Die Bank definition
Examples of Die Bank in a sentence
Within […***…] days after the Effective Date, NXP shall provide the Customer, at the Customer’s expense, with a data interface that allows the Customer to access work in progress and finished-goods data (including part numbers, quantities, and anticipated stage completion dates), on an unconsolidated basis, for each of the following stages: (i) FG PO Commit; (ii) Wafer PO; (iii) Wafer Test PO; (iv) Die Bank; and (v) Back End PO.
Provided that the Customer is current in its payment obligations under this Agreement, and provided that there are a sufficient number of wafers available to meet the finished goods Purchase Orders (either as a result of the agreed-upon wafer starts in Section 4.3 or through drawing upon the Die Bank), NXP will accept all Purchase Orders placed with the applicable lead time in accordance with the applicable Confirmed Forecast, and will […***…] accept all other Purchase Orders.
Such Qualified Die Bank may be held by Spectrian and thereafter submitted to Newco for Component finishing, in which case the price of the Component shall be the difference between the Component price determined pursuant to Section 1.7 and the price previously paid for such Qualified Die Bank.
Upon production or procurement of the agreed-upon number of wafers, NXP will either (a) consume the wafers in response to finished goods Purchase Orders submitted by the Customer pursuant to Section 6.2 (Purchase Orders) and accepted by NXP pursuant to Section 6.3 (Order Acceptance); or (b) in the case of wafers for which the Customer does not submit a finished goods Purchase Order, deposit such wafers into the Die Bank.
Any such purchase of Qualified Die Bank shall be credited against the Minimum Commitment for the quarter in which such purchase is made.
The Customer and NXP will mutually agree on a smooth and feasible transition plan from current make-to-order process with Trident with no safety stock levels, to a process that allows decoupling at Die Bank with safety stock levels as agreed in this Section 4.2. The Die Bank will (a) be maintained by NXP at its manufacturing location; and (b) have a safety stock level equal to a number of weeks of the Customer’s forecasted demand, as reasonably determined by the Customer.
In any case where the Die Bank System die are used as a resource by such .35 standard cell Second Source to source .35 CBA format Components, in KLSI's discretion, the die used will be credited to Immersion's Die Bank System account and replenished by KLSI at no charge to Immersion.
Sections 2.2 ("Second Source"), 5 ("Warranty"), 6 ("Indemnification"), 7.4 ("Base Wafer Maintenance Purchase Order System"), 7.5 ("Die Bank System"), 8 ("Termination"), 9 ("Personal Injury and Property Damage Claims"), 10 ("Confidentiality and Proprietary Notices"), 11 ("Limitation of Liability") and 12 ("General Provisions") will survive and continue after the expiration or termination of this Agreement.
At least […***…] per […***…], the Parties shall meet and discuss an appropriate number of wafer starts to be initiated by NXP or purchased from Third Party Providers to support the Customer’s demand for Products, taking into account the applicable Confirmed Forecast and the available wafers in the Die Bank.
Any Qualified Die Bank purchased by Spectrian hereunder may not be sold or transferred to any party other than Newco.