Common Contracts

4 similar Loan and Security Agreement contracts by Interlink Electronics Inc, Advanced BioHealing Inc, Sonic Foundry Inc

SECOND AMENDED AND RESTATED LOAN AND SECURITY AGREEMENT
Loan and Security Agreement • July 1st, 2011 • Sonic Foundry Inc • Radio & tv broadcasting & communications equipment • Maryland

THIS LOAN AND SECURITY AGREEMENT (this “Agreement”) dated as of June 27, 2011 (the “Effective Date”) between SILICON VALLEY BANK, a California corporation with a loan production office located at 380 Interlocken Crescent, Suite 600, Broomfield, Colorado 80021 (“Bank”), SONIC FOUNDRY, INC., Maryland corporation (“Sonic Foundry”), and SONIC FOUNDRY MEDIA SYSTEMS, INC., a Maryland corporation (“Sonic Systems” and together with Sonic Foundry, jointly and severally, individually and collectively, the “Borrower”), provides the terms on which Bank shall lend to Borrower and Borrower shall repay Bank. This Agreement amends and restates in its entirety a certain Amended and Restated Loan and Security Agreement dated as of June 16, 2008, between Borrower and Bank, as amended by a certain First Amendment to Amended and Restated Loan and Security Agreement, dated as of April 1, 2009 (as amended, the “Prior Loan Agreement”). The parties hereby agree as follows:

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AMENDED AND RESTATED LOAN AND SECURITY AGREEMENT
Loan and Security Agreement • February 25th, 2011 • Advanced BioHealing Inc • Delaware

THIS AMENDED AND RESTATED LOAN AND SECURITY AGREEMENT (this “Agreement”) dated as of September 17, 2010 (the “Effective Date”) between SILICON VALLEY BANK (“Bank”), and ADVANCED BIOHEALING, INC., a Delaware corporation (“Borrower”), amends and restates the terms of that certain Loan and Security Agreement by and among Bank, Oxford Finance Corporation, the lenders party thereto and Borrower, dated as of December 23, 2008 (as amended from time to time, the “Original Agreement”), and provides the terms on which Bank shall lend to Borrower and Borrower shall repay Bank. The parties agree as follows:

AMENDED AND RESTATED LOAN AND SECURITY AGREEMENT
Loan and Security Agreement • November 14th, 2007 • Interlink Electronics Inc • Computer peripheral equipment, nec • Delaware

THIS AMENDED AND RESTATED LOAN AND SECURITY AGREEMENT (this “Agreement”) dated as of the Effective Date between SILICON VALLEY BANK, a California corporation (“Bank”), and INTERLINK ELECTRONICS, INC., a Delaware corporation (“Borrower”), provides the terms on which Bank shall lend to Borrower and Borrower shall repay Bank. Bank and Borrower are parties to that certain Loan and Security Agreement dated as of December 19, 2006 as amended by that certain First Amendment to Loan and Security Agreement dated as of April 6, 2007, that certain Second Amendment to Loan and Security Agreement dated as of July 18, 2007 and that certain Third Amendment to Loan and Security Agreement dated as of August 13, 2007 (the “Original Agreement”). Bank and Borrower wish to amend and restate the Original Agreement in accordance with the terms hereof. The parties agree as follows:

LOAN AND SECURITY AGREEMENT
Loan and Security Agreement • August 13th, 2007 • Interlink Electronics Inc • Computer peripheral equipment, nec • Delaware

THIS LOAN AND SECURITY AGREEMENT (this “Agreement”) dated as of the Effective Date between SILICON VALLEY BANK, a California corporation (“Bank”), and INTERLINK ELECTRONICS, INC., a Delaware corporation (“Borrower”), provides the terms on which Bank shall lend to Borrower and Borrower shall repay Bank. The parties agree as follows:

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