Dated this 22nd of June 2006 Between STATS CHIPPAC SHANGHAI CO., LTD as vendor And STATS CHIPPAC LTD. as guarantor for STATS ChipPAC Shanghai Co., Ltd. And WUXI CR MICRO-ASSEMB TECH. LTD. as purchaser And CHINA RESOURCES LOGIC LIMITED as guarantor for...

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Exhibit 4.44
Dated this 22nd of June 2006
Between
STATS CHIPPAC SHANGHAI CO., LTD
as vendor
And
STATS CHIPPAC LTD.
as guarantor for STATS ChipPAC Shanghai Co., Ltd.
And
WUXI CR MICRO-ASSEMB TECH. LTD.
as purchaser
And
CHINA RESOURCES LOGIC LIMITED
as guarantor for Wuxi CR Micro-Assemb Tech. Ltd.
 
 

 

 

TABLE OF CONTENTS
             
CLAUSE            
PAGE   HEADING        
 
            
  DEFINITIONS     1  
 
            
  AGREEMENT TO SELL THE ASSETS     4  
 
            
  PURCHASE CONSIDERATION     4  
 
            
  TRANSFERS OF ASSETS     5  
 
            
  RESPONSIBILITIES AND OBLIGATIONS     6  
 
            
  WARRANTIES     7  
 
            
  NON-SOLICITATION     8  
 
            
  CRL GUARANTEE     9  
 
            
  SCL GUARANTEE     9  
 
            
  ANNOUNCEMENTS     9  
 
            
  STAMP DUTY     10  
 
            
  COSTS AND EXPENSES     10  
 
            
  CONFIDENTIALITY     10  
 
            
  GENERAL     12  
 
            
  ILLEGALITY     13  
 
            
  NOTICES     13  
 
            
  REMEDIES AND WAIVERS     15  
 
            
  TIME OF ESSENCE     15  
 
            
  FORCE MAJEURE     15  
 
            
  COUNTERPARTS     15  
 
            
  GOVERNING LAW AND ARBITRATION     15  
 
            
APPENDIX 1        
 
            
ASSETS     17  
 
            
APPENDIX 2        
 
            
TECHNICAL SPECIFICATIONS     18  
 
            
APPENDIX 3        
 
            
TRANSFER PLAN     19  
 
            
SCHEDULE     20  

 

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THIS ASSETS SALE AND PURCHASE AGREEMENT is made on 22nd day of June 2006
BETWEEN:
(1)   STATS CHIPPAC SHANGHAI CO., LTD., a company incorporated in the People’s Republic of China and having its registered address at 000 Xxxxx Xxxx, Xxxxxx Xxxxxxxx 000000 Shanghai, People’s Republic of China (“SCC”);
 
(2)   STATS CHIPPAC LTD. (Company Registration No. 199407932D) a company incorporated in Singapore and having its corporate headquarters address at 00 Xxx Xx Xxx Xxxxxx 00, Xxxxxxxxx #00-00/00, Xxxxxxxxx (“SCL”);
 
(3)   WUXI CR MICRO-ASSEMB TECH. LTD., a company incorporated in the People’s Republic of China and having its registered address at New District Science & Technology Park Ximei Road, B-27, Wuxi 214112, Jiangsu, People’s Republic of China (“ANST”); and
 
(4)   CHINA RESOURCES LOGIC LIMITED (Company Registration No. 19963), a company incorporated in Bermuda and having its principal business xxxxxxx xx Xxxxx 0000-00, Xxxxx Resources Xxxxxxxx, 00 Xxxxxxx Xxxx, Xxxxxxx, Xxxx Xxxx (“CRL”),
 
    (collectively, the “Parties” and each a “Party”).
WHEREAS:
(A)   SCC has agreed to sell, and ANST has agreed to purchase, the Assets (as defined below) upon the terms and subject to the conditions of this Agreement.
 
(B)   CRL has entered into this Agreement to guarantee to and covenant with SCC the due and punctual performance by ANST of its payment obligations under this Agreement.
 
(C)   SCL has entered into this Agreement to guarantee to and covenant with CRL and ANST the due and punctual performance by SCC of certain of its obligations under this Agreement.
IT IS AGREED as follows:
1.   DEFINITIONS
 
1.1   In this Agreement, except to the extent that the context requires otherwise:
 
    “Additional Incentive Amount” has the meaning ascribed to it in Clause 3.3;
 
    “Assets” means the tools, equipment and spare parts agreed to be sold under this Agreement as more particularly set out in Appendix 1 and shall where appropriate, include the tools, equipment and spare parts to be delivered by SCC pursuant to Clause 4.3;
 
    “Balance Purchase Consideration” has the meaning ascribed to it in Clause 3.1(ii);

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    “Business Day” means a day (other than a Saturday, Sunday or gazetted public holiday) on which commercial banks are open for business in Hong Kong, Singapore, the BVI and the PRC;
 
    “BVI” means the British Virgin Islands;
 
    “CIETAC” means China International Economic and Trade Arbitration Commission;
 
    “CIETAC Rules” means the CIETAC Arbitration Rules in force at the date of this Agreement;
 
    “commercially reasonable efforts” for the purposes of the discharge of SCC’s obligations under Clause 5.2, shall mean such steps to be taken by SCC as set out in the Schedule;
 
    “Confidential Information” means any information which is proprietary and confidential to a Party including but not limited to the terms and conditions of this Agreement, information concerning or relating in any way whatsoever to its distributorship, franchise or other arrangements, principals, any of the trade secrets or confidential operations, processes or inventions carried on or used by a Party, any information concerning the organisation, business, finances, transactions or affairs of a Party, dealings of a Party, secret or confidential information which relates to the business or Party or any of its principals’, clients or customers’ transactions or affairs, any Party’s technology, designs, documentation, manuals, budgets, financial statements or information, accounts, dealers’ lists, customer lists, marketing studies, drawings, notes, memoranda and the information contained therein, any information therein in respect of trade secrets, technology and technical or other information relating to the development, manufacture, clinical testing, analysis, marketing, sale or supply or proposed development, manufacture, clinical testing, analysis, marketing, sale or supply of any products or services by a Party, and plans for the development or marketing of such products or services and information and material which is either marked confidential or is by its nature intended to be exclusively for the knowledge of the recipient alone;
 
    “Encumbrance” means any claim, mortgage, charge, pledge, lien, security interest or encumbrance or any other agreement or arrangement having substantially the same legal effect, including any retention of title arrangement;
 
    “Inspection Dates” shall have the meaning ascribed to it in Clause 4.1;
 
    “Joint Venture Agreement” shall have the meaning ascribed to it in the Subscription Agreement;
 
    “Manufacturer’s Representative Agreement” means that certain manufacturer’s representative agreement entered or to be entered into between CRL, ANST, SCL and SCBL pursuant to which SCBL is appointed as a non-exclusive manufacturer’s representative of ANST;
 
    “MAT” means Micro Assembly Technologies Limited, a company established in the BVI with its registered office at Pasea Estate, Road Town, Tortola, British Virgin Islands;
 
    “Purchase Consideration” shall have the meaning ascribed to it in Clause 3.1;
 
    “PRC” means the People’s Republic of China;

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    “Related Corporation” means with reference to a corporation, a corporation which is (a) the holding company of the first-mentioned corporation; (b) a subsidiary of the first-mentioned corporation; or (c) a subsidiary of the holding company of the first-mentioned corporation;
 
    “RMB” means the lawful currency of the People’s Republic of China;
 
    “SCBL” means STATS ChipPAC (BVI) Limited, a company established in the BVI with its principal place of business at Xxxxxxxxx Xxxxxxxx, Xxxx Xxxx, Xxxxxxx, the BVI;
 
    “SCL Customers” means the existing and future customers of SCL and/or its subsidiaries, including without limitation, fabless IC Companies, fabless ASIC Companies, wafer foundries and test and assembly houses;
 
    “Subscription Agreement” means the subscription agreement entered or to be entered into between SCL, CRL, MAT and Wuxi China Resources Microelectronics (Holdings) Limited pursuant to which, inter alia, SCL agrees to subscribe for a 25% stake in the enlarged share capital of MAT;
 
    “Technical Specifications” means detailed quality requirements, maintenance specifications, related products’ process flow and specifications plus quality assurance process flow and specification more particularly set out in Appendix 2;
 
    “to de-install” means to unplug and unbolt and “de-installation” shall be construed accordingly;
 
    “Transfer” means the completion of the de-installation of a phase of Assets in accordance with the Transfer Plan and the acceptance of the same by ANST (evidenced by the delivery by ANST of an acceptance certificate by ANST to SCC for the Assets);
 
    “Transfer Customers” means the SCL Customers to be referred and transferred to ANST by SCL and/or its subsidiaries pursuant to Clause 5.2;
 
    “Transfer Customer Confidential Information” means any Confidential Information of or relating to any Transfer Customer;
 
    “Transfer Plan” means the plan relating to the transfer of the Assets from SCC to ANST set out in Appendix 3 (as may be amended and updated from time to time by mutual agreement of SCC and ANST in writing);
 
    “Transferred Revenues” in relation to a particular Year, means the aggregate revenues of ANST for that Year for assembly and testing services provided by ANST arising from orders received by ANST (including orders received through SCC) from the Transfer Customers or any of them based on the aggregate amount invoiced by ANST to the Transfer Customers for that Year for such services (excluding taxes and the value of wafers and chips);
 
    “US$” or “US Dollars” means the lawful currency of the United States of America; and
 
    “Year” means a calendar year commencing on 1 January and ending on 31

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  December.
 
1.2   Any reference in this Agreement, the Appendices or the Schedule to a statutory provision shall include that provision and any regulations made in pursuance thereof as from time to time modified or re-enacted.
 
1.3   The headings in this Agreement are inserted for convenience only and shall be ignored in construing this Agreement. Unless the context otherwise requires, words (including words defined in this Agreement) denoting the singular number only shall include the plural and vice versa. The words “written” and “in writing” include any means of visible reproduction and electronic mails. References to the “Appendices”, “Schedule” and “Clauses” are to the appendices and schedule to and clauses of this Agreement.
 
1.4   Any reference to “this Agreement” shall be deemed to be references to this Assets Sale and Purchase Agreement.
 
1.5   The expression “subsidiary” shall mean any company in which a Party directly or indirectly owns more than fifty percent (50%) of such company’s capital and voting rights of such company.
2.   AGREEMENT TO SELL THE ASSETS
 
    SCC shall sell as legal and beneficial owner and ANST shall purchase the Assets on an “as is, where is” basis as at the Inspection Dates free from all Encumbrances as at the time of Transfer at the Purchase Consideration and upon the terms and conditions hereinafter contained.
3.   PURCHASE CONSIDERATION
 
3.1   The aggregate consideration for the purchase of the Assets (the “Purchase Consideration”) to be paid by ANST shall comprise the following:
  (i)   an amount of US$12,000,000 to be paid to SCC on the date of the execution of this Agreement;
 
  (ii)   an aggregate amount of US$23,000,000 (the “Balance Purchase Consideration”) to be paid in installments from 2007 to 2010 on the last Business Day of each Year from 2007 to 2010 (both Years inclusive) and the amount to be paid to SCC each Year shall be calculated as follows:
                         
 
  P   =   S
 
50,000,000 		  ×   23,000,000
 
4 		   
Where:
P denotes the installment of the Balance Purchase Consideration payable for that Year;

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S denotes the Transferred Revenues for the relevant Year; and
  (iii)   a balance amount equal to the difference between US$23,000,000 and the aggregate amount paid under sub-paragraph (ii) (if such aggregate amount paid is effectively less than US$23,000,000) to be paid to SCC on or before 31 December 2010. For the avoidance of doubt, the aggregate of the amounts payable under Clauses 3.1(ii) and 3.1(iii) shall not exceed US$23,000,000.
3.2   Payments to be made by ANST to SCC in accordance with this Clause 3 shall be made in RMB in the equivalent RMB amount (based on the US$ to RMB exchange rate on the Business Day prior to the date of payment quoted by The Hongkong and Shanghai Banking Corporation Limited, Singapore (or any successor entity thereof)) on the date of payment by telegraphic transfer to a bank account in the PRC notified by SCC to ANST not later than three (3) Business Days prior to the relevant payment date.
 
3.3   In the event that the cumulative Transferred Revenues for the Years 2007 to 2010 (both Years inclusive) exceeds US$180,000,000, ANST shall pay the amount of US$5,000,000 to SCC on or before 30 June 2011 (the “Additional Incentive Amount”), which amount is a goodwill payment and does not form any part of the Purchase Consideration.
4.   TRANSFERS OF ASSETS
 
4.1   The Parties agree and acknowledge that the representatives of ANST have on 16 and 17 April 2006 (“Inspection Dates”) inspected the Assets.
 
4.2   The Assets shall be transferred by SCC to ANST in such phases and in such manner as more particularly set out in the Transfer Plan (as may be amended and updated from time to time by mutual agreement of SCC and ANST in writing) and pursuant to each phase, the following shall occur:
  (i)   ANST shall inspect the Assets to be transferred under such phase (the “affected Assets”) on the date for the Transfer of such Assets for such phase set out in the Transfer Plan (“Transfer Date”) for the sole purpose of determining that the affected Assets are in the same condition as at the Inspection Dates (ordinary wear and tear and deterioration through the effluxion of time excepted);
 
  (ii)   if such inspection by ANST confirms that the Assets are in the same condition as at the Inspection Dates (ordinary wear and tear and deterioration through the effluxion of time excepted), SCC shall de-install the affected Assets and upon successful completion of the de-installation, ANST will deliver to SCC an acceptance certificate confirming acceptance of the affected Assets under the Transfer (“Acceptance Certificate”). For the avoidance of doubt, ANST shall not be required to issue an Acceptance Certificate if the affected Assets are damaged in the course of the de-installation;
 
  (iii)   upon de-installation, the risks of the affected Assets under the Transfer will pass to ANST;
 
  (iv)   upon issuance of the Acceptance Certificate, the title to the affected Assets under the Transfer will pass to ANST; and

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  (v)   ANST shall take all necessary steps to package, crate and transport the affected Assets, as well as take out insurance coverage on the affected Assets.
4.3   In the event of any non-delivery or shortfall of any of the Assets (“Undelivered Assets”) in accordance with the Transfer Plan, SCC shall deliver to ANST such tools, equipment and spare parts as are substantially similar to the Undelivered Assets within 45 days of the Transfer Date in relation to the Undelivered Assets or such other date as ANST and SCC may mutually agree.
 
4.4   For the avoidance of doubt, SCC shall be entitled to utilise the Assets for their own benefit and at their own risk up to and until the date on which the relevant Assets are to be transferred to ANST under the Transfer Plan.
5.   RESPONSIBILITIES AND OBLIGATIONS
 
5.1   SCC shall:
  (i)   keep the Assets in reasonably good working condition, free from fire, free from moisture and to secure the Assets before their Transfer;
 
  (ii)   use commercially reasonable efforts to ensure that at the time of Transfer to ANST, the condition of the Assets is substantially the same as the condition as at the Inspection Dates (ordinary wear and tear and deterioration through the effluxion of time excepted);
 
  (iii)   for a period of 12 months commencing from the date of this Agreement, send technical engineers to ANST to guide and help ANST install, test and commission the Assets, at ANST’s sole cost and expense;
 
  (iv)   for a period of 12 months commencing from the date of this Agreement, train ANST engineers to use and maintain the Assets, at ANST’s sole cost and expense;
 
  (v)   co-operate fully with ANST on implementing the Transfer Plan and the de-commissioning, wipe-down, packaging, transport, reassembling, installing, testing, facility quality guidelines, facility maintenance guidelines, related products process flow and specifications plus quality assurance specifications and process flow of the Assets; and
 
  (vi)   for a period of 12 months commencing from the date of the completion of the first Transfer, provide technical assistance to help bring the equipment up and running and if necessary, to send its technical persons to ANST’s site to set up, maintain and repair the Assets Transferred.
5.2   SCC shall, and SCL shall procure that SCC shall, use commercially reasonable efforts (as if SCC were in the position of ANST in receiving the benefits of having the SCL Customers), to refer and transfer the Transfer Customers to ANST and to help the Transfer Customers qualify ANST as soon as possible.
 
5.3   Subject to Clause 5.2 and the confidentiality agreements between SCC, SCL and/or its subsidiaries with the respective Transfer Customers, SCC shall:
  (i)   for a period of 12 months commencing from the date of this Agreement, provide to ANST such information and assistance as ANST may reasonably require

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      relating to the Assets including, but not limited to, the Technical Specifications and all related intellectual property for the Assets;
 
  (ii)   for a period of 12 months commencing from the date of this Agreement, train ANST engineers and staff members to assist in their familiarisation with the Technical Specifications, at ANST’s sole cost and expense; and
 
  (iii)   provide details of the name list, needs, business volume forecast and past three (3) years business profiles of each Transfer Customer.
5.4   ANST shall:
  (i)   work with SCC’s technical engineers on implementing the Transfer Plan and the de-commissioning, wipe-down, packaging, transport, reassembling, installing, testing, facility quality guidelines, facility maintenance guidelines, related products process flow and specifications plus quality assurance specifications and process flow of the Assets;
 
  (ii)   use commercially reasonable efforts to promptly accept and confirm orders from Transfer Customers and issue invoices to Transfer Customers for such orders;
 
  (iii)   prepare and furnish to SCC within three (3) Business Days of the end of each month, a monthly report setting out sufficient details of the aggregate Transferred Revenues for that month, in form and substance satisfactory to SCC; and
 
  (iv)   use commercially reasonable efforts to provide SCC and its officers, employees, representatives and agents (collectively, the “Representatives”) access to all its financial and operating data, books and records as SCC and/or its Representatives may from time to time require, in connection with the verification of the monthly reports referred to in sub-paragraph (iii) above.
5.5   Each Party shall:
  (i)   at all times co-operate fully with the other Parties to improve, perfect, execute and implement the Transfer Plan and to facilitate and expedite the Transfers; and
 
  (ii)   co-operate with the other Parties to obtain all local and national government regulatory approvals, licenses and permits that are required for the consummation of the transactions contemplated under this Agreement.
5.6   The Parties shall agree on a plan for SCC to and SCC shall, in accordance with such plan, send out technical engineers to ANST and use existing production lines in ANST to build skills and processes, quality control and manufacturing process flow and specifications for the Transfer Customers according to the requirements of SCC and the Transfer Customers.
6.   WARRANTIES

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6.1   Each Party hereby represents and warrants to and undertakes with the other Parties that:
  (i)   it has full power and capacity to enter into and perform this Agreement, and this Agreement when executed will constitute valid and binding obligations, enforceable in accordance with its terms; and
 
  (ii)   the execution and delivery of, and the performance by it of its obligations under, this Agreement will not:
  (a)   result in a breach of any provision of its memorandum or articles of association or constitutional documents or any agreement to which it is a party; or
 
  (b)   result in a breach of any order, judgment or decree of any court, governmental agency or regulatory body to which it is a party or by which it is bound.
6.2   Each of SCL and SCC hereby warrants to ANST that:
  (i)   SCC is the legal and beneficial owner of the Assets; and
 
  (ii)   the Assets are or will at the time of the relevant Transfer or delivery pursuant to Clause 4.3 (as the case may be) be free from all Encumbrances.
6.3   Each of CRL and ANST agrees and acknowledges that the Assets are to be sold and purchased on an “as is, where is” basis as at the Inspection Dates and that SCC has not given any warranties, representations, covenants or undertakings in respect of the Assets, including without limitation any relating to description performance, merchantability, fitness for any use or purpose, value, condition, performance, maintenance, specification or design, of the whole or any part of the Assets save for the warranties expressly set out in this Agreement.
7.   NON-SOLICITATION
 
7.1   Each of CRL and ANST jointly and severally covenants with and undertakes to SCC that it shall not, and shall procure that none of the subsidiaries of CRL shall, without the prior written consent of SCC, at any time induce or attempt to induce any person who is at the time of this Agreement or who later becomes an employee of SCC or any of its Related Corporations in their businesses to terminate his or her employment with SCC or its Related Corporations (as the case may be).
 
