CREDIT AND SECURITY AGREEMENT among TRANSPHORM, INC., as Borrower, TRANSPHORM TECHNOLOGY, INC., as Guarantor, RENESAS ELECTRONICS AMERICA INC., as Lender Dated as of March 1, 2024Credit and Security Agreement • March 5th, 2024 • Transphorm, Inc. • Semiconductors & related devices • New York
CREDIT AND SECURITY AGREEMENT, dated as of March 1, 2024, among TRANSPHORM, INC., a Delaware corporation (“Borrower”), TRANSPHORM TECHNOLOGY, INC., a Delaware corporation (“Guarantor”), and RENESAS ELECTRONICS AMERICA INC., a California corporation, as lender (together with its successors and assigns, “Lender”).
