Common Contracts
3 similar Building Lease Agreement contracts by MagnaChip Semiconductor LTD (United Kingdom)
BUILDING LEASE AGREEMENT Between Hynix Semiconductor Inc. (as Lessor) and MagnaChip Semiconductor, Ltd. (as Lessee) with respect to M4 Building located in Ichon the Republic of Korea October 6, 2004Building Lease Agreement • June 21st, 2005 • MagnaChip Semiconductor LTD (United Kingdom)
WHEREAS, the Parties have entered into a certain business transfer agreement dated June 12, 2004, as amended (the “BTA”) pursuant to which, among other things, Lessee has agreed to acquire the Acquired Assets (as defined in the BTA) from Lessor subject to the terms and conditions set forth in the BTA;
BUILDING LEASE AGREEMENT Between MagnaChip Semiconductor, Inc. (as Lessor) and Hynix Semiconductor Ltd. (as Lessee) with respect to R Building, C1 Building and C2 Building located in Cheong-Ju the Republic of Korea October 6, 2004Building Lease Agreement • June 21st, 2005 • MagnaChip Semiconductor LTD (United Kingdom)
WHEREAS, the Parties have entered into a certain business transfer agreement dated June 12, 2004, as amended (the “BTA”) pursuant to which, among other things, Lessor has agreed to acquire the Acquired Assets (as defined in the BTA) from Lessee subject to the terms and conditions set forth in the BTA;
BUILDING LEASE AGREEMENT Between Hynix Semiconductor Inc. (as Lessor) and MagnaChip Semiconductor, Ltd. (as Lessee) with respect to certain Buildings and Warehouses located in Cheong-Ju the Republic of Korea October 6, 2004Building Lease Agreement • June 21st, 2005 • MagnaChip Semiconductor LTD (United Kingdom)
WHEREAS, the Parties have entered into a certain business transfer agreement dated June 12, 2004, as amended (the “BTA”) pursuant to which, among other things, Lessee has agreed to acquire the Acquired Assets (as defined in the BTA) from Lessor subject to the terms and conditions set forth in the BTA;