7.2   SCC covenants with and undertakes to ANST that:
  (i)   it shall not solicit, entertain, discuss, negotiate or finalise any arrangements with any third party with a view to or in connection with any acquisition or purchase of all or part of the Assets; and
 
  (ii)   it and its subsidiaries shall not directly or indirectly, solicit any offers or proposals from any person relating to any sale or acquisition of all or part of the

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      Assets or enter into or continue any discussion or negotiation in respect of Clause 7.2(i).
8.   CRL GUARANTEE
 
8.1   In consideration of SCC agreeing, at the request of CRL and ANST, to enter into this Agreement, CRL hereby guarantees and undertakes to SCC the due and punctual payment to SCC and/or its nominee(s) of the Balance Purchase Consideration and the Additional Incentive Amount when due and payable under this Agreement (the “CRL Guarantee”) and accordingly, in the event that ANST is unable to perform any of its payment obligations to pay the Balance Purchase Consideration and/or the Additional Incentive Amount within 60 days after the due date in relation to such payment obligation, CRL shall forthwith perform such obligation to pay.
 
8.2   The CRL Guarantee is a continuing guarantee and shall remain in full force and effect until (a) all the payment obligations of ANST in relation to the Balance Purchase Consideration and the Additional Incentive Amount expressed or contemplated herein shall have been performed in full or discharged or (b) until 61 days after 30 June 2011, whichever is earlier, and are in addition to and not in substitution for any other rights which SCC may have under or by virtue of this Agreement. CRL shall not be exonerated or discharged from liability under the CRL Guarantee by time being given to ANST by SCC or by any other indulgence or concession to any person granted by SCC and time given to ANST by SCC or any other indulgence or concession granted by SCC to any person shall not be construed as a waiver of any of the rights of SCC under this Agreement.
9.   SCL GUARANTEE
 
9.1   In consideration of CRL agreeing, at the request of SCL and SCC, to enter into this Agreement, SCL hereby guarantees and undertakes to ANST the due and punctual performance by SCC of its obligations under Clauses 5.2, 5.3 and 6.2 (the “SCL Guarantee”) and accordingly, in the event that SCC is unable to perform any of its obligations under Clauses 5.2, 5.3 or 6.2, SCL shall forthwith perform such obligation.
 
9.2   This SCL Guarantee is a continuing guarantee and shall remain in full force and effect until all the obligations of SCC under Clauses 5.2, 5.3 and 6.2 shall have been performed in full or until 30 June 2011, whichever is earlier.
10.   ANNOUNCEMENTS
 
    Save as may be required to be disclosed pursuant to any applicable laws or to any requirement of any competent governmental or statutory authority or rules or regulations of any relevant regulatory, administrative or supervisory body (including, without limitation, any relevant stock exchange or securities council), none of the Parties shall make or authorise the making of any announcement concerning the subject matter of this Agreement unless the other Parties shall have given their written consent to such announcement (such consent not to be unreasonably withheld).

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11.   STAMP DUTY
 
    All stamp duty payable (if any) on this Agreement or any other document executed or to be executed pursuant to this Agreement shall be borne equally by the Parties.
12.   COSTS AND EXPENSES
 
12.1   The applicable taxes payable in the PRC (including the value added taxes) on the sale of the Assets and the cost and expenses of the de-installation of the Assets shall be borne by SCC. The entire costs and expenses (including taxes and duties) arising from the packaging, crating, transportation and all applicable insurance coverage on the Assets shall be borne by ANST.
 
12.2   Save as otherwise provided in this Agreement, each Party shall bear its own legal, professional and other costs and expenses incurred by it in connection with the negotiation, preparation or completion of this Agreement.
13.   CONFIDENTIALITY
 
13.1   The Parties shall (and shall procure that its agents and where applicable its officers and employees shall) at all times use all reasonable endeavours to keep confidential any Confidential Information which it may acquire in relation to any other Party or in relation to the clients, business or affairs of any other Party and shall not use or disclose such information to any other person except with the consent of that other party or in accordance with the order of a court of competent jurisdiction or of any governmental or regulatory authority (whether in Singapore or elsewhere).

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13.2   Notwithstanding Clause 13.1, the confidentiality obligation shall not apply to:
  (a)   any information obtained from any Party which becomes generally known to the public, other than by reason of any willful or negligent act or omission of any party hereto or any of their agents, advisers, directors, officers, employees or representatives;
 
  (b)   any information which is required to be disclosed pursuant to any applicable laws or to any competent governmental or statutory authority or pursuant to rules or regulations of any relevant regulatory, administrative or supervisory body (including, without limitation, any relevant stock exchange or securities council);
 
  (c)   any information disclosed by any of the Parties to their respective bankers, financial advisers, consultants and legal or other advisers for the purpose of this Agreement;
 
  (d)   any information disclosed by a Party to the directors, officers, employees, agents, advisors or investors of that Party and/or subsidiaries of that Party; and
 
  (e)   any information which is Transfer Customer Confidential Information which is subject to confidentiality undertakings entered into between ANST and each such Transfer Customer.
13.3   Without prejudice to the generality of the foregoing, ANST shall, and CRL shall procure that ANST shall, save where the Transfer Customer agrees otherwise:
  (a)   use Transfer Customer Confidential Information strictly for ANST’s businesses and operations in outsource foundry assembly and testing; and
 
  (b)   set up “firewalls” and implement other measures and processes to ensure that no Transfer Customer Confidential Information will be leaked outside of ANST and such measures shall include, without limitation, ensuring that the Transfer Customer Confidential Information may only be disclosed to such of the directors, officers or employees of ANST who are directly concerned with the business and operation of ANST and whose knowledge of such information is required for such purpose and who (prior to such disclosure) are bound by a confidentiality undertaking to the same extent as the undertaking contained in this Clause 13.3.
Each of CRL and ANST further acknowledges that SCC shall be entitled to equitable relief, including injunction, in the event of any breach or threatened breach of the provisions of the undertaking contained in this Clause 13.3.
13.4   Each of CRL and ANST shall jointly and severally hold harmless and indemnify SCC, its directors, officers, employees and representatives for any costs, claims, demands losses or liabilities of whatsoever nature arising directly or indirectly out of a breach of Clause 13.3. The aggregate liability of CRL and ANST for breaches of Clause 13.3 of this Agreement, Clause 24.3 of the Joint Venture Agreement and Clause 14.3 of the Manufacturer’s Representative’s Agreement (the “Confidentiality Obligations”) and all matters relating to or arising in connection with the subject matter of the Confidentiality Obligations, whether based on an action or claim in contract, tort or otherwise, shall not exceed US$5,000,000.

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13.5   While the restrictions contained in Clause 13.3 are considered by the Parties to be reasonable in all circumstances, it is recognised that such restrictions may fail for technical reasons unforeseen and accordingly, it is hereby agreed and declared that if any such restrictions shall be adjudged to be void as going beyond what is reasonable in all the circumstances for the protection of the interests of SCL and/or its Related Corporations but would be valid if part of the wording thereof were deleted or the periods (if any) thereof were reduced or the range of activities or areas dealt with thereby were reduced in scope, the said restrictions shall apply with such modifications as may be necessary to make them valid and effective.
 
13.6   CRL and ANST acknowledge that no right or license is granted by SCC or SCL in relation to any Transfer Customer Confidential Information.
 
13.7   The obligations contained in this Clause shall endure, notwithstanding the termination of this Agreement, without limit in point of time except and until any confidential information enters the public domain as set out above.
14.   GENERAL
 
14.1   This Agreement shall be binding upon and enure for the benefit of the permitted successors of the Parties.
 
14.2   Unless otherwise agreed in writing by the Parties, none of the Parties shall be entitled to assign this Agreement or any of its rights and obligations hereunder except that CRL may assign and transfer its rights and obligations under this Agreement in the manner set out in Clause 14.3 below.
 
14.3   The Parties acknowledge that CRL may, but shall not be obliged to undertake an internal corporate restructuring exercise involving CRL and its Related Corporations but not involving any change of ultimate shareholding control of CRL (a “Restructuring Exercise”). The Parties hereby agree that notwithstanding Clause 14.2, CRL may (but shall not be obliged to) transfer or assign its rights and obligations under this Agreement to its successor entity pursuant to the Restructuring Exercise (“CRL Successor Entity”) and no consent shall be required from any Party in respect of such assignment or transfer of CRL’s rights and obligations Provided that (i) such CRL Successor Entity’s net asset value (total assets minus total liabilities (excluding shareholders’ equity)) at the time of such assignment or transfer of CRL’s rights and obligations shall not be less than CRL’s net asset value (total assets minus total liabilities (excluding shareholders’ equity)) as of the date of this Agreement, based on CRL’s audited accounts for the financial year ended 31 December 2005; and (ii) not less than one (1) month prior to any such assignment or transfer, CRL has permitted SCC’s independent external auditors to, at the sole cost and expense of CRL, undertake a limited review of the financial statements of CRL Successor Entity for the sole purpose of determining its net asset value. The opinion of SCC’s independent external auditors shall be final, conclusive and binding on CRL and SCC.

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Table of Contents

14.4   The provisions of this Agreement (insofar as the same shall not have been fully performed at each Transfer) shall remain in full force and effect notwithstanding each Transfer. The Transfers shall not prejudice any rights of any of the Parties which may have accrued hereunder prior to each Transfer or payment of the Purchase Consideration or any part thereof.
 
14.5   The Parties shall do and execute or procure to be done and executed all such further acts, deeds, things and documents as may be necessary to give effect to the terms of this Agreement.
 
14.6   This Agreement, and the documents referred to in it, constitute the entire agreement and understanding between the Parties relating to the subject matter of this Agreement and none of the Parties has entered into this Agreement in reliance upon any representation, warranty or undertaking of any other Party which is not set out or referred to in this Agreement. The Parties agree that no variations or modifications shall be made to this Agreement unless agreed to by the Parties in writing. Nothing in this Clause 14.6 shall however operate to limit or exclude liability for fraud.
 
14.7   Save as expressly provided herein, any right of termination conferred upon a Party shall be in addition to and without prejudice to all other rights and remedies available to it and no exercise or failure to exercise such a right of termination shall constitute a waiver of any such other right or remedy.
 
14.8   As all Parties have participated in the drafting of this Agreement, the Parties agree that any applicable rule requiring the construction of this Agreement or any provision hereof against any Party drafting this Agreement shall not apply.
15.   ILLEGALITY
 
    The illegality, invalidity or unenforceability of any provision of this Agreement under the law of any jurisdiction shall not affect its legality, validity or enforceability under the law of any other jurisdiction nor the legality, validity or enforceability of any other provision.
16.   NOTICES
 
16.1   Any notice required to be given by a Party to the other Parties shall be deemed validly served by hand delivery or by telefax or by prepaid registered letter or by a recognised courier service sent to its address or facsimile number given herein or such other address or facsimile number as may from time to time be notified for this purpose. The initial addresses and telefax numbers of the Parties are:

13

Table of Contents

           
 
SCC
  :   STATS ChipPAC Shanghai Co., Ltd.
 
 
        
 
Fax Number
  :   x00 0000 0000
 
 
        
 
Address
  :   00 Xxx Xx Xxx Xxxxxx 00 Xxxxxxxxx #00-00/00 Xxxxxxxxx 000000
 
 
        
 
Attention
  :   Xx. Xxxxxx, Xxxx Xxxx, Vice President, Corporate Strategy
 
 
        
 
With a copy to
  :   Xx. Xxxxxx, Xxxxx, General Counsel
 
 
        
 
SCL
  :   STATS ChipPAC Ltd.
 
 
        
 
Fax Number
  :   x00 0000 0000
 
 
        
 
Address
  :   00 Xxx Xx Xxx Xxxxxx 00 Xxxxxxxxx #00-00/00 Xxxxxxxxx 000000
 
 
        
 
Attention
  :   Xx. Xxxxxx, Xxxx Xxxx, Vice President, Corporate Strategy
 
 
        
 
With a copy to
  :   Xx. Xxxxxx, Xxxxx, General Counsel
 
 
        
 
ANST
  :   Wuxi CR Micro-Assemb Tech. Ltd.
 
 
        
 
Fax Number
  :   x00 000 0000000
 
 
        
 
Address
  :   00 XxxxxXx Xxxx, Xxx Xx Xxxxxxxx, Xxxx, Xxxxxxx Xxxxxxxx, PRC
 
 
        
 
Attention
  :   Mr. Xxxxx Xxxx Jian, Director
 
 
        
 
CRL
      China Resources Logic Limited
 
 
        
 
Fax Number
  :   x000 0000 0000
 
 
        
 
Address
  :   Xxxxx 0000-0, 00/X., Xxxxx Resources Xxxxxxxx, 00 Xxxxxxx Xxxx, Xxxxxxx, Xxxx Xxxx
 
 
        
 
Attention
  :   Xx. Xxxx Xxxxxxx, Director and Chief Executive Officer
16.2   Any such notice or communication shall be deemed to have been served:
  (a)   if delivered by hand, at the time of delivery; or
 
  (b)   if posted by prepaid ordinary mail, at the expiration of three (3) days after the envelope containing the same shall have been put into the post; or
 
  (c)   if sent by facsimile, upon the receipt by the sender of the transmission report indicating that the notice or communication has been sent in full to the recipient’s facsimile machine, or such other similar medium of receipt; or
 
  (d)   if sent by courier, at the expiration of two (2) days after the package containing the same shall have been received by the relevant courier company.

14

Table of Contents

16.3     In proving such service it shall be sufficient to prove that delivery by hand was made or that the envelope containing such notice or document was properly addressed and posted as a prepaid ordinary mail letter or that the facsimile confirmation note indicates the transmission was successful, or, as the case may be, the package containing such notice or document was properly addressed and sent to the relevant courier company.
17.   REMEDIES AND WAIVERS
 
    No failure on the part of any Party to exercise, and no delay on its part in exercising, any right or remedy under this Agreement will operate as a waiver thereof, nor will any single or partial exercise of any right or remedy preclude any other or further exercise thereof or the exercise of any other right or remedy. The rights provided in this Agreement are cumulative and not exclusive of any rights or remedies provided by law.
18.   TIME OF ESSENCE
 
    Any date, time or period mentioned in any provision of this Agreement may be extended by mutual agreement among the Parties but as regards any time, date or period originally fixed and not extended or any time, date or period so extended as aforesaid time shall be of the essence.
19.   FORCE MAJEURE
 
    Save as is otherwise specifically provided in this Agreement, the Parties shall not be liable for failures or delays in performing their obligations hereunder arising from any cause beyond their control, including but not limited to acts of God, acts of civil or military authority, fires, strikes, lockouts or labour disputes, epidemics, governmental restrictions, wars, riots, earthquakes, storms, typhoons, floods and breakdowns in electronic and computer information and communications systems and in the event of any such delay the time for any Party’s performance shall be extended for a period equal to the time lost by reason of the delay which shall be remedied with all due despatch in the circumstances. Any Party who becomes aware of any event arising under this Clause shall notify the other Parties in writing promptly.
20.   COUNTERPARTS
 
    This Agreement may be signed in any number of counterparts, all of which taken together shall constitute one and the same instrument. Any Party may enter into this Agreement by signing any such counterpart and each counterpart may be signed and executed by the Parties and transmitted by facsimile transmission and shall be as valid and effectual as if executed as an original.
21.     GOVERNING LAW AND ARBITRATION
 
21.1     This Agreement shall be governed by, and construed in accordance with, the laws of the PRC. This Agreement is made out in six (6) originals in Chinese and four (4)

15

Table of Contents

originals in English. Both language versions shall have equal legal force provided that if there is a conflict between them the English version shall take precedence.
21.2   In case any dispute or difference shall arise between the Parties as to the construction of this Agreement or as to any matter of whatsoever nature arising thereunder or in connection therewith, including any question regarding its existence, validity or termination, such dispute or difference shall be submitted to a single arbitrator to be appointed by the Chairman for the time being of the CIETAC. Such submission shall be a submission to arbitration in accordance with the CIETAC Rules by which the Parties agree to be so bound. The place of arbitration shall be Shanghai and the arbitration shall be conducted wholly in the English language. The prevailing Party in the arbitration shall be entitled to receive reimbursement of its reasonable legal fees incurred in connection therewith.

