0001193125-12-017673 Sample Contracts

SHARE SUBSCRIPTION AGREEMENT
Share Subscription Agreement • January 20th, 2012 • Datang Telecom Technology & Industry Holdings LTD • Semiconductors & related devices • Hong Kong

SHARE SUBSCRIPTION AGREEMENT (the “Agreement” or this “Agreement”), dated as of 5 May, 2011, by and among Semiconductor Manufacturing International Corporation (the “Company”), and Datang Holdings (Hongkong) Investment Company Limited (the “Investor”).

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Joint Filing Agreement
Joint Filing Agreement • January 20th, 2012 • Datang Telecom Technology & Industry Holdings LTD • Semiconductors & related devices

In accordance with Rule 13d-1(k) promulgated under the Securities Exchange Act of 1934, as amended, the undersigned hereby agree to the joint filing with all other Reporting Persons (as such term is defined in the Schedule 13D referred to below) on behalf of each of them of a statement on Schedule 13D (including amendments thereto) with respect to the common stock, par value US$0.0004 each, of Semiconductor Manufacturing International Corporation, a Cayman Islands company, and that this Agreement may be included as an exhibit to such joint filing. This Agreement may be executed in any number of counterparts, all of which taken together shall constitute one and the same instrument.

WARRANT AGREEMENT
Warrant Agreement • January 20th, 2012 • Datang Telecom Technology & Industry Holdings LTD • Semiconductors & related devices • Hong Kong

This WARRANT AGREEMENT, dated as of September 16, 2011 (the “Agreement”), is made by and between Datang Holdings (Hongkong) Investment Company Limited., a company incorporated in the Hong Kong Special Administrative Region of the People’s Republic of China ( “Hong Kong”) with Limited Liability with its registered address at 40/F, Bank of China Tower, 1 Garden Road, Central,, Hong Kong (the “Initial Holder”), and Semiconductor Manufacturing International Corporation, an exempted company incorporated under the laws of the Cayman Islands having a place of business located at No. 18 Zhang Jiang Road, Pudong New Area, Shanghai 201203, People’s Republic of China (the “Company”).

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