Hybrid Bonding License Agreement Sample Contracts
Xperi and LAPIS, a ROHM Group Company, Enter into Hybrid Bonding License AgreementHybrid Bonding License Agreement • October 17th, 2022
SAN JOSE, Calif. & YOKOHAMA, Japan--(BUSINESS WIRE)-- Adeia, the newly launched brand for the intellectual property (IP) licensing business of Xperi Holding Corporation (NASDAQ: XPER) (“Xperi”) and LAPIS Technology Co., Ltd., (“LAPIS”), a ROHM Group subsidiary, today announced an agreement that includes a technology transfer of Adeia’s DBI ® Ultra die-to-wafer hybrid bonding know-how to support the development and deployment of the technology into LAPIS’s product portfolio. The agreement also includes a license to Adeia’s foundational hybrid bonding patent portfolio.