16

Table of Contents

APPENDIX 1
ASSETS

17

Table of Contents

Transferred Assembly Equipment Summary
                         
        MOU             Haved added to Total by ANST
Core equipment confirmation     List     Core   Total   request (SCC agreeed)
BG  
Disco 850
     0     1   1    
   
Wafer mount ATM 8100=1,
     1     1   1    
   
manual wafer mount=1
     1     1   1    
DS  
DISCO 640=7, DISCO641=2, DISCO651=2
     11     8   11    
   
Manual wafer clean=3
     1     1   0    
   
CO2 bubbles
     3     3   4   1
   
Diama flow
     2     2   2    
DA  
ASM889=15, ESEC2007=38
     37     39   53    
   
Die Coat
     2     2   2    
Oven  
DA cure
     5     5   7    
   
PMC
     6     6   8    
WB  
KnS1488=47
     47     16   47    
   
Shikawa UTC200=53
     53     53   53    
   
Shikawa UTC250=191
     191     108   169   -22
   
Kns 8028=12
     12     12   12    
3rd opt  
3rd Inspection mc
     5     5   5    
   
Microvision for PDIP/SOIC150mil
     6     0   0    
   
Low power scope
     0     10   10    
   
High power scope
     0     1   2   1
   
Ball shear/WP
     0     1   2   1
MOLD  
Manual press=22
     22     22   26   4
   
Preheater=22
     22     22   26   4
   
Auto mold system=15
     16     16   16   1 (Added in 19 May 06)
   
Mold die
     79     78   134    
Marking  
Laser marker
           Total   18    
   
Pad print marking
     26     marking   6    
   
Pad engraver
           26   1    
   
Laser deflash
               1    
   
X-ray for mold
     0     1   1    
   
Profile projector
     0     1   1    
Plating  
plating mc pure tin=3, solder=1
     4     4   4    
Trim/form  
 
                    
   
Trim/form system (Manual+auto)
     42     40   59    
   
Trim.form die sets (manual+auto)
     101     80   90    
   
Lead scan (PDIP/SOIC150mils)
     2     0   1    
   
Lead straightener
     3     3   3    
   
C-XXX
     0         1   1
   
 
     700     568   778    
 
Same as number shown in the equipment list in MOU     Agreed number on Core mc needed   Total mc checked
    699          567 787     4/17/2006
    699          567 777    
 
------>4-21 updated (Have added to Total by ANST request (SCC agreeed))

 

Table of Contents

                     
    Process   Equipment Name   Model Type   Asset No.   Capital date
1   XX0   XX0 BUBBLER M/C   RC2000ACDS   40000841   2000.08.20
2   XX0   XX0 BUBBLER M/C   RC-2000 ACD   40000840   2000.08.20
3   XX0   XX0 BUBBLER M/C   RC-2000 ACD   40003185   2004.09.15
4   XX0   XX0 BUBBLER M/C   RC-2000 ACD   40002225   2002.09.16
0   XXXXXXXXX   XX 000   XXX0-X   40003639   2006.02.25
2   DIAMAFLOW   DP 038   ADS2-M        
1   DIE ATTACH   AD 889 HIGH SPEED AUTOMATIC DI   AD 889   40000829   2000.08.20
2   DIE ATTACH   AD 889 HIGH SPEED AUTOMATIC DI   AD 889   40002967   2004.04.23
3   DIE ATTACH   AD 889 HIGH SPEED AUTOMATIC DI   AD 889   40000828   2000.08.20
4   DIE ATTACH   AD 889 HIGH SPEED AUTOMATIC DI   AD 889   40000638   2000.11.30
5   DIE ATTACH   AD 889 HIGH SPEED AUTOMATIC DI   AD 889   40000636   2000.11.30
6   DIE ATTACH   AD 889 HIGH SPEED AUTOMATIC DI   AD 889   40000633   2000.11.30
7   DIE ATTACH   AD 889 HIGH SPEED AUTOMATIC DI   AD 889   40000634   2000.11.30
8   DIE ATTACH   AD 889 HIGH SPEED AUTOMATIC DI   AD 889   40002966   2004.04.23
9   DIE ATTACH   AD 889 HIGH SPEED AUTOMATIC DI   AD 889   40000635   2000.11.30
10
   DIE ATTACH   AUTOMATIC DIE BONDER   AD889   40000646   2000.12.30
11
   DIE ATTACH   AUTOMATIC DIE BONDER   AD889   40000645   2000.12.30
12
   DIE ATTACH   ICT:DIE MOUNTER   AD889   40000637   2000.11.30
13
   DIE ATTACH   ICT:DIE MOUNTER   AD889   40000643   2000.12.30
14
   DIE ATTACH   ICT:DIE MOUNTER   AD889   40002969   2004.04.23
15
   DIE ATTACH   ICT:DIE MOUNTER   AD889   40002968   2004.04.23
16
   DIE ATTACH   ICT:DIE BONDER   ESEC 2007IC-8   40000465   1997.12.31
17
   DIE ATTACH   ICT:DIE BONDER   ESEC 2007IC-8   40000466   1997.12.31
18
   DIE ATTACH   ICT:DIE BONDER   ESEC 2007IC-8   40000469   1997.12.31
19
   DIE ATTACH   ICT:DIE BONDER   ESEC 2007IC-8   40000384   1997.10.31
20
   DIE ATTACH   ICT:DIE BONDER   ESEC 2007IC-8   40000468   1997.12.31
21
   DIE ATTACH   ICT:DIE BONDER   ESEC 2007IC-8   40000470   1997.12.31
22
   DIE ATTACH   ICT:DIE BONDER   ESEC 2007IC-8   40000474   1997.12.31
23
   DIE ATTACH   ICT:DIE BONDER   ESEC 2007IC-8   40000473   1997.12.31
00
   XXX XXXXXX   XXXX0000 XXX DIE BONDER   ESEC 2007IC-8   40000472   1997.12.31
00
   XXX XXXXXX   XXXX0000 XXX DIE BONDER   ESEC 2007IC-8   40001596   2002.02.25
00
   XXX XXXXXX   XXXX0000 XXX DIE BONDER   ESEC 2007IC-8   40001749   2001.11.25
27
   DIE ATTACH   ICT:DIE BONDER   ESEC 2007IC-8   40001746   2001.11.25
28
   DIE ATTACH   ICT:DIE BONDER   ESEC 2007IC-8   40001747   2001.11.25
29
   DIE ATTACH   ICT:DIE BONDER   ESEC 2007IC-8   40001748   2001.11.25
30
   DIE ATTACH   ICT:DIE BONDER   ESEC 2007IC-8   40001750   2001.11.25
31
   DIE ATTACH   AUTO DIE BONDER   ESEC 2007BGA   40002590   2003.07.25
32
   DIE ATTACH   AUTO DIE BONDER   ESEC 2007BGA   40002591   2003.07.25
33
   DIE ATTACH   AUTO DIE BONDER   ESEC 2007BGA   40002592   2003.07.25
34
   DIE ATTACH   AUTO DIE BONDER   ESEC 2007IC-8   40002504   2003.04.26
35
   DIE ATTACH   AUTO DIE BONDER   ESEC 2007IC-8   40002503   2003.04.26
36
   DIE ATTACH   ICT:DIE BONDER   ESEC 2007IC-8   40002501   2003.04.26
37
   DIE ATTACH   AUTO DIE BONDER   ESEC 2007 IC-8   40002502   2003.04.26
38
   DIE ATTACH   AUTO DIE BONDER   ESEC 2007 HS   40000839   2000.08.20
39
   DIE ATTACH   AUTO DIE BONDER   ESEC 2007 HS   40000832   2000.08.20
40
   DIE ATTACH   AUTO DIE BONDER   ESEC 2007 HS   40000834   2000.08.20
41
   DIE ATTACH   AUTO DIE BONDER   ESEC 2007 HS   40000838   2000.08.20
42
   DIE ATTACH   AUTO DIE BONDER   ESEC 2007 HS   40000830   2000.08.20
43
   DIE ATTACH   AUTO DIE BONDER   ESEC 2007 HS   40000836   2000.08.20
44
   DIE ATTACH   AUTO DIE BONDER   ESEC 2007 HS   40000835   2000.08.20
45
   DIE ATTACH   AUTO DIE BONDER   ESEC 2007 HS   40000837   2000.08.20
46
   DIE ATTACH   AUTO DIE BONDER   ESEC 2007 HS   40000831   2000.08.20
47
   DIE ATTACH   AUTO DIE BONDER   ESEC 2007 HS   40000833   2000.08.20
48
   DIE ATTACH   AUTO DIE BONDER   ESEC 2007 HS   40002094   2002.07.27
49
   DIE ATTACH   AUTO DIE BONDER   ESEC 2007IC-8   40002701   2003.10.25
50
   DIE ATTACH   AUTO DIE BONDER   ESEC 2007IC-8   40002770   2003.12.30
51
   DIE ATTACH   AUTO DIE BONDER   ESEC 2007IC-8   40002769   2003.12.30
52
   DIE ATTACH   AUTO DIE BONDER   ESEC 2007IC-8   40002919   2004.03.27
53
   DIE ATTACH   AUTO DIE BONDER   ESEC 2007IC-8   40002983   2004.04.24
1   DIE COAT   DIE COATING M/C   L1500   40000386   1997.10.31
2   DIE COAT   DIE COATER       40001534   2001.11.26
1   DIE SAW   DICING SAW SYSTEM   DFD640   40000454   1997.12.31
2   DIE SAW   DICING SAW SYSTEM   DFD640   40000455   1997.12.31
3   DIE SAW   DICING SAW SYSTEM   DFD640   40000459   1997.12.31
4   DIE SAW   DICING SAW SYSTEM   DFD640   40000458   1997.12.31
5   DIE SAW   DICING SAW SYSTEM   DFD640   40000460   1997.12.31
6   DIE SAW   ICT:DICING SAW   DFD640   40002021   2002.05.25
7   DIE SAW   ICT:DIE SAW   DFD640   40002981   2004.04.24
8   DIE SAW   DP 067   DFD641   40000640   2000.11.30
9   DIE SAW   DP 076   DFD641   40000639   2000.11.30
10
   DIE SAW   DFD 641 FULLY AUTOMATIC DICING   DFD 651   40001517   2001.08.23
11
   DIE SAW   DFD 641 FULLY AUTOMATIC DICING   DFD 651   40003035   2001.08.23
1   INSPECTION   3RD INSPECTION M/C   PD24   40000558   1997.12.31
2   INSPECTION   3RD INSPECTION M/C   PS28W   40000554   1997.12.31
3   INSPECTION   3RD INSPECTION M/C   PD8/14/16   40000557   1997.12.31
4   INSPECTION   3RD INSPECTION M/C   PD8/14/16   40000561   1997.12.31
5   INSPECTION   3RD INSPECTION M/C   PD   40000556   1997.12.31
1   LEAD SCAN   LEAD SCANNING FOR SOIC 150MIL   851   40000695   1999.06.30

 

Table of Contents

                     
    Process   Equipment Name   Model Type   Asset No.   Capital date
1   LEAD STRAIGHTENER   AT-1045FP   SOIC150MIL   40000700   1999.08.31
2   LEAD STRAIGHTENER   AT-300-RDS   PDIP300MIL   40000702   1999.08.31
3   LEAD STRAIGHTENER   AT-600-RDS   PDIP600MIL   40000701   1999.08.31
1   XXXX   LASER M/K SYSTEM   SY95-02   40001341   1997.12.31
2   XXXX   AUTO YAG LASER M/K   DLM818SV   40001334   1997.07.31
3   XXXX   AUTO LASER M/K SYSTEM   DLM818SV   40001333   1997.07.31
4   XXXX   AUTO LASER M/K SYSTEM   DLM818SV   40000564   1998.05.31
5   XXXX   AUTO PAD MARKING M/C   DPM513HSV   40000598   1998.05.31
6   XXXX   AUTO PAD MARKING M/C   DPM513HSV   40000595   1998.05.31
7   XXXX   AUTO PAD M/K SYSTEM   PLCC 28LD   40000597   1998.05.31
8   XXXX   PAD MARKER   MARKEM 534   40000596   1998.05.31
9   XXXX   LASER MARKING M/C   SLD-402   40001691   2001.06.21
10
   XXXX   AUTO YAG M/K SYSTEM   PDIP/SOIC   40000145   1995.12.31
11
   XXXX   AUTO YAG M/K SYSTEM   PDIP/SOIC   40000683   1999.04.10
12
   XXXX   AUTO YAG M/K SYSTEM   PDIP/SOIC   40000682   1999.04.10
13
   XXXX   YAG LASER M/K SYS   DLM818SV   40000566   1998.05.31
14
   XXXX   YAG LASER M/K SYS   DLM818SV   40000565   1998.05.31
15
   XXXX   LASER MARKER AND PARTS   SLD402   40001690   2001.06.21
16
   XXXX   AUTO STRIP LASER MARKING M/C   AT1817   40000648   2000.12.30
17
   XXXX   AUTO STRIP LASER MARKING M/C   AT1818   40001689   2001.05.28
18
   XXXX   ICT:LASER MARKING SYSTEM(JIT)   LEADED PKG   40002023   2002.05.25
19
   XXXX   XXXXX LASER DEFLASHER FOR EDP   KDM600   40002299   2002.10.25
20
   XXXX   SDL PLATE MARKE   MARKEM612   40000684   1999.04.10
21
   XXXX   LASER MARKING SYSTEM(STRIP MAR   SLD-402/100   40000623   1995.12.31
22
   XXXX   AUTO LASER XXXX M/C   EO LASER(SY9502)   40003189   2004.09.16
23
   XXXX   AUTO LASER XXXX M/C   EO LASER(SY9502)   40001332   1997.06.30
24
   XXXX   AUTO PAD XXXX M/C   TECA   40001330   1997.04.30
25
   XXXX   AUTO PAD XXXX M/C   TECA   40000699   1999.08.31
26
   XXXX   LASER MARKING SYSTEM   SLD-402/100   40001506   2000.08.20
1   MOLD AUTO   TOWA AUTO MOLD   Y-1 4F   40000588   1998.05.31
2   MOLD AUTO   TOWA AUTO MOLD   Y-1 4F   40000589   1998.05.31
3   MOLD AUTO   TOWA AUTO MOLD   Y-1 8F   40000657   1999.03.31
4   MOLD AUTO   TOWA AUTO MOLD   Y-1 8F   40000772   2000.05.28
5   MOLD AUTO   TOWA AUTO MOLD   Y-1 8F   40000771   2000.05.28
6   MOLD AUTO   TOWA AUTO MOLD   Y-1 4F   40000658   1999.03.31
7   MOLD AUTO   ASM AUTO MOLD   ES649 4F   40000665   1999.04.10
8   MOLD AUTO   ASM AUTO MOLD   ES649 4F   40000664   1999.04.10
9   MOLD AUTO   ASM AUTO MOLD   EM649 4F   40000667   1999.04.10
10
   MOLD AUTO   TOWA AUTO MOLD   Y-1E 8F   40000647   2000.12.30
00
   XXXX XXXX   XXXX XXXX XXXX   X-0 0X   40001778   2001.12.23
00
   XXXX XXXX   XXXX XXXX XXXX   X-0 0X   40001779   2001.12.23
00
   XXXX XXXX   XXXX XXXX XXXX   X-0 0X   40001906   2001.07.29
00
   XXXX XXXX   XXXX XXXX XXXX   X-0 0X   40001777   2001.12.23
00
   XXXX XXXX   XXXX XXXX XXXX   X-0 0X   40001987   2002.03.26
00
   XXXX XXXX   XXXX XXXX XXXX   XXX000XXX 0X   40001925   1995
1   MOLD   MOLD DIE   PDIP8M   40003100   2004.07.23
2   MOLD   MOLD DIE   PDIP8M   40003101   2004.07.23
3   MOLD   MOLD DIE   PDIP8M   40002386   2002.12.28
4   MOLD   MOLD DIE   PDIP8M   40002387   2002.12.28
5   MOLD   MOLD DIE   PDIP8M   40003100   2004.07.23
6   MOLD   MOLD DIE   PDIP8M   40003101   2004.07.23
7   MOLD   MOLD DIE   PDIP8M        
8   MOLD   MOLD DIE   PDIP8M        
9   MOLD   MOLD DIE   PDIP8M        
10
   MOLD   MOLD DIE   PDIP8M        
11
   MOLD   MOLD DIE   PDIP8M        
12
   MOLD   MOLD DIE   PDIP8M        
13
   MOLD   MOLD DIE   PDIP8   40000591   2001.12.31
14
   MOLD   MOLD DIE   PDIP14   40000160   1995.12.31
15
   MOLD   MOLD DIE   PDIP14   40000161   1995.12.31
16
   MOLD   MOLD DIE   PDIP14   40000237   1996.09.17
17
   MOLD   MOLD DIE   PDIP14   40001556   2001.12.28
18
   MOLD   MOLD DIE   PDIP14   40000170   1995.12.31
19
   MOLD   MOLD DIE   PDIP16   40000171   1995.12.31
20
   MOLD   MOLD DIE   PDIP16   40000590   1998.05.31
21
   MOLD   MOLD DIE   PDIP16   40001553   2001.12.28
22
   MOLD   MOLD DIE   PDIP16   40000034   1997.12.31
23
   MOLD   MOLD DIE   PDIP16   40000849   2000.09.30
24
   MOLD   MOLD DIE   PDIP18   40000256   2001.12.31
25
   MOLD   MOLD DIE   PDIP20   40000255   2001.12.31
26
   MOLD   MOLD DIE   PDIP20   40000163   1995.12.31
27
   MOLD   MOLD DIE   PDIP24   40000164   1995.12.31
28
   MOLD   MOLD DIE   PDIP24   40001554   2001.12.28
29
   MOLD   MOLD DIE   PDIP24   40001555   2001.12.28
30
   MOLD   MOLD DIE   PDIP24   40000493   2001.12.31
31
   MOLD   MOLD DIE   PDIP28   40000494   2001.12.31
32
   MOLD   MOLD DIE   PDIP28   40001896   2001.05.25
33
   MOLD   MOLD DIE   PDIP28   40001608   1996.03.25
34
   MOLD   MOLD DIE   PDIP28   40000166   2001.12.31

 

Table of Contents

                     
    Process   Equipment Name   Model Type   Asset No.   Capital date
35
   MOLD   MOLD DIE   PDIP24N   40000238   2001.12.31
36
   MOLD   MOLD DIE   PDIP28N   40001608   1996.03.25
37
   MOLD   MOLD DIE   PDIP32   40002205   2002.07.28
38
   MOLD   MOLD DIE   PDIP32   40002207   2002.07.28
39
   MOLD   MOLD DIE   PDIP40   40000169   1995.12.31
40
   MOLD   MOLD DIE   PDIP40   40002632   2001.04.29
41
   MOLD   MOLD DIE   PDIP40   40000240   1996.09.17
42
   MOLD   MOLD DIE   PDIP40   40000495   1997.12.31
43
   MOLD   MOLD DIE   PDIP40   40002633   2001.04.29
44
   MOLD   MOLD DIE   PLCC20   40000650   2000.12.30
45
   MOLD   MOLD DIE   PLCC28   40000229   1996.07.30
46
   MOLD   MOLD DIE   PLCC28   40003601   2006.01.28
47
   MOLD   MOLD DIE   PLCC32   40001023   2001.01.24
48
   MOLD   MOLD DIE   PLCC44   40002218   2002.08.25
49
   MOLD   MOLD DIE   PLCC44   40000268   1997.01.31
50
   MOLD   MOLD DIE   SOIC8/SOEP8E   40001991   2002.04.01
51
   MOLD   MOLD DIE   SOIC8/SOEP8E   40001992   2002.04.01
52
   MOLD   MOLD DIE   SOIC8/SOEP8E   40001993   2002.04.01
53
   MOLD   MOLD DIE   SOIC8/SOEP8E   40001994   2002.04.01
54
   MOLD   MOLD DIE   SOIC8/SOEP8E   40000794   2000.06.21
55
   MOLD   MOLD DIE   SOIC8/SOEP8E   40000794   2000.06.21
56
   MOLD   MOLD DIE   SOIC8/SOEP8E   40000794   2000.06.21
57
   MOLD   MOLD DIE   SOIC8/SOEP8E   40000794   2000.06.21
58
   MOLD   MOLD DIE   SOIC8/SOEP8E   40002304   2002.10.25
59
   MOLD   MOLD DIE   SOIC8/SOEP8E   40002303   2002.10.25
60
   MOLD   MOLD DIE   SOIC8/SOEP8E   40003199   2004.09.19
61
   MOLD   MOLD DIE   SOIC8/SOEP8E   40003200   2004.09.19
62
   MOLD   MOLD DIE   SOIC8/SOEP8E   40001991   2002.04.01
63
   MOLD   MOLD DIE   SOIC8/SOEP8E   40001992   2002.04.01
64
   MOLD   MOLD DIE   SOIC8/SOEP8E   40001993   2002.04.01
65
   MOLD   MOLD DIE   SOIC8/SOEP8E   40001994   2002.04.01
66
   MOLD   MOLD DIE   SOIC8W   40003199   2004.09.19
67
   MOLD   MOLD DIE   SOIC8W   40003200   2004.09.19
68
   MOLD   MOLD DIE   SOIC8W   40003245   2004.11.08
69
   MOLD   MOLD DIE   SOIC8W   40003422   2005.08.19
70
   MOLD   MOLD DIE   SOIC14N   40000496   1997.12.31
71
   MOLD   MOLD DIE   SOIC14N   40000172   1995.12.31
72
   MOLD   MOLD DIE   SOIC14N   40000848   2000.09.30
73
   MOLD   MOLD DIE   SOIC14N   40002931   2004.04.01
74
   MOLD   MOLD DIE   SOIC16N   40000316   1997.05.31
75
   MOLD   MOLD DIE   SOIC16N   40003198   2004.09.19
76
   MOLD   MOLD DIE   SOIC16N   40000173   1995.12.31
77
   MOLD   MOLD DIE   SOIC16N   40001775   2001.12.23
78
   MOLD   MOLD DIE   SOIC14M   40003442   2005.09.20
79
   MOLD   MOLD DIE   SOIC14M   40003442   2005.09.20
80
   MOLD   MOLD DIE   SOIC14M   40003442   2005.09.20
81
   MOLD   MOLD DIE   SOIC14M        
82
   MOLD   MOLD DIE   SOIC16M   40003443   2005.09.20
83
   MOLD   MOLD DIE   SOIC16M   40003443   2005.09.20
84
   MOLD   MOLD DIE   SOIC16M   40003443   2005.09.20
85
   MOLD   MOLD DIE   SOIC16M        
86
   MOLD   MOLD DIE   SOIC16W   40000174   1995.12.31
87
   MOLD   MOLD DIE   SOIC16W   40001685   2001.04.29
88
   MOLD   MOLD DIE   SOIC16WM   40003366   2005.05.16
89
   MOLD   MOLD DIE   SOIC20   40000175   1995.12.31
90
   MOLD   MOLD DIE   SOIC20   40000050   1998.12.31
91
   MOLD   MOLD DIE   SOIC20M        
92
   MOLD   MOLD DIE   SOIC20M        
93
   MOLD   MOLD DIE   SOIC20M        
94
   MOLD   MOLD DIE   SOIC20M        
95
   MOLD   MOLD DIE   SOIC24        
96
   MOLD   MOLD DIE   SOIC24   40001677   2001.03.31
97
   MOLD   MOLD DIE   SOIC24NM   40003397   2005.07.22
98
   MOLD   MOLD DIE   SOIC28N   40000242   2001.12.31
99
   MOLD   MOLD DIE   SOIC28N   40001679   2001.03.31
100
   MOLD   MOLD DIE   SOIC28N   40001678   2001.03.31
101
   MOLD   MOLD DIE   SOIC28NM   40003398   2005.07.22
102
   MOLD   MOLD DIE   SOIC28NM   40003398   2005.07.22
103
   MOLD   MOLD DIE   SOIC28NM        
104
   MOLD   MOLD DIE   SOIC28W   40003575   2006.01.25
105
   MOLD   MOLD DIE   SOIC28W   40000243   2001.12.31
106
   MOLD   MOLD DIE   SSOP48   40003268   2004.12.06
107
   MOLD   MOLD DIE   SSOP48   40003269   2004.12.06
108
   MOLD   MOLD DIE   SSOP48   40003270   2004.12.06
109
   MOLD   MOLD DIE   SSOP48   40003271   2004.12.06
110
   MOLD   MOLD DIE   SSOP48   40003272   2004.12.06
111
   MOLD   MOLD DIE   SSOP48   40003273   2004.12.06
112
   MOLD   MOLD DIE   SSOP56   40002051   2002.05.27
113
   MOLD   MOLD DIE   SSOP56   40002051   2002.05.27

 

Table of Contents

                     
    Process   Equipment Name   Model Type   Asset No.   Capital date
                     
114
   MOLD   MOLD DIE   SSOP56   40002051   2002.05.27
115
   MOLD   MOLD DIE   SSOP56   40002051   2002.05.27
116
   MOLD   MOLD DIE   SSOP56AMP   40003066   2004.06.26
117
   MOLD   MOLD DIE   SSOP56AMP   40003066   2004.06.26
118
   MOLD   MOLD DIE   TSSOP8   40001577   2002.02.19
119
   MOLD   MOLD DIE   TSSOP8   40003419   2005.08.18
120
   MOLD   MOLD DIE   TSSOP8   40003599   2006.01.28
121
   MOLD   MOLD DIE   TSSOP14/16   40001579   2002.02.19
122
   MOLD   MOLD DIE   TSSOP14/16   40003194   2004.09.16
123
   MOLD   MOLD DIE   TSSOP14/16   40003099   2004.07.23
124
   MOLD   MOLD DIE   TSSOP14/16   40003800   2006.04.28
125
   MOLD   MOLD DIE   TSSOP20        
126
   MOLD   MOLD DIE   TSSOP20   40003567   2005.12.24
127
   MOLD   MOLD DIE   TSSOP20   40003798   2006.04.28
128
   MOLD   MOLD DIE   TSSOP24        
129
   MOLD   MOLD DIE   TSSOP28   40003239   2004.11.03
130
   MOLD   MOLD DIE   TSSOP28   40001578   2002.02.19
131
   MOLD   MOLD DIE   TSSOP28   40003566   2005.12.24
132
   MOLD   MOLD DIE   MSOP8/10   40001575   2002.02.19
133
   MOLD   MOLD DIE   MSOP8/10   40003038   2004.06.23
134
   MOLD   MOLD DIE   PLCC84   40000036   1997.12.31
1   MOLD PRESS   MANUAL MOLD PRESS   FSTMP-250TM32   40000364   1997.08.31
2   MOLD PRESS   MANUAL MOLD PRESS   FSTMP-250   40000153   1995.12.31
3   MOLD PRESS   MANUAL MOLD PRESS   FSTMP-250TM32   40000155   1995.12.31
4   MOLD PRESS   MANUAL MOLD PRESS   FSTMP-250TM32   40000157   1995.12.31
5   MOLD PRESS   MANUAL MOLD PRESS   FSTMP-250TM32   40000158   1995.12.31
6   MOLD PRESS   MANUAL MOLD PRESS   FSTMP-200-7TM   40000247   1996.09.30
7   MOLD PRESS   MANUAL MOLD PRESS   FSTMP-250TM32   40000156   1995.12.31
8   MOLD PRESS   MANUAL MOLD PRESS   FSTMP-250TM32   40000315   1997.05.31
9   MOLD PRESS   MANUAL MOLD PRESS   FSTMP-250TM32   40000484   1997.04.30
10
   MOLD PRESS   MANUAL MOLD PRESS   FSTM250-7TAN32   40000481   1997.12.31
11
   MOLD PRESS   MANUAL MOLD PRESS   FSTM250-7TAN32   40000570   1998.05.31
12
   MOLD PRESS   MANUAL MOLD PRESS   FSTM250-7TAN32   40000487   1997.12.31
13
   MOLD PRESS   MANUAL MOLD PRESS   FSTM250-7TAN32   40000486   1997.12.31
14
   MOLD PRESS   MANUAL MOLD PRESS   FSTM250-7TAN32   40000576   1998.05.31
15
   MOLD PRESS   MANUAL MOLD PRESS   FSTM250-7TAN32   40000575   1998.05.31
16
   MOLD PRESS   MANUAL MOLD PRESS   FSTM250-7TAN32   40000572   1998.05.31
17
   MOLD PRESS   MANUAL MOLD PRESS   FSTM250-7TAN32   40000571   1998.05.31
18
   MOLD PRESS   MANUAL MOLD PRESS   FSTM250-7TAN32   40000490   1997.12.31
19
   MOLD PRESS   MANUAL MOLD PRESS   FSTM250-7TAN32   40000491   1997.12.31
20
   MOLD PRESS   MANUAL MOLD PRESS   FSTM250-7TAN32   40000574   1998.05.31
21
   MOLD PRESS   MANUAL MOLD PRESS   FSTM250-7TAN32   40000573   1998.05.31
22
   MOLD PRESS   MANUAL MOLD PRESS   FSTM250-7TAN32   40000492   1997.12.31
23
   MOLD PRESS   MANUAL MOLD PRESS   FSTM250-7TAN32   40000483   1997.12.31
24
   MOLD PRESS   MANUAL MOLD PRESS   FSTM250-7TAN32   40000569   1998.05.31
25
   MOLD PRESS   MANUAL MOLD PRESS   FSTMP-250TM32   40002329   2002.11.23
26
   MOLD PRESS   MANUAL MOLD PRESS   FSTMP-250TM32   40002328   2002.11.23
1   OVEN   DA OVEN   MP1506   40000121   1995.12.31
2   OVEN   DA OVEN   MP1506   40000127   1995.12.31
3   OVEN   DA OVEN   MP1506   40000128   1995.12.31
4   OVEN   DA OVEN   MP1506   40000125   1995.12.31
5   OVEN   DA OVEN   MP1506   40000126   1995.12.31
6   OVEN   DA OVEN   MP1506   40000122   1995.12.31
7   OVEN   DA OVEN   MP1506   40000124   1995.12.31
8   OVEN   PMC OVEN   MP-1506FY-HP-WAS   40000190   1995.12.31
9   OVEN   PMC OVEN   MP-1506FY-HP-WAS   40000191   1995.12.31
10
   OVEN   PMC OVEN   MP-1506FY-HP-WAS   40000192   1995.12.31
11
   OVEN   PMC OVEN   ASC-336F   40000194   1995.12.31
12
   OVEN   PMC OVEN   MP-1506FY-HP-WAS   40000202   1995.12.31
13
   OVEN   PMC OVEN   MP-1506FY-HP-WAS   40001306   1995.12.31
14
   OVEN   PMC OVEN   MP-1506FY-HP-WAS   40001307   1995.12.31
15
   OVEN   PMC OVEN   MP-1506FY-HP   40001308   1995.12.31
1   PLATING   PLATING M/C   EDF-EPL 1800S   40000497   1997.12.31
2   PLATING   PLATING M/C   EDF-EPL 1800S   40000498   1997.12.31
3   PLATING   PLATING M/C   EDF-EPL 1800S   40001905   2001.07.29
4   PLATING   PLATING M/C   EDF-EPL 1800S   40002108   2002.07.28
1   MOLD   PREHEATER   SD523M   40000184   1995.12.31
2   MOLD   PREHEATER   SD523M   40000179   1995.12.31
3   MOLD   PREHEATER   SD523M   40000231   1996.07.30
4   MOLD   PREHEATER   SD523M   40000185   1995.12.31
5   MOLD   PREHEATER   SD523M   40000186   1995.12.31
6   MOLD   PREHEATER   SD523M   40000181   1995.12.31
7   MOLD   PREHEATER   SD523M   40000188   1995.12.31
8   MOLD   PREHEATER   SD523M   40000178   1995.12.31
9   MOLD   PREHEATER   SD723M   40000405   1997.11.30
10
   MOLD   PREHEATER   SD723M   40000271   1997.01.31
11
   MOLD   PREHEATER   SD723M   40000339   1997.07.31
12
   MOLD   PREHEATER   SD723M   40000285   1997.04.30
13
   MOLD   PREHEATER   SD723M   40000368   1997.08.31

 

Table of Contents

                     
    Process   Equipment Name   Model Type   Asset No.   Capital date
                     
14
   MOLD   PREHEATER   SD723M   40000370   1997.08.31
15
   MOLD   PREHEATER   SD723M   40000407   1997.11.30
16
   MOLD   PREHEATER   SD723M   40000272   1997.01.31
17
   MOLD   PREHEATER   SD723M   40000410   1997.11.30
18
   MOLD   PREHEATER   SD723M   40000321   1997.06.30
19
   MOLD   PREHEATER   SD723M   40000317   1997.05.31
20
   MOLD   PREHEATER   SD723M   40000322   1997.06.30
21
   MOLD   PREHEATER   SD723M   40000411   1997.11.30
22
   MOLD   PREHEATER   SD723M   40000406   1997.11.30
23
   MOLD   PREHEATER   SD723M   40000369   1997.08.31
24
   MOLD   PREHEATER   SD723M   40000233   1996.07.30
25
   MOLD   PREHEATER   SD723M   40000338   1997.07.31
26
   MOLD   PREHEATER   SD723M   40000415   1997.11.30
1   TNF   XX000   XXXXXX XX0XX AUTO T/F/S(ROLLER)   40000704   1999.11.30
2   TNF   XX000   XXXXXX XX0XX AUTO T/F/S   40000704   1999.11.30
3   TNF   XX000   XXXXXX XX0XX AUTO T/F/S   40000703   1999.11.30
4   TNF   XX000   XXXXXX XX0XX AUTO T/F/S(ROLLER)   40000703   1999.11.30
5   TNF   AP047   MATRIX SOIC8LD AUTO TRIM   40000451   1997.12.30
6   TNF   AP066   MATRIX SOIC8LD F/S   40001593   2002.02.25
7   TNF   AP065   MATRIX SOIC8LD TRIM   40001592   2002.02.25
8   TNF   AP036   MATRX SOIC8LD AUTO FORM   40000668   1999.04.10
9   TNF   AP131   MSOP08/10 FORM   40003190   2004.09.16
10
   TNF   AP130   MSOP08 TRIM   40003191   2004.09.16
11
   TNF   AP084   MSOP8/10 3RD REJECT CUT TOOL   40001962   2002.02.24
12
   TNF   AP084   MSOP8/10LD AUTO FROM   40001962   2002.02.24
13
   TNF   AP083   MSOP10LD AUTO TRIM   40001963   2002.02.24
14
   TNF   AP020   PD14LD IDF AUTO T/F SHUTTLE(roller)   40000362   1997.08.31
15
   TNF   AP021   PD16LD IDF AUTO T/F SHUTTLE(roller)   40000363   1997.08.31
16
   TNF   AP002   PD16LD IDFAUTO T/F SHUTTLE(roller)   40000853   1997.11.30
17
   TNF   BP018   PD18 FORM MANUAL DIE   40001392   2000.12.30
18
   TNF   BP017   PD18 TRIM MANUAL DIE        
19
   TNF   AP051   PD20LD AUTO T/F/S SHUTTLE   40000681   1999.04.10
20
   TNF   BP012   PD24(N) TRIM MANUAL DIE   40001392   2000.12.30
21
   TNF   AP075   PD24(W)LD AUTO T/F SHUTTLE   40000656   2000.12.30
22
   TNF   BP004   PD24N FORM MANUAL DIE   40003347   2005.03.16
23
   TNF   BP004   PD28(N) FORM MANUAL DIE   40000928   1995.12.31
24
   TNF   BP012   PD28(N) TRIM MANUAL DIE   40000989   1995.12.31
25
   TNF   AP064   PD28(w)LD AUTO T/F   40001676   2001.03.31
26
   TNF   AP078   PD40 AUTO T/F SHUTTLE   40000423   1997.11.30
27
   TNF   AP008   PD8LD IDF AUTO T/F SHUTTLE   40000134   2001.12.31
28
   TNF   AP045   PLCC 44LD AUTO FORM   40000674   1999.04.10
29
   TNF   AP010   PLCC20LD AUTO TRIM   40000055   1996.10.31
30
   TNF   AP010   PLCC20LD AUTO FORM   40000055   1996.10.31
31
   TNF   AP070   PLCC28LD AUTO FORM   40000236   2001.12.31
32
   TNF   AP067   PLCC28LD AUTO TRIM   40001512   2000.11.15
33
   TNF   AP029   PLCC32LD FORM   40000235   1996.07.30
34
   TNF   AP026   PLCC32LD TRIM   40000424   1997.11.30
35
   TNF   AP050   PLCC44LD AUTO TRIM   40000675   1999.04.10
36
   TNF   AP055   PLCC84LD AUTO FORM   40000678   2001.12.30
37
   TNF   AP054   PLCC84LD AUTO TRIM   40000680   1999.04.10
38
   TNF   AP018   SO16(w)/20LD AUTO T/F   40000331   1997.07.31
39
   TNF   AP017   SO8/14/16LD AUTO T/F   40000257   1996.10.31
40
   TNF   AP116   SOIC 14LDM AUTO FORM   40002692   2003.10.21
41
   TNF   AP116   SOIC 16LDM AUTO FORM   40002692   2003.10.21
42
   TNF   AP046   SOIC 8/14/16LD AUTO FORM   40000685   1999.04.10
43
   TNF   AP128   SOIC08M FORM   40003209   2004.10.20
44
   TNF   AP059   SOIC14M TRIM   40000843   2000.09.29
45
   TNF   AP042   SOIC16(W)/20LD AUTO FORM   40000686   1999.04.10
46
   TNF   AP041   SOIC16(W)/20LD AUTO TRIM   40000687   1999.04.10
47
   TNF   AP080   SOIC16/20M AUTO FORM   40001711   2001.07.29
48
   TNF   AP079   SOIC16/20M AUTO TRIM   40001710   2001.07.29
49
   TNF   AP059   SOIC16M TRIM   40000843   2000.09.29
50
   TNF   AP105   SOIC24/28 TRIM/FORM   40000606   1998.05.31
51
   TNF   AP006   SOIC24/28LD AUTO TRIM   40000224   1996.06.30
52
   TNF   AP006   SOIC24/28LD AUTO FORM   40000224   1996.06.30
53
   TNF   AP076   SOIC24/28LD AUTO TRIM   40000676   1999.04.10
54
   TNF   AP076   SOIC24/28LD AUTO FORM   40000676   1999.04.10
55
   TNF   AP071   SOIC24M ATUO TRIM   40001751   2001.11.25
56
   TNF   AP131   SOIC24M FORM   40003190   2004.09.16
57
   TNF   AP007   SOIC28(w)LD AUTO TRIM   40000221   1996.05.31
58
   TNF   AP007   SOIC28(w)LD AUTO FORM   40000221   1996.05.31
59
   TNF   AP071   SOIC28M AUTO TRIM   40001751   2001.11.25
60
   TNF   AP131   SOIC28M FORM   40003190   2004.09.16
61
   TNF   XX000   XXXX0(x)XX AUTO FORM   40000605   1998.05.31
62
   TNF   AP031   SOIC8(w)LD AUTO TRIM   40000604   1998.05.31
63
   TNF   AP022   SOIC14/16LD AUTO FORM   40000452   1997.12.31
64
   TNF   AP025   SOIC14/16LD AUTO FORM   40000477   1997.12.31
65
   TNF   AP023   SOIC14/16LD AUTO TRIM   40000479   1997.12.31
66
   TNF   AP024   SOIC14/16LD AUTO TRIM   40000478   1997.12.31

 

Table of Contents

                     
    Process   Equipment Name   Model Type   Asset No.   Capital date
                     
67
   TNF   AP036   SOIC8M 3RD REJECT CUT TOOL   40000668   1999.04.10
68
   TNF   AP032   SOIC8W 3RD REJECT CUT TOOL   40000605   1998.05.31
69
   TNF   AP060   SSOP48(intel)LD AUTO F/S   40000844   2000.09.29
70
   TNF   AP043   SSOP48LD AUTO FORM   40000666   1999.04.10
71
   TNF   AP059   SSOP48LD AUTO TRIM   40000843   2000.09.29
72
   TNF   AP074   SSOP56LD AUTO FORM(AMD)   40002636   2001.12.30
73
   TNF   AP044   SSOP56LD AUTO TRIM   40000666   1999.04.10
74
   TNF   AP073   SSOP56LD AUTO TRIM (AMD)   40001892   2001.12.30
75
   TNF   AP084   TSSOP08LD AUTO FORM   40001962   2002.02.24
76
   TNF   AP083   TSSOP08LD AUTO TRIM   40001963   2002.02.24
77
   TNF   AP084   TSSOP14/16 3RD REJECT CUT TOOL   40001962   2002.02.24
78
   TNF   AP129   TSSOP14/16 FORM   40003206   2004.10.14
79
   TNF   AP084   TSSOP14/16LD AUTO FROM   40001962   2002.02.24
80
   TNF   AP083   TSSOP14LD AUTO TRIM   40001963   2002.02.24
81
   TNF   AP038   TSSOP20/24 3RD REJECT CUT TOOL   40000662   1999.03.31
82
   TNF   AP038   TSSOP20 AUTO FORM/SINGULATION   40000662   1999.03.31
83
   TNF   AP037   TSSOP20/24LD AUTO TRIM   40000660   1999.03.31
84
   TNF   AP084   TSSOP28LD AUTO FROM   40001962   2002.02.24
85
   TNF   AP083   TSSOP28LD AUTO TRIM   40001963   2002.02.24
86
   TNF   AP037   TSSOP30LD AUTO TRIM   40000660   1999.03.31
87
   TNF   AP128   SOIC08M FORM(EDP)   40003209   2004.10.20
88
   TNF   AP020   PD14LD IDF AUTO T/F SHUTTLE(roller)   40000362   1997.08.31
89
   TNF   AP038   TSSOP24/30LD AUTO FORM SINGULATION   40000662   1999.03.31
90
   TNF   AP130   TSSOP16LD AUTO TRIM   40003191   2004.09.16
1   TNF SYS   AUTO T/F SYSTEM   SO 24/28LD   40000224   1996.06.30
2   TNF SYS   AUTO T/F SYSTEM(PD8LD)   J036-444   40000134   2001.12.31
3   TNF SYS   AUTO T/F/S   SOIC 28LD   40000236   2001.12.31
4   TNF SYS   AUTO T/F SYSTEM   SO-8/14/16L   40000685   1999.04.10
5   TNF SYS   T/F SYSTEM-A   SO W16/20   40000331   1997.07.31
6   TNF SYS   T/F SYSTEM-A   PD-14L/D   40000362   1997.08.31
7   TNF SYS   T/F SYSTEM-A   PD-16L/D   40000363   1997.08.31
8   TNF SYS   AUTO TRIM SYSTEM   PLCC 32LD   40000424   1997.11.30
9   TNF SYS   AUTO FORM SYSTEM   SOIC 8/14/1   40000452   1997.12.31
10
   TNF SYS   AUTO FORM SYSTEM   SOIC 8/14/1   40000477   1997.12.31
11
   TNF SYS   AUTO TRIM SYSTEM   SOIC 8/14/1   40000479   1997.12.31
12
   TNF SYS   AUTO TRIM SYSTEM   SOIC 8/14/1   40000478   1997.12.31
13
   TNF SYS   AUTO TRIM SYSTEM   SOIC8LD   40000604   1998.05.31
14
   TNF SYS   AUTO FORM SYSTEM   SOIC8LD   40000605   1998.05.31
15
   TNF SYS   AUTO TRIM SYSTEM   TSSOP20/24L   40000660   1999.03.31
16
   TNF SYS   AUTO FORM SYSTEM   TSSOP20/24L   40000662   1999.03.31
17
   TNF SYS   TRIM FORM SYSTEM   M209 SOIC8L   40000668   1999.04.10
18
   TNF SYS   AUTO FORM SYSTEM   PLCC44LD   40000674   1999.04.10
19
   TNF SYS   AUTO TRIM SYSTEM   PLCC44LD   40000675   1999.04.10
20
   TNF SYS   AUTO FORM SYSTEM   PLCC84LD   40000678   2001.12.30
21
   TNF SYS   AUTO TRIM SYSTEM   PLCC84LD   40000680   1999.04.10
22
   TNF SYS   AUTO T/F SYSTEM   PDIP20LD   40000681   1999.04.10
23
   TNF SYS   TRIM FORM SYSTEM   SOIC8/14/16   40000257   1996.10.31
24
   TNF SYS   AUTO FORM SYSTEM   SOICW16/20   40000686   1999.04.10
25
   TNF SYS   AUTO TRIM SYSTEM   SOICW16/20   40000687   1999.04.10
26
   TNF SYS   TRIM/FORM SYSTEM   PDIP08LD   40000704   1999.11.30
27
   TNF SYS   TRIM/FORM SYSTEM   PDIP08LD   40000703   1999.11.30
28
   TNF SYS   ICT:AUTO TRIM EQUIP   SOIC W16/20   40001710   2001.07.29
29
   TNF SYS   ICT:AUTO FORM EQUIP   SOIC W16/20   40001711   2001.07.29
30
   TNF SYS   FORM SYSTEM WITH PARTS (450000   SH01,SE34,S   40001962   2002.02.24
31
   TNF SYS   TRIM SYSTEM WITH PARTS(4500003   SH01,SH02,S   40001963   2002.02.24
32
   TNF SYS   MP209 FORM/SING'SYSTEM FOR SOI   SOIC 14/16L   40002692   2003.10.21
33
   TNF SYS   TSSOP/MSOP FORM SYSTEM   AP131   40003190   2004.09.16
34
   TNF SYS   TSSOP/MSOP TORM SYSTEM   AP130   40003191   2004.09.16
35
   TNF SYS   MP209 FORM SYSTEM FOR SOIC 8LD   SOIC 8LD   40003209   2004.10.20
36
   TNF SYS   T/F FOR PD24/28   AVA0045Z   40000656   2000.12.30
37
   TNF SYS   A SET OF TRIM & MATRIX   SSOP48&56LD   40000666   1999.04.10
38
   TNF SYS   TRIM MANUAL PRESS       40001395   2000.11.30
39
   TNF SYS   FORM MANUAL PRESS       40001396   2000.11.30
40
   TNF SYS   FORM/SIGULATION FOR PLCC28       40001511   2000.11.15
41
   TNF SYS   TRIM FORM FOR PLCC 28       40001512   2000.11.15
42
   TNF SYS   SOIC8 MATRIX TRIM(PO2362)   MECHANICAL   40001592   2002.02.25
43
   TNF SYS   SOIC8 MATRIX FORM(PO2362)   MECHANICAL   40001593   2002.02.25
44
   TNF SYS   ICT-PDIP24 AUTO TRIM/FORM E   D9Z850715   40000656   2000.12.30
45
   TNF SYS   TRIM/FORM SYSTEM   PLCC20LD AUTO T/F   40000055   1996.10.31
46
   TNF SYS   AUTO FORM SYSTEM   PLCC32LD FORM   40000048   1998.12.31
47
   TNF SYS   TRIM/FORM SYSTEM   SOIC28(w)LD AUTO T/F   40000221   1996.05.31
48
   TNF SYS   AUTO FORM SYSTEM   SSOP56LD AUTO FORM(AMD)   40002636   2001.12.30
49
   TNF SYS   AUTO TRIM SYSTEM   SSOP56LD AUTO TRIM (AMD)   40001892   2001.12.30
50
   TNF SYS   AUTO FORM SYSTEM   SSOP48(intel)LD AUTO F/S   40000844   2000.09.29
51
   TNF SYS   AUTO FORM SYSTEM   SSOP48LD AUTO FORM   40000666   1999.04.10
52
   TNF SYS   AUTO TRIM SYSTEM   SSOP48LD AUTO TRIM   40000843   2000.09.29
53
   TNF SYS   TRIM/FORM SYSTEM   SO 24/28LD   40000606   1998.05.31
54
   TNF SYS   SOIC8 MATRIX TRIM   MECHANICAL   40000451   1997.12.30
55
   TNF SYS   TSSOP/MSOP FORM SYSTEM   AP129   40003206   2004.10.14

 

Table of Contents

                     
    Process   Equipment Name   Model Type   Asset No.   Capital date
                     
56
   TNF SYS   TRIM/FORM SYSTEM   PD40 TTT   40000140   1995.12.31
57
   TNF SYS   AUTO TRIM/FORM SYS.   PLCC32LD   40002507 /40002508   2003.05.25
58
   TNF SYS   AUTO TRIM FORM SYS   300MIL 20LD   40001599   1995.10.31
59
   TNF SYS   AUTO T/F SYS   14LD IDF   40001909   2001.10.26
0   XXXXX XXXXX   XXXXX XXXXXXX   XXX0000   40000453   1997.12.31
2   WAFER MOUNT   MANAUAL WAFER MOUNT SYSTEM   DT-MWM1230   40002053   2002.05.27
1   WIRE BOND   ICT:WIRE BONDER K&S1488   KnS 1488   40002117   2002.07.28
2   WIRE BOND   ICT:WIRE BONDER 1488(X0X000000   KnS 1488   40002122   2002.07.28
3   WIRE BOND   ICT:WIRE BONDER 1488(X0X000000   KnS 1488   40002196   2002.07.28
4   WIRE BOND   ICT:WIRE BONDER 1488(D9L970285   KnS 1488   40002171   2002.07.28
5   WIRE BOND   ICT:WIRE BONDER 1488(D9L970299   KnS 1488   40002183   2002.07.28
6   WIRE BOND   ICT:WIRE BONDER 1488(D9Y990059   KnS 1488   40002126   2002.07.28
7   WIRE BOND   ICT:WIRE BONDER 1488(D9Y990105   KnS 1488   40002129   2002.07.28
8   WIRE BOND   ICT:WIRE BONDER 1488(X0X000000   KnS 1488   40002295   2002.09.28
9   WIRE BOND   ICT:WIRE BONDER 1488(D9A970173   KnS 1488   40002243   2002.09.28
10
   WIRE BOND   ICT:WIRE BONDER   KnS 1488   40002287   2002.09.28
11
   WIRE BOND   ICT:WIRE BONDER   KnS 1488   40002141   2002.07.28
12
   WIRE BOND   ICT:WIRE BONDER   KnS 1488   40002145   2002.07.28
13
   WIRE BOND   ICT:WIRE BONDER   KnS 1488   40002547   2001.05.25
14
   WIRE BOND   ICT:WIRE BONDER   KnS 1488   40002270   2002.09.28
15
   WIRE BOND   ICT:WIRE BONDER   KnS 1488   40002269   2002.09.28
16
   WIRE BOND   ICT:WIRE BONDER   KnS 1488   40002258   2002.09.28
17
   WIRE BOND   ICT:WIRE BONDER   KnS 1488   40002543   2001.05.25
18
   WIRE BOND   ICT:WIRE BONDER   KnS 1488   40002559   2001.05.25
19
   WIRE BOND   ICT:WIRE BONDER   KnS 1488   40002165   2002.07.28
20
   WIRE BOND   ICT:WIRE BONDER   KnS 1488   40002140   2002.07.28
21
   WIRE BOND   ICT:WIRE BONDER   KnS 1488   40002556   2001.05.25
22
   WIRE BOND   ICT:WIRE BONDER   KnS 1488   40002560   2001.05.25
23
   WIRE BOND   ICT:WIRE BONDER   KnS 1488   40001795   2001.12.23
24
   WIRE BOND   ICT:WIRE BONDER   KnS 1488   40002144   2002.07.28
25
   WIRE BOND   ICT:WIRE BONDER   KnS 1488   40001687   2001.05.25
26
   WIRE BOND   ICT:WIRE BONDER   KnS 1488   40001788   2001.12.23
27
   WIRE BOND   ICT:WIRE BONDER   KnS 1488   40002149   2002.07.28
28
   WIRE BOND   ICT:WIRE BONDER   KnS 1488   40001783   2001.12.23
29
   WIRE BOND   ICT:WIRE BONDER   KnS 1488   40001792   2001.12.23
30
   WIRE BOND   ICT:WIRE BONDER   KnS 1488   40001790   2001.12.23
31
   WIRE BOND   ICT:WIRE BONDER   KnS 1488   40002160   2002.07.28
32
   WIRE BOND   ICT:WIRE BONDER   KnS 1488   40002553   2001.05.25
33
   WIRE BOND   ICT:WIRE BONDER   KnS 1488   40002548   2001.05.25
34
   WIRE BOND   ICT:WIRE BONDER   KnS 1488   40002146   2002.07.28
35
   WIRE BOND   ICT:WIRE BONDER   KnS 1488   40002139   2002.07.28
36
   WIRE BOND   ICT:WIRE BONDER   KnS 1488   40001787   2001.12.23
37
   WIRE BOND   ICT:WIRE BONDER   KnS 1488   40002191   2002.07.28
38
   WIRE BOND   ICT:WIRE BONDER   KnS 1488   40002535   2001.05.25
39
   WIRE BOND   ICT:WIRE BONDER K&S1488   KnS 1488   40001789   2001.12.23
40
   WIRE BOND   ICT:WIRE BONDER K&S1488   KnS 1488   40002552   2001.05.25
41
   WIRE BOND   ICT:WIRE BONDER K&S1488   KnS 1488   40002201   2002.07.28
42
   WIRE BOND   ICT:WIRE BONDER K&S1488   KnS 1488   40001794   2001.12.23
43
   WIRE BOND   ICT:WIRE BONDER K&S1488   KnS 1488   40002178   2002.07.28
44
   WIRE BOND   ICT:WIRE BONDER K&S1488   KnS 1488   40002198   2002.07.28
45
   WIRE BOND   ICT:WIRE BONDER K&S1488   KnS 1488   40002155   2002.07.28
46
   WIRE BOND   ICT:WIRE BONDER K&S1488   KnS 1488   40002137   2002.07.28
47
   WIRE BOND   ICT:WIRE BONDER K&S1488   KnS 1488   40002262   2002.09.28
1   WIRE BOND   ICT:WIRE BONDER   UTC-200   40000816   2000.06.30
2   WIRE BOND   ICT:WIRE BONDER   UTC-200   40000819   2000.06.30
3   WIRE BOND   ICT:WIRE BONDER   UTC-200   40000818   2000.06.30
4   WIRE BOND   WIRE BONDER   UTC-200   40000817   2000.06.30
5   WIRE BOND   WIRE BONDER   UTC-200   40000798   2000.06.30
6   WIRE BOND   WIRE BONDER   UTC-200   40000797   2000.06.30
7   WIRE BOND   WIRE BONDER   UTC-200   40000796   2000.06.30
8   WIRE BOND   WIRE BONDER   UTC-200   40000795   2000.06.30
9   WIRE BOND   WIRE BONDER   UTC-200   40002476   2003.04.26
10
   WIRE BOND   WIRE BONDER   UTC-200   40000800   2000.06.30
11
   WIRE BOND   WIRE BONDER   UTC-200   40000799   2000.06.30
12
   WIRE BOND   WIRE BONDER   UTC-200   40000807   2000.06.30
13
   WIRE BOND   WIRE BONDER   UTC-200   40000805   2000.06.30
14
   WIRE BOND   WIRE BONDER   UTC-200   40002477   2003.04.26
15
   WIRE BOND   WIRE BONDER   UTC-200   40000808   2000.06.30
16
   WIRE BOND   WIRE BONDER   UTC-200   40002478   2003.04.26
17
   WIRE BOND   WIRE BONDER   UTC-200   40000803   2000.06.30
18
   WIRE BOND   WIRE BONDER   UTC-200   40000806   2000.06.30
19
   WIRE BOND   WIRE BONDER   UTC-200   40000804   2000.06.30
20
   WIRE BOND   WIRE BONDER   UTC-200   40000812   2000.06.30
21
   WIRE BOND   WIRE BONDER   UTC-200   40000801   2000.06.30
22
   WIRE BOND   WIRE BONDER   UTC-200   40000810   2000.06.30
23
   WIRE BOND   WIRE BONDER   UTC-200   40000802   2000.06.30
24
   WIRE BOND   WIRE BONDER   UTC-200   40000811   2000.06.30
25
   WIRE BOND   WIRE BONDER&&   UTC-200   40000813   2000.06.30
26
   WIRE BOND   WIRE BONDER&&   UTC-200   40000814   2000.06.30

 

Table of Contents

                     
    Process   Equipment Name   Model Type   Asset No.   Capital date
                     
27
   WIRE BOND   WIRE BONDER&&   UTC-200   40000815   2000.06.30
28
   WIRE BOND   WIRE BONDER&&   UTC-200   40000809   2000.06.30
29
   WIRE BOND   INT-UTC-200 BI WIRE BONDER   UTC-200BI   40001605   1995.09.06
30
   WIRE BOND   INT-UTC-200 BI WIRE BONDER   UTC-200BI   40001606   1995.09.06
31
   WIRE BOND   INT-UTC-200 BI WIRE BONDER   UTC-200BI   40001607   1995.09.06
32
   WIRE BOND   INT-UTC-200 BI WIRE BONDER   UTC-200BI   40001604   1995.09.06
33
   WIRE BOND   INT-UTC-200 BI WIRE BONDER   UTC-200BI   40001624   1998.04.23
34
   WIRE BOND   INT-UTC-200 BI WIRE BONDER   UTC-200BI   40001615   1998.04.23
35
   WIRE BOND   INT-UTC-200 BI WIRE BONDER   UTC-200BI   40001616   1998.04.23
36
   WIRE BOND   INT-UTC-200 BI WIRE BONDER   UTC-200BI   40001618   1998.04.23
37
   WIRE BOND   INT-UTC-200 BI WIRE BONDER   UTC-200BI   40001622   1998.04.23
38
   WIRE BOND   INT-UTC-200 BI WIRE BONDER   UTC-200BI   40001621   1998.04.23
39
   WIRE BOND   INT-UTC-200 BI WIRE BONDER   UTC-200BI   40001620   1998.04.23
40
   WIRE BOND   INT-UTC-200 BI WIRE BONDER   UTC-200BI   40001619   1998.04.23
41
   WIRE BOND   INT-UTC-200 BI WIRE BONDER   UTC-200BI   40001630   1998.04.23
42
   WIRE BOND   INT-UTC-200 BI WIRE BONDER   UTC-200BI   40001631   1998.04.23
43
   WIRE BOND   INT-UTC-200 BI WIRE BONDER   UTC-200BI   40001617   1998.04.23
44
   WIRE BOND   INT-UTC-200 BI WIRE BONDER   UTC-200BI   40001625   1998.04.23
45
   WIRE BOND   INT-UTC-200 BI WIRE BONDER   UTC-200BI   40001623   1998.04.23
46
   WIRE BOND   INT-UTC-200 BI WIRE BONDER   UTC-200BI   40001627   1998.04.23
47
   WIRE BOND   INT-UTC-200 BI WIRE BONDER   UTC-200BI   40001611   1997.05.16
48
   WIRE BOND   INT-UTC-200 BI WIRE BONDER   UTC-200BI   40001626   1998.04.23
49
   WIRE BOND   INT-UTC-200 BI WIRE BONDER   UTC-200BI   40001629   1998.04.23
50
   WIRE BOND   INT-UTC-200 BI WIRE BONDER   UTC-200BI   40001614   1997.05.16
51
   WIRE BOND   INT-UTC-200 BI WIRE BONDER   UTC-200BI   40001613   1997.05.16
52
   WIRE BOND   INT-UTC-200 BI WIRE BONDER   UTC-200BI   40001628   1998.04.23
53
   WIRE BOND   INT-UTC-200 BI WIRE BONDER   UTC-200BI   40001612   1997.05.16
1   WIRE BOND   AUTO WIRE BONDER   UTC-250BI-S   40000534   1997.12.31
2   WIRE BOND   AUTO WIRE BONDER   UTC-250BI-S   40000531   1997.12.31
3   WIRE BOND   AUTO WIRE BONDER   UTC-250BI-S   40000532   1997.12.31
4   WIRE BOND   AUTO WIRE BONDER   UTC-250BI-S   40000533   1997.12.31
5   WIRE BOND   AUTO WIRE BONDER   UTC-250BI-S   40000535   1997.12.31
6   WIRE BOND   AUTO WIRE BONDER   UTC-250BI-S   40000536   1997.12.31
7   WIRE BOND   AUTO WIRE BONDER   UTC-250BI-S   40000540   1997.12.31
8   WIRE BOND   AUTO WIRE BONDER   UTC-250BI-S   40000537   1997.12.31
9   WIRE BOND   AUTO WIRE BONDER   UTC-250BI-S   40000538   1997.12.31
10
   WIRE BOND   WIRE BONDER-A   UTC250BI-SU   40000501   1997.12.31
11
   WIRE BOND   WIRE BONDER-A   UTC250BI-SU   40000502   1997.12.31
12
   WIRE BOND   WIRE BONDER-A   UTC250BI-SU   40000503   1997.12.31
13
   WIRE BOND   WIRE BONDER-A   UTC250BI-SU   40000504   1997.12.31
14
   WIRE BOND   WIRE BONDER-A   UTC250BI-SU   40000505   1997.12.31
15
   WIRE BOND   WIRE BONDER-A   UTC250BI-SU   40000506   1997.12.31
16
   WIRE BOND   WIRE BONDER-A   UTC250BI-SU   40000507   1997.12.31
17
   WIRE BOND   WIRE BONDER-A   UTC250BI-SU   40000508   1997.12.31
18
   WIRE BOND   WIRE BONDER-A   UTC250BI-SU   40000509   1997.12.31
19
   WIRE BOND   WIRE BONDER-A   UTC250BI-SU   40000510   1997.12.31
20
   WIRE BOND   WIRE BONDER-A   UTC250BI-SU   40000511   1997.12.31
21
   WIRE BOND   WIRE BONDER-A   UTC250BI-SU   40000512   1997.12.31
22
   WIRE BOND   WIRE BONDER-A   UTC250BI-SU   40000513   1997.12.31
23
   WIRE BOND   WIRE BONDER-A   UTC250BI-SU   40000514   1997.12.31
24
   WIRE BOND   WIRE BONDER-A   UTC250BI-SU   40000515   1997.12.31
25
   WIRE BOND   WIRE BONDER-A   UTC250BI-SU   40000517   1997.12.31
26
   WIRE BOND   WIRE BONDER-A   UTC250BI-SU   40000518   1997.12.31
27
   WIRE BOND   WIRE BONDER-A   UTC250BI-SU   40000516   1997.12.31
28
   WIRE BOND   WIRE BONDER-A   UTC250BI-SU   40000519   1997.12.31
29
   WIRE BOND   WIRE BONDER-A   UTC250BI-SU   40000520   1997.12.31
30
   WIRE BOND   WIRE BONDER-A   UTC250BI-SU   40000521   1997.12.31
31
   WIRE BOND   WIRE BONDER-A   UTC250BI-SU   40000522   1997.12.31
32
   WIRE BOND   WIRE BONDER-A   UTC250BI-SU   40000523   1997.12.31
33
   WIRE BOND   WIRE BONDER-A   UTC250BI-SU   40000524   1997.12.31
34
   WIRE BOND   WIRE BONDER-A   UTC250BI-SU   40000525   1997.12.31
35
   WIRE BOND   WIRE BONDER-A   UTC250BI-SU   40000526   1997.12.31
36
   WIRE BOND   WIRE BONDER-A   UTC250BI-SU   40000527   1997.12.31
37
   WIRE BOND   WIRE BONDER-A   UTC250BI-SU   40000528   1997.12.31
38
   WIRE BOND   WIRE BONDER-A   UTC250BI-SU   40000529   1997.12.31
39
   WIRE BOND   WIRE BONDER-A   UTC250BI-SU   40000530   1997.12.31
40
   WIRE BOND   WIRE BONDER-A   UTC-250BI-S   40000539   1997.12.31
41
   WIRE BOND   WIRE BONDER-A   UTC-250BI-S   40000390   1997.10.31
42
   WIRE BOND   WIRE BONDER-A   UTC-250BI-S   40000391   1997.10.31
43
   WIRE BOND   WIRE BONDER-A   UTC-250BI-S   40000392   1997.10.31
44
   WIRE BOND   WIRE BONDER-A   UTC-250BI-S   40000393   1997.10.31
45
   WIRE BOND   WIRE BONDER-A   UTC-250BI-S   40000394   1997.10.31
46
   WIRE BOND   WIRE BONDER-A   UTC-250BI-S   40000395   1997.10.31
47
   WIRE BOND   WIRE BONDER-A   UTC-250BI-S   40000396   1997.10.31
48
   WIRE BOND   WIRE BONDER-A   UTC-250BI   40000541   1997.12.31
49
   WIRE BOND   WIRE BONDER-A   UTC-250BI   40000542   1997.12.31
50
   WIRE BOND   WIRE BONDER-A   UTC-250BI   40000543   1997.12.31
51
   WIRE BOND   WIRE BONDER-A   UTC-250BI   40000544   1997.12.31
52
   WIRE BOND   WIRE BONDER-A   UTC-250BI   40000545   1997.12.31

 

Table of Contents

                     
    Process   Equipment Name   Model Type   Asset No.   Capital date
                     
53
   WIRE BOND   WIRE BONDER-A   UTC-250BI   40000546   1997.12.31
54
   WIRE BOND   WIRE BONDER-A   UTC-250BI   40000547   1997.12.31
55
   WIRE BOND   WIRE BONDER-A   UTC-250BI   40000548   1997.12.31
56
   WIRE BOND   WIRE BONDER-A   UTC-250BI   40000549   1997.12.31
57
   WIRE BOND   WIRE BONDER-A   UTC-250BI   40000550   1997.12.31
58
   WIRE BOND   WIRE BONDER-A   UTC-250BI   40000551   1997.12.31
59
   WIRE BOND   WIRE BONDER   UTC-250   40001832   2001.12.23
60
   WIRE BOND   WIRE BONDER   UTC-250   40001862   2001.12.23
61
   WIRE BOND   WIRE BONDER   UTC-250   40002497   2003.04.26
62
   WIRE BOND   WIRE BONDER   UTC-250   40000746   2000.01.30
63
   WIRE BOND   WIRE BONDER   UTC-250   40000744   2000.01.30
64
   WIRE BOND   WIRE BONDER   UTC-250   40000745   2000.01.30
65
   WIRE BOND   WIRE BONDER   UTC-250   40000747   2000.01.30
66
   WIRE BOND   WIRE BONDER   UTC-250   40001855   2001.12.23
67
   WIRE BOND   WIRE BONDER   UTC-250   40002494   2003.04.26
68
   WIRE BOND   WIRE BONDER   UTC-250   40000713   1999.11.30
69
   WIRE BOND   WIRE BONDER   UTC-250   40000714   1999.11.30
70
   WIRE BOND   WIRE BONDER   UTC-250   40000715   1999.11.30
71
   WIRE BOND   WIRE BONDER   UTC-250   40000716   1999.11.30
72
   WIRE BOND   WIRE BONDER   UTC-250   40000717   1999.11.30
73
   WIRE BOND   WIRE BONDER   UTC-250   40000718   1999.11.30
74
   WIRE BOND   WIRE BONDER   UTC-250   40000719   1999.11.30
75
   WIRE BOND   WIRE BONDER   UTC-250   40000720   1999.11.30
76
   WIRE BOND   WIRE BONDER   UTC-250   40000721   1999.12.30
77
   WIRE BOND   WIRE BONDER   UTC-250   40000722   1999.12.30
78
   WIRE BOND   WIRE BONDER   UTC-250   40000723   1999.12.30
79
   WIRE BOND   WIRE BONDER   UTC-250   40000724   1999.12.30
80
   WIRE BOND   WIRE BONDER   UTC-250   40000725   1999.12.30
81
   WIRE BOND   WIRE BONDER   UTC-250   40000726   1999.12.30
82
   WIRE BOND   WIRE BONDER   UTC-250   40002481   2003.04.26
83
   WIRE BOND   WIRE BONDER   UTC-250   40002487   2003.04.26
84
   WIRE BOND   WIRE BONDER   UTC-250   40002480   2003.04.26
85
   WIRE BOND   WIRE BONDER   UTC-250   40000727   1999.12.30
86
   WIRE BOND   WIRE BONDER   UTC-250   40000728   1999.12.30
87
   WIRE BOND   WIRE BONDER   UTC-250   40000729   1999.12.30
88
   WIRE BOND   WIRE BONDER   UTC-250   40000730   2000.01.30
89
   WIRE BOND   WIRE BONDER   UTC-250   40000731   2000.01.30
90
   WIRE BOND   WIRE BONDER   UTC-250   40000732   2000.01.30
91
   WIRE BOND   WIRE BONDER   UTC-250   40000733   2000.01.30
92
   WIRE BOND   WIRE BONDER   UTC-250   40000734   2000.01.30
93
   WIRE BOND   WIRE BONDER   UTC-250   40000735   2000.01.30
94
   WIRE BOND   WIRE BONDER   UTC-250   40000736   2000.01.30
95
   WIRE BOND   WIRE BONDER   UTC-250   40000737   2000.01.30
96
   WIRE BOND   WIRE BONDER   UTC-250   40000738   2000.01.30
97
   WIRE BOND   WIRE BONDER   UTC-250   40000739   2000.01.30
98
   WIRE BOND   WIRE BONDER   UTC-250   40000740   2000.01.30
99
   WIRE BOND   WIRE BONDER   UTC-250BI   40000552   1997.12.31
100
   WIRE BOND   WIRE BONDER   UTC-250BI   40002820   2004.02.21
101
   WIRE BOND   ICT:WIRE BONDER (D9Z96)   UTC-250   40002491   2003.04.26
102
   WIRE BOND   ICT:WIRE BONDER (D9Z96)   UTC-250   40002488   2003.04.26
103
   WIRE BOND   ICT:WIRE BONDER (D9Z96)   UTC-250   40002489   2003.04.26
104
   WIRE BOND   ICT:WIRE BONDER (D9A97)   UTC-250   40000741   2000.01.30
105
   WIRE BOND   ICT:WIRE BONDER (D9A97)   UTC-250   40000742   2000.01.30
106
   WIRE BOND   ICT:WIRE BONDER (D9A97)   UTC-250   40000743   2000.01.30
107
   WIRE BOND   ICT:WIRE BONDER (D9A97)   UTC-250   40000748   2000.01.30
108
   WIRE BOND   ICT:WIRE BONDER (D9A97)   UTC-250   40000749   2000.01.30
109
   WIRE BOND   ICT:WIRE BONDER (D9A97)   UTC-250   40000750   2000.01.30
110
   WIRE BOND   ICT:WIRE BONDER (D9A97)   UTC-250   40000751   2000.01.30
111
   WIRE BOND   ICT:WIRE BONDER (D9A97)   UTC-250   40000752   2000.01.30
112
   WIRE BOND   ICT:WIRE BONDER (D9A97)   UTC-250   40000753   2000.01.30
113
   WIRE BOND   ICT:WIRE BONDER (D9A97)   UTC-250   40001833   2001.12.23
114
   WIRE BOND   ICT:WIRE BONDER (D9A97)   UTC-250   40001848   2001.12.23
115
   WIRE BOND   ICT:WIRE BONDER (D9A97)   UTC-250   40001861   2001.12.23
116
   WIRE BOND   ICT:WIRE BONDER (D9A97)   UTC-250   40001857   2001.12.23
117
   WIRE BOND   ICT:WIRE BONDER (D9A97)   UTC-250   40001838   2001.12.23
118
   WIRE BOND   ICT:WIRE BONDER (D9A97)   UTC-250   40001860   2001.12.23
119
   WIRE BOND   ICT:WIRE BONDER (D9A97)   UTC-250   40001858   2001.12.23
120
   WIRE BOND   ICT:WIRE BONDER (D9A97)   UTC-250   40001851   2001.12.23
121
   WIRE BOND   ICT:WIRE BONDER (D9A97)   UTC-250   40001840   2001.12.23
122
   WIRE BOND   ICT:WIRE BONDER (D9A97)   UTC-250   40001853   2001.12.23
123
   WIRE BOND   ICT:WIRE BONDER (D9A97)   UTC-250   40001846   2001.12.23
124
   WIRE BOND   ICT:WIRE BONDER (D9A97)   UTC-250   40002498   2003.04.26
125
   WIRE BOND   ICT:WIRE BONDER (D9A97)   UTC-250   40000754   2000.01.30
126
   WIRE BOND   ICT:WIRE BONDER (D9A97)   UTC-250   40002493   2003.04.26
127
   WIRE BOND   ICT:WIRE BONDER (D9A97)   UTC-250   40002479   2003.04.26
128
   WIRE BOND   ICT:WIRE BONDER (D9A97)   UTC-250   40002483   2003.04.26
129
   WIRE BOND   ICT:WIRE BONDER (D9A97)   UTC-250   40002496   2003.04.26
130
   WIRE BOND   ICT:WIRE BONDER (D9A97)   UTC-250   40002495   2003.04.26
131
   WIRE BOND   ICT:WIRE BONDER   UTC-250   40002482   2003.04.26

 

Table of Contents

                     
    Process   Equipment Name   Model Type   Asset No.   Capital date
                     
132
   WIRE BOND   ICT:WIRE BONDER   UTC-250   40002500   2003.04.26
133
   WIRE BOND   ICT:WIRE BONDER   UTC-250   40002486   2003.04.26
134
   WIRE BOND   ICT:WIRE BONDER   UTC-250   40001845   2001.12.23
135
   WIRE BOND   ICT:WIRE BONDER   UTC-250   40001841   2001.12.23
136
   WIRE BOND   ICT:WIRE BONDER   UTC-250   40001826   2001.12.23
137
   WIRE BOND   ICT:WIRE BONDER   UTC-250   40001823   2001.12.23
138
   WIRE BOND   ICT:WIRE BONDER   UTC-250   40001844   2001.12.23
139
   WIRE BOND   ICT:WIRE BONDER   UTC-250   40001825   2001.12.23
140
   WIRE BOND   ICT:WIRE BONDER   UTC-250   40001842   2001.12.23
141
   WIRE BOND   ICT:WIRE BONDER   UTC-250   40001828   2001.12.23
142
   WIRE BOND   ICT:WIRE BONDER   UTC-250   40002499   2003.04.26
143
   WIRE BOND   ICT:WIRE BONDER   UTC-250   40002484   2003.04.26
144
   WIRE BOND   ICT:WIRE BONDER   UTC-250   40001839   2001.12.23
145
   WIRE BOND   ICT:WIRE BONDER   UTC-250   40001829   2001.12.23
146
   WIRE BOND   ICT:WIRE BONDER   UTC-250   40001830   2001.12.23
147
   WIRE BOND   ICT:WIRE BONDER   UTC-250   40001837   2001.12.23
148
   WIRE BOND   ICT:WIRE BONDER   UTC-250   40001850   2001.12.23
149
   WIRE BOND   ICT:WIRE BONDER   UTC-250   40001827   2001.12.23
150
   WIRE BOND   ICT:WIRE BONDER   UTC-250   40001824   2001.12.23
151
   WIRE BOND   ICT:WIRE BONDER   UTC-250   40001831   2001.12.23
152
   WIRE BOND   ICT:WIRE BONDER   UTC-250   40002490   2003.04.26
153
   WIRE BOND   ICT:WIRE BONDER   UTC-250   40002787   2004.01.19
154
   WIRE BOND   ICT:WIRE BONDER   UTC-250   40002789   2004.01.19
155
   WIRE BOND   ICT:WIRE BONDER   UTC-250   40002788   2004.01.19
156
   WIRE BOND   ICT:WIRE BONDER   UTC-250   40002784   2004.01.19
157
   WIRE BOND   ICT:WIRE BONDER   UTC-250   40002791   2004.01.19
158
   WIRE BOND   ICT:WIRE BONDER   UTC-250   40002790   2004.01.19
159
   WIRE BOND   ICT:WIRE BONDER   UTC-250   40002786   2004.01.19
160
   WIRE BOND   ICT:WIRE BONDER   UTC-250   40002785   2004.01.19
161
   WIRE BOND   ICT:WIRE BONDER   UTC-250BI   40002818   2004.02.21
162
   WIRE BOND   ICT:WIRE BONDER   UTC-250BI   40000781   2000.05.28
163
   WIRE BOND   ICT:WIRE BONDER   UTC-250BI   40000780   2000.05.28
164
   WIRE BOND   ICT:WIRE BONDER   UTC-250BI   40002821   2004.02.21
165
   WIRE BOND   ICT:WIRE BONDER   UTC-250BI   40002825   2004.02.21
166
   WIRE BOND   ICT:WIRE BONDER   UTC-250BI   40002824   2004.02.21
167
   WIRE BOND   ICT:WIRE BONDER   UTC-250BI   40002822   2004.02.21
168
   WIRE BOND   ICT:WIRE BONDER   UTC-250BI   40002823   2004.02.21
169
   WIRE BOND   WIRE BONDER-A   UTC-250BI   40002819   2004.02.21
1   WIRE BOND   ICT:WIRE BONDER   KnS 8028   40002900   2004.03.27
2   WIRE BOND   ICT:WIRE BONDER   KnS 8028   40002906   2004.03.27
3   WIRE BOND   ICT:WIRE BONDER   KnS 8028   40002904   2004.03.27
4   WIRE BOND   ICT:WIRE BONDER   KnS 8028   40002902   2004.03.27
5   WIRE BOND   ICT:WIRE BONDER   KnS 8028   40002905   2004.03.27
6   WIRE BOND   ICT:WIRE BONDER   KnS 8028   40003058   2004.06.27
7   WIRE BOND   ICT:WIRE BONDER   KnS 8028   40003061   2004.06.27
8   WIRE BOND   ICT:WIRE BONDER   KnS 8028   40003062   2004.06.27
9   WIRE BOND   ICT:WIRE BONDER   KnS 8028   40003057   2004.06.27
10
   WIRE BOND   ICT:WIRE BONDER   KnS 8028   40003056   2004.06.27
11
   WIRE BOND   ICT:WIRE BONDER   KnS 8028   40003141   2004.07.23
12
   WIRE BOND   ICT:WIRE BONDER   KnS 8028   40003132   2004.07.23

 

Table of Contents

TRANSFERRED TEST EQUIPMENT SUMMARY
                                     
TYPE   PLATFORM   Out-Total   CORE   EXCESS   S/D
                     
TESTER
  A360     12       4       4       4  
TESTER
  A5XX     5       3       2       0  
TESTER
  ASL1000     4       3       1       0  
TESTER
  DUO     2       2       0       0  
TESTER
  EPRO     44       35       0       9  
TESTER
  ETS300     2       1       1       0  
TESTER
  ETS300_TI     3       0       2       1  
TESTER
  ETS364     5       5       0       0  
TESTER
  HP94XX     13       10       2       1  
TESTER
  J750     3       3       0       0  
TESTER
  LTX77     21       12       9       0  
TESTER
  M3650     3       2       1       0  
TESTER
  MAGNUM     1       1       0       0  
TESTER
  MAVERICK PT     1       1       0       0  
TESTER
  Q2/62     9       3       1       5  
TESTER
  SENTRY     3       0       0       3  
TESTER
  VISTA     6       3       2       1  
 
                                    
TESTER TOTAL
        137       88       25       24  
 
                                    
HANDLER
  AAT     6       0       1       5  
XXXXXXX
  XXX0000     8       3       1       4  
XXXXXXX
  XXX0000     8       1       0       7  
HANDLER
  AESCO     6       0       2       4  
HANDLER
  ASM     3       3       0       0  
HANDLER
  KUWANO     10       8       0       2  
HANDLER
  MCT     43       18       11       14  
HANDLER
  SESSCO     14       4       1       9  
HANDLER
  XXXXX     20       17       3       0  
HANDLER
  SYMTEK     6       1       0       5  
HANDLER
  TESEC     10       0       0       10  
HANDLER
  TB150     1       0       0       1  
HANDLER
  MH802     2       0       0       2  
HANDLER
  MT93XX     24       20       4       0  
HANDLER
  MT8589     2       2       0       0  
HANDLER
  MT8588     3       0       2       1  
HANDLER
  MT99XX     6       4       2       0  
 
                                    
HANDLER TOTAL
        172       81       27       64  
 
                                    
GRAND TOTAL
        309       169       52       88  

 

Table of Contents

SCC Tester Review-Out
                                 
NO   Platform   Asset   Device   Arrived at SCC   Vendor   CORE   Excess   S/D
1   A360   40001349   ANALOG   00.10.6   TERADYNE       EXCESS    
2   A360   40001350   ANALOG   00.10.6   TERADYNE       EXCESS    
3   A360   40001351   ANALOG   00.10.6   TERADYNE           S/D
4   A360   40001352   ANALOG   00.10.6   TERADYNE       EXCESS    
5   A360   40001353   ANALOG   00.10.6   TERADYNE   CORE        
6   A360   40001348   ANALOG   03.04.11   TERADYNE   CORE        
7   A360   40002586   ANALOG   03.6.11   TERADYNE   CORE        
8   A360   40002587   ANALOG   03.6.11   TERADYNE       EXCESS    
9   A360   40002585   ANALOG   03.6.11   TERADYNE   CORE        
10   A360   40002772   ANALOG   03.11.27   TERADYNE           S/D
11   A360   40002773   ANALOG   03.11.27   TERADYNE           S/D
12   A360       ANALOG   04.3.22   TERADYNE           S/D
A360 Count   12                   4   4   4
13   A5XX   40002923   ANALOG   04.3.12   TERADYNE       EXCESS    
14   A5XX   40002924   ANALOG   04.3.25   TERADYNE       EXCESS    
15   A5XX   40002219   ANALOG   02.8.22   TERADYNE   CORE        
16   A5XX   40002220   ANALOG   02.8.22   TERADYNE   CORE        
17   A5XX   40002965   ANALOG   04.4.2   TERADYNE   CORE        
A5XX Count   5                   3   2   0
18   ASL1000   40000755   ANALOG   99.11.7   CREDENCE   CORE        
19   ASL1000   40000756   ANALOG   99.11.7   CREDENCE   CORE        
20   ASL1000   40002607   ANALOG   02.5.17   CREDENCE   CORE        
21   ASL1000   40002606   ANALOG   02.5.17   CREDENCE       EXCESS    
ASL1000 Count   4                   3   1   0
22   DUO   40002642   ANALOG   03.9.4   CREDENCE   CORE        
23   DUO   40003073   ANALOG   04.2.2   CREDENCE   CORE        
DUO Count   2                   2   0   0
24   EPRO   40000286   MEMORY   97.3.14   CREDENCE   CORE        
25   EPRO   40000287   MEMORY   97.3.14   CREDENCE   CORE        
26   EPRO   40000293   MEMORY   97.3.14   CREDENCE   CORE        
27   EPRO   40000294   MEMORY   97.3.14   CREDENCE   CORE        
28   EPRO   40000295   MEMORY   97.3.14   CREDENCE   CORE        
29   EPRO   40000291   MEMORY   97.3.21   CREDENCE           S/D
30   EPRO   40000290   MEMORY   97.3.21   CREDENCE   CORE        
31   EPRO   40000289   MEMORY   97.11.4   CREDENCE   CORE        
32   EPRO   40000296   MEMORY   97.11.4   CREDENCE   CORE        
33   EPRO   40000288   MEMORY   97.11.4   CREDENCE   CORE        
34   EPRO   40001020   MEMORY   98.9.25   CREDENCE   CORE        
35   EPRO   40000416   MEMORY   98.9.25   CREDENCE   CORE        
36   EPRO   40000417   MEMORY   98.9.25   CREDENCE   CORE        
37   EPRO   40000418   MEMORY   98.9.25   CREDENCE   CORE        
38   EPRO   40000419   MEMORY   98.9.25   CREDENCE   CORE        
39   EPRO   40000420   MEMORY   98.9.25   CREDENCE   CORE        
40   EPRO   40000761   MEMORY   00.2.18   CREDENCE   CORE        
41   EPRO   40000762   MEMORY   00.2.18   CREDENCE   CORE        
42   EPRO   40000763   MEMORY   00.2.18   CREDENCE   CORE        
43   EPRO   40000764   MEMORY   00.2.18   CREDENCE           S/D
44   EPRO   40000765   MEMORY   00.2.18   CREDENCE           S/D
45   EPRO   40000766   MEMORY   00.2.18   CREDENCE   CORE        
46   EPRO   40000767   MEMORY   00.2.18   CREDENCE           S/D
47   EPRO   40000768   MEMORY   00.2.18   CREDENCE   CORE        
48   EPRO   40001031   MEMORY   00.9.14   CREDENCE           S/D
49   EPRO   40001034   MEMORY   00.9.14   CREDENCE           S/D
50   EPRO   40001032   MEMORY   00.9.21   CREDENCE   CORE        
51   EPRO   40001033   MEMORY   00.9.21   CREDENCE   CORE        
52   EPRO   40001035   MEMORY   00.9.21   CREDENCE   CORE        
53   EPRO   40001037   MEMORY   00.9.21   CREDENCE   CORE        
54   EPRO   40001038   MEMORY   00.9.21   CREDENCE   CORE        

 

Table of Contents

                                 
NO   Platform   Asset   Device   Arrived at SCC   Vendor   CORE   Excess   S/D
55   EPRO   40000654   MEMORY   00.9.21   CREDENCE   CORE        
56   EPRO   40000655   MEMORY   00.9.21   CREDENCE           S/D
57   EPRO   40001004   MEMORY   97.3.19   CREDENCE   CORE        
58   EPRO   40001005   MEMORY   97.3.19   CREDENCE   CORE        
59   EPRO   40001006   MEMORY   97.7.28   CREDENCE           S/D
60   EPRO   40001007   MEMORY   97.12.4   CREDENCE   CORE        
61   EPRO   40001008   MEMORY   97.12.4   CREDENCE   CORE        
62   EPRO   40001014   MEMORY   98.2.27   CREDENCE           S/D
63   EPRO   40001015   MEMORY   98.2.27   CREDENCE   CORE        
64   EPRO   40001016   MEMORY   98.9.25   CREDENCE   CORE        
65   EPRO   40001017   MEMORY   98.9.25   CREDENCE   CORE        
66   EPRO   40001018   MEMORY   98.9.25   CREDENCE   CORE        
67   EPRO   40001019   MEMORY   98.9.25   CREDENCE   CORE        
EPRO Count   44                   35   0   9
68   ETS300   40002892   ANALOG   04.3.5   EAGLE       EXCESS    
69   ETS300   40003249   ANALOG   04.6.23   EAGLE   CORE        
ETS300 Count   2                   1   1   0
70   ETS300_TI   40002810   ANALOG   03.12.4   EAGLE           S/D
71   ETS300_TI   40003254   ANALOG   04.6.23   EAGLE       EXCESS    
72   ETS300_TI   40003148   ANALOG   04.7.22   EAGLE       EXCESS    
ETS300_TI Count   3                   0   2   1
73   ETS364   40002605   ANALOG   02.12.17   EAGLE   CORE        
74   ETS364   40002589   ANALOG   03.4.25   EAGLE   CORE        
75   ETS364   40002686   ANALOG   03.5.9   EAGLE   CORE        
76   ETS364   40002685   ANALOG   03.5.9   EAGLE   CORE        
77   ETS364   40002687   ANALOG   03.5.29   EAGLE   CORE        
ETS364 Count   5                   5   0   0
78   HP94XX   40002735   ANALOG   03.8.28   AGILENT       EXCESS    
79   HP94XX   40002736   ANALOG   03.9.23   AGILENT   CORE        
80   HP94XX   40002737   ANALOG   03.9.23   AGILENT   CORE        
81   HP94XX   40002738   ANALOG   03.9.23   AGILENT   CORE        
82   HP94XX   40002734   ANALOG   03.11.25   AGILENT   CORE        
83   HP94XX   40002733   ANALOG   03.11.25   AGILENT   CORE        
84   HP94XX   40003075   ANALOG   04.2.2   AGILENT           S/D
85   HP94XX   40003077   ANALOG   04.2.16   AGILENT   CORE        
86   HP94XX   40003076   ANALOG   04.2.16   AGILENT   CORE        
87   HP94XX   40003078   ANALOG   04.2.20   AGILENT   CORE        
88   HP94XX   40003222   ANALOG   04.7.29   AGILENT   CORE        
89   HP94XX   40003223   ANALOG   04.9.9   AGILENT   CORE        
90   HP94XX   40003221   ANALOG   04.11.2   AGILENT       EXCESS    
HP94XX Count   13                   10   2   1
91   J750   40003210   ANALOG   04.7.12   TERADYNE   CORE        
92   J750   40003251   ANALOG   04.11.8   TERADYNE   CORE        
93   J750   40003353   ANALOG   05.3.15   TERADYNE   CORE        
J750 Count   3                   3   0   0
94   LTX77   40001359   ANALOG   00.10.6   LTX       EXCESS    
95   LTX77   40001364   ANALOG   00.10.6   LTX       EXCESS    
96   LTX77   40001358   ANALOG   00.10.6   LTX   CORE        
97   LTX77   40001356   ANALOG   00.10.6   LTX       EXCESS    
98   LTX77   40001355   ANALOG   00.10.6   LTX   CORE        
99   LTX77   40001365   ANALOG   00.10.6   LTX       EXCESS    
100   LTX77   40001363   ANALOG   00.10.6   LTX   CORE        
101   LTX77   40001360   ANALOG   00.10.6   LTX       EXCESS    
102   LTX77   40001947   ANALOG   02.2.1   LTX   CORE        
103   LTX77   40001943   ANALOG   02.2.1   LTX       EXCESS    
104   LTX77   40001944   ANALOG   02.2.1   LTX       EXCESS    
105   LTX77   40001945   ANALOG   02.2.1   LTX       EXCESS    
106   LTX77   40001946   ANALOG   02.2.1   LTX       EXCESS    
107   LTX77   40002239   ANALOG   02.9.4   LTX   CORE        
108   LTX77   40002584   ANALOG   03.6.6   LTX   CORE        

 

Table of Contents

                                 
NO   Platform   Asset   Device   Arrived at SCC   Vendor   CORE   Excess   S/D
109   LTX77   40002582   ANALOG   03.6.6   LTX   CORE        
110   LTX77   40002973   ANALOG   04.4.28   LTX   CORE        
111   LTX77   40003119   ANALOG   04.7.8   LTX   CORE        
112   LTX77   40003170   ANALOG   04.8.23   LTX   CORE        
113   LTX77   40003171   ANALOG   04.8.23   LTX   CORE        
114   LTX77   40003211   ANALOG   04.11.12   LTX   CORE        
LTX77 Count   21                   12   9   0
115   M3650   40003354   MIX   00.2.16   CREDENCE       EXCESS    
116   M3650   40001863   MIX   01.12.18   CREDENCE   CORE        
117   M3650   40003363   MIX   05.4.28   CREDENCE   CORE        
M3650 Count   3                   2   1   0
118   MAGNUM   NA   DIGITAL   05.6.6   NEXTEST   CORE        
MAGNUM Count   1                   1   0   0
119   MAVERICK PT   40003307   DIGITAL   04.6.8   NEXTEST   CORE        
MAVERICK PT Count   1                   1   0   0
120   Q2/62   40001897   LOGIC   01.6.11   MEGATEST       EXCESS    
121   Q2/62   40002567   LOGIC   01.6.11   MEGATEST   CORE        
122   Q2/62   40001869   LOGIC   01.12.18   MEGATEST           S/D
123   Q2/62   40001874   LOGIC   01.12.18   MEGATEST           S/D
124   Q2/62   40001872   LOGIC   01.12.18   MEGATEST           S/D
125   Q2/62   40001873   LOGIC   01.12.18   MEGATEST           S/D
126   Q2/62   40001868   LOGIC   01.12.18   MEGATEST   CORE        
127   Q2/62   40001865   LOGIC   01.12.18   MEGATEST           S/D
128   Q2/62   40001866   LOGIC   01.12.18   MEGATEST   CORE        
Q2/62 Count   9                   3   1   5
129   SENTRY   40002238   DIGITAL   02.9.4   SCHLUMBERGER           S/D
130   SENTRY   40001876   DIGITAL   01.12.18   SCHLUMBERGER           S/D
131   SENTRY   40001877   DIGITAL   01.12.18   SCHLUMBERGER           S/D
SENTRY Count   3                   0   0   3
132   VISTA   40002729   DIGITAL   03.8.6   CREDENCE   CORE        
133   VISTA   40002728   DIGITAL   03.8.14   CREDENCE           S/D
134   VISTA   40002730   DIGITAL   03.9.23   CREDENCE   CORE        
135   VISTA   40002726   DIGITAL   03.9.23   CREDENCE       EXCESS    
136   VISTA   40002727   DIGITAL   03.11.25   CREDENCE       EXCESS    
137   VISTA   40003074   DIGITAL   04.2.16   CREDENCE   CORE        
VISTA Count   6                   3   2   1
                                 
