ["pnode", "PNode", "PNode"], ["manufacturing-site", "Manufacturing Site", "Manufacturing Site"]], "related_snippets": [], "updated": "2025-07-10T05:58:13+00:00"}, "json": true, "cursor": ""}}