Grand Count   137                   88   25   24

 

Table of Contents

SCC Handler Review -Out
                                     
    Platform                                
NO   (Sum)   Module   Asset   Device   Arrived at SCC   Vendor   CORE   Excess   S/D
1   AAT   AAT   40002092   SOIC 150mil   02.5.10   AAT           S/D
2   AAT   AAT   40003387   SOIC 150mil   05.9.24   AAT       Excess    
3   AAT   AAT   40001516   LGA 5*8   01.6.16   AAT           S/D
4   AAT   AAT   40001581   LGA 5*8   01.10.25   AAT           S/D
5   AAT   AAT   40001582   LGA 5*8   01.12.6   AAT           S/D
6   AAT   AAT   40002347   SOIC 150mil   02.8.5   AAT           S/D
AAT Count   6                       0   1   5
7   AET5050   AETRIUM 5050T   40002744   SSOP 208mil   03.9.3   AETRIUM   CORE        
8   AET5050   AETRIUM 5050T   40003082   SOIC 300mil   03.9.18   AETRIUM   CORE        
9   AET5050   AETRIUM 5050T   40002745   SOIC 300mil   03.11.25   AETRIUM   CORE        
10   AET5050   AETRIUM 5050T   40002869   SSOP 208mil   04.4.14   AETRIUM       Excess    
11   AET5050   AETRIUM 5050T   40003227   SOIC 300mil   04.10.6   AETRIUM           S/D
12   AET5050   AETRIUM 5050T   40002743   SOIC 300mil   04.2.3   AETRIUM           S/D
13   AET5050   AETRIUM 5050T   40002868   SOIC 300mil   04.2.9   AETRIUM           S/D
14   AET5050   AETRIUM 5050T   40003226   SOIC 300mil   04.11.2   AETRIUM           S/D
AET5050 Count   8                       3   1   4
15   AET3300   AETRIUM 3300   40002741   PLCC 00   00.00.00   AETRIUM   CORE        
16   AET3300   AETRIUM 3300   40002862   PLCC 28   04.2.16   AETRIUM           S/D
17   AET3300   AETRIUM 3300   40002866   SOIC 300mil   04.2.9   AETRIUM           S/D
18   AET3300   AETRIUM 3300   40002865   PLCC 44   04.2.16   AETRIUM           S/D
19   AET3300   AETRIUM 3300   40002977   PLCC 68   04.3.3   AETRIUM           S/D
20   AET3300   AETRIUM 3300   40002980   PLCC 68   04.3.3   AETRIUM           S/D
21   AET3300   AETRIUM 3300   40003225   PLCC   04.10.6   AETRIUM           S/D
22   AET3300   AETRIUM 3300   40002742   SOIC 300mil   03.10.20   AETRIUM           S/D
AET3300 Count   8                       1   0   7
23   AESCO   ASECO S-130   40002399   PLCC 28   03.1.29   ASECO           S/D
24   AESCO   ASECO S-130   40002398   PLCC 28   03.1.29   ASECO       Excess    
25   AESCO   ASECO S-130   40002400   PLCC 28   03.1.29   ASECO       Excess    
26   AESCO   S-130   40001889   PLCC20   01.12.18   ASECO           S/D
27   AESCO   S-130   40001888   PLCC 00   00.00.00   ASECO           S/D
28   AESCO   S-130   40002397   PLCC 28   03.1.29   ASECO           S/D
AESCO Count   6                       0   2   4
29   ASM   ASM matrix   40002725   SOIC 8   02.10.17   ASM   CORE        
30   ASM   ASM matrix   40003357   SOIC 8   04.9.29   ASM   CORE        
31   ASM   ASM FT1000       SOIC 8   05.7.28   ASM   CORE        
ASM Count   3                       3   0   0
32   KUWANO   LT-930-H222   40001373   SOIC 8-20   00.10.6   XXXXXX   XXXX        
00   XXXXXX   LT-930-H222   40002774   SOIC 8-20   03.11.27   XXXXXX   XXXX        
00   XXXXXX   LT-930-H222   40002894   SOIC 8-20   04.3.12   XXXXXX   XXXX        
00   XXXXXX   LT-930-H222   40002895   SOIC 8-20   04.3.12   XXXXXX   XXXX        
00   XXXXXX   LT-930-H222   40002970   SOIC 8-20   04.4.21   XXXXXX   XXXX        
00   XXXXXX   LT-930-H222   40002971   SOIC 8-20   04.4.21   XXXXXX   XXXX        
00   XXXXXX   LT-930-H222   40002976   SOIC 8-20   04.4.28   XXXXXX   XXXX        
00   XXXXXX   LT-930-H222   40003087   SOIC 8-20   04.6.11   XXXXXX   XXXX        
00   XXXXXX   LT-930-H222   40001376   SOIC 8-20   00.10.6   XXXXXX           X/X
00   XXXXXX   LT-930-H222   40002070   SOIC 8-20   02.6.20   KUWANO           S/D
KUWANO Count   10                       8   0   2
42   MCT   MCT-3608 A3   40001381   PDIP 300mil   00.10.6   MCT   CORE        
43   MCT   MCT-3608 AE   40002454   PDIP 300mil   00.10.6   MCT   CORE        
44   MCT   MCT-3608 A3   40001380   PDIP 300mil   00.10.6   MCT   CORE        
45   MCT   MCT-3608 A3   40000628   PDIP 300mil   00.10.6   MCT   CORE        
46   MCT   MCT-3608 A3   40001379   PDIP 300mil   00.10.6   MCT   CORE        
47   MCT   MCT-3608 A3   40001377   PDIP 300mil   00.10.6   MCT   CORE        
48   MCT   MCT-3608 A3   40001723   PDIP 300mil   01.10.16   MCT   CORE        
49   MCT   MCT-3608 A3   40001727   PDIP 300mil   01.10.16   MCT   CORE        
50   MCT   MCT-3608 A3   40001722   PDIP 300mil   01.10.16   MCT   CORE        
51   MCT   MCT-3608 A3   40001724   PDIP 300mil   01.10.16   MCT   CORE        
52   MCT   MCT-3608 ES   40002001   PDIP 300mil   02.3.14   MCT   CORE        
53   MCT   MCT-3608 ES   40002002   PDIP 300mil   02.3.14   MCT   CORE        
54   MCT   MCT-3608 ES   40001996   PDIP 300mil   02.3.14   MCT           S/D
55   MCT   MCT-3608 ES   40001999   PDIP 300mil   02.3.14   MCT       Excess    
56   MCT   MCT-3608 A   40002234   PDIP 300mil   02.9.4   MCT       Excess    
57   MCT   MCT-3608 A   40002237   PDIP 300mil   02.9.4   MCT       Excess    
58   MCT   MCT-3608 A   40002235   PDIP 300mil   02.9.4   MCT           S/D
59   MCT   MCT-3608 A   40002236   PDIP 300mil   02.9.4   MCT   CORE        
60   MCT   MCT-3608 A   40002452   PDIP 300mil   03.3.7   MCT   CORE        
61   MCT   MCT-3608 A   40002450   PDIP 300mil   03.3.7   MCT   CORE        
62   MCT   MCT-3608 A   40002453   PDIP 300mil   03.3.7   MCT   CORE        
63   MCT   MCT-3608 A3   40002457   PDIP 300mil   03.4.3   MCT       Excess    

 

Table of Contents

                                     
    Platform                                
NO   (Sum)   Module   Asset   Device   Arrived at SCC   Vendor   CORE   Excess   S/D
64   MCT   MCT-3608 A3   40002456   PDIP 300mil   03.4.3   MCT       Excess    
65   MCT   MCT-3608 A3   40001806   PDIP 300mil   03.4.3   MCT       Excess    
66   MCT   MCT-3608 A3   40001382   PDIP 300mil   03.4.3   MCT       Excess    
67   MCT   MCT-3608 E   40002920   PDIP 600mil   04.3.5   MCT   CORE        
68   MCT   MCT-3608 A   40002921   PDIP 600mil   04.3.5   MCT   CORE        
69   MCT   MCT-3608 E   40002951   PDIP 300mil   04.3.17   MCT       Excess    
70   MCT   MCT-3608 E   40002952   PDIP 300mil   04.3.17   MCT       Excess    
71   MCT   MCT-3608 E   40002945   PDIP 300mil   04.3.17   MCT       Excess    
72   MCT   MCT-3608 E   40002948   PDIP 300mil   04.3.17   MCT       Excess    
73   MCT   MCT-3608 E   40000277   PDIP 300mil   97.3.14   MCT           S/D
74   MCT   MCT-3608 E3   40001707   PDIP 300mil   01.3.27   MCT           S/D
75   MCT   MCT-3608 ES   40002005   PDIP 300mil   02.3.14   MCT           S/D
76   MCT   MCT-3608 ES   40002004   PDIP 300mil   02.3.14   MCT           S/D
77   MCT   MCT-3608 E   40002953   PDIP 300mil   04.3.17   MCT           S/D
78   MCT   MCT-3608 E   40002944   PDIP 300mil   04.3.17   MCT           S/D
79   MCT   MCT-3608 E   40002946   PDIP 300mil   04.3.17   MCT           S/D
80   MCT   MCT-3608 E   40002947   PDIP 300mil   04.3.17   MCT           S/D
81   MCT   MCT-3608       PDIP 300mil   04.8.23   MCT           S/D
82   MCT   MCT-3608       PDIP 300mil   04.8.23   MCT           S/D
83   MCT   MCT-3608       PDIP 300mil   04.8.23   MCT           S/D
84   MCT   MCT-3608       PDIP 300mil   04.8.23   MCT           S/D
MCT Count   43                       18   11   14
85   SESSCO   SESSCO   40002093   SOIC 24   02.6.12   SESSCO       Excess    
86   SESSCO   SESSCO   40002796   SOIC 150mil   03.10.20   SESSCO           S/D
87   SESSCO   SESSCO   40002795   SOIC 150mil   03.10.20   SESSCO           S/D
88   SESSCO   SESSCO   40002802   SOIC 150mil   03.11.6   SESSCO           S/D
89   SESSCO   SESSCO   40002803   SOIC 150mil   03.11.6   SESSCO           S/D
90   SESSCO   SESSCO   40002804   SOIC 150mil   03.11.24   SESSCO   CORE        
91   SESSCO   SESSCO   40002798   SOIC 150mil   03.11.24   SESSCO   CORE        
92   SESSCO   SESSCO   40002801   SOIC 150mil   03.12.8   SESSCO   CORE        
93   SESSCO   SESSCO   40002799   SOIC 150mil   03.12.23   SESSCO           S/D
94   SESSCO   SESSCO   40003010   SOIC 150mil   04.5.13   SESSCO   CORE        
95   SESSCO   SESSCO   40002702   SOIC 150mil   03.8.9   SESSCO           S/D
96   SESSCO   SESSCO   40002797   SOIC 150mil   03.10.20   SESSCO           S/D
97   SESSCO   SESSCO   40002800   SOIC 150mil   03.12.8   SESSCO           S/D
98   SESSCO   SESSCO   40002652   MSOP 8   02.10.17   SESSCO           S/D
SESSCO Count   14                       4   1   9
99   XXXXX   SO 1000H   40000776   SOIC 8-28(150/208MIL)   99.11.25   XXXXX   CORE        
100   XXXXX   SO 1000H   40000777   SOIC 8-28(150/208MIL)   99.11.30   XXXXX   CORE        
101   XXXXX   SO 1000H   40000783   SOIC 8-20 (208MIL)   00.2.19   XXXXX   CORE        
102   XXXXX   SO 1000H   40000789   SOIC 8-20   00.4.20   XXXXX   CORE        
103   XXXXX   SO 1000AH   40000790   SOIC 8-20   00.5.24   XXXXX   CORE        
104   XXXXX   SO 1000AH   40000791   SOIC 8-20   00.6.8   XXXXX   CORE        
105   XXXXX   SO 1000AH   40000792   SOIC 8-20   00.6.8   XXXXX   CORE        
106   XXXXX   SO 1000AH   40001664   SOIC 8-20(208MIL)   00.12.22   XXXXX   CORE        
107   XXXXX   SO 1000AH   40001721   SOIC 150mil   01.9.3   XXXXX   CORE        
108   XXXXX   SO 1000AH   40001940   SOIC 8-20(208MIL)   01.10.4   XXXXX   CORE        
109   XXXXX   SO 1000T   40001942   SOIC 8-20(208MIL)   01.12.14   XXXXX   CORE        
110   XXXXX   SO 1000T   40001941   SOIC 8-20   01.12.14   XXXXX   CORE        
111   XXXXX   SO 1000T   40001969   SOIC 8-20(208MIL)   02.1.27   XXXXX   CORE        
112   XXXXX   SO 1000AH   40002076   SOIC8-20   02.5.16   XXXXX   CORE        
113   XXXXX   SO 1000AH   40002080   SOIC8-20   02.5.22   XXXXX   CORE        
114   XXXXX   SO 1000AH   40002079   SOIC8-20   02.5.22   XXXXX   CORE        
115   XXXXX   SO 1000AH   40002608   TSSOP   03.2.14   XXXXX       Excess    
116   XXXXX   SO 1000AH   40002515   TSSOP   03.2.17   XXXXX   CORE        
117   XXXXX   SO 1000AH   40002989   TSSOP 8   04.4.2   XXXXX       Excess    
118   XXXXX   SO 2000   40003037   TSSOP   04.5.24   XXXXX       Excess    
XXXXX Count   20                       17   3   0
119   SYMTEK   SYMTEK 300   40002755   P-DIP 14-28   03.10.20   SYM-TEK   CORE        
120   SYMTEK   SYMTEK 300HC   40001372   P-DIP 14-28   00.10.6   SYM-TEK           S/D
121   SYMTEK   SYMTEK 300HC   40001878   P-DIP 14-28   01.12.18   SYM-TEK           S/D
122   SYMTEK   SYMTEK 300   40002871   P-DIP 14-32   04.2.16   SYM-TEK           S/D
123   SYMTEK   SYMTEK 300   40002870   P-DIP 14-32   04.2.16   SYM-TEK           S/D
124   SYMTEK   SYMTEK 300   40002872   P-DIP 14-32   04.2.16   SYM-TEK           S/D
SYMTEK Count   6                       1   0   5
125   TESEC   TESEC 9210   40002776   SOIC 150 8-16LD   03.11.27   TESEC           S/D
126   TESEC   TESEC 8710   40003213   SOIC 150 8-16LD   04.7.27   TESEC           S/D
127   TESEC   TESEC 9030   40003172   SOIC 14-16LD   04.8.23   TESEC           S/D
128   TESEC   TESEC 8710   40002775   SOIC 150 8-16LD   03.11.27   TESEC           S/D
129   TESEC   TESEC 9210   40002777   SOIC 150 8-16LD   03.11.27   TESEC           S/D
130   TESEC   TESEC 8710   40003214   SOIC 150 8-16LD   04.7.27   TESEC           S/D
131   TESEC   TESEC 8710   40001745   SIOC 24   01.11.8   TESEC           S/D

 

Table of Contents

                                     
    Platform                                
NO   (Sum)   Module   Asset   Device   Arrived at SCC   Vendor   CORE   Excess   S/D
132   TESEC   TESEC 9030   40002778   SOIC 14-16LD   03.11.27   TESEC           S/D
133   TESEC   TESEC 9210   40003212   SOIC 150 8-16LD   04.7.27   TESEC           S/D
134   TESEC   TESEC 9030   40003157   SOIC 14-16LD   04.8.23   TESEC           S/D
TESEC Count   10                       0   0   10
135   XX000   XX-000XX   40000389   SOIC 150mil   97.10.24   SEC           S/D
TB150 Count   1                       0   0   1
136   MH802   MH802   40000774   SOIC 208mil   99.7.6   MICROHANDLING           S/D
137   MH802   MH802   40000775   SOIC 150mil   99.8.10   MICROHANDING           S/D
MH802 Count   2                       0   0   2
138   MT93XX   MT 9308   40001708   SOIC 330 28L   01.4.28   MULTITEST   CORE        
139   MT93XX   MT 9308   40001713   SOIC 330 28L   01.6.13   MULTITEST   CORE        
140   MT93XX   MT 9308   40002688   SOIC 300mil   03.4.25   MULTITEST   CORE        
141   MT93XX   MT 9308   40002689   SOIC 300mil   03.5.6   MULTITEST   CORE        
142   MT93XX   MT 9308   40002690   SOIC 300mil   03.5.6   MULTITEST   CORE        
143   MT93XX   MT 9308   40002672   SOIC 150mil   03.6.26   MULTITEST   CORE        
144   MT93XX   MT 9308   40002746   SOIC 300mil   03.9.18   MULTITEST   CORE        
145   MT93XX   MT 9308   40002893   SOIC 150mil   04.3.22   MULTITEST   CORE        
146   MT93XX   MT 9320   40002813   SOIC 150mil   04.2.9   MULTITEST   CORE        
147   MT93XX   MT 9320   40002349   MSOP 118mil   02.12.13   MULTITEST       Excess    
148   MT93XX   MT 9320   40002748   TSSOP173mil   03.9.18   MULTITEST       Excess    
149   MT93XX   MT 9320   40002836   SOIC 208mil   03.11.13   MULTITEST       Excess    
150   MT93XX   MT 9320   40002978   TSSOP173mil   04.3.15   MULTITEST       Excess    
151   MT93XX   MT 9320   40002747   SOIC 150MIL PTB   03.11.25   MULTITEST   CORE        
152   MT93XX   MT 9320       SOIC 150mil   04.5.26   MULTITEST   CORE        
153   MT93XX   MT 9320   40002925   SOIC 150mil   04.3.25   MULTITEST   CORE        
154   MT93XX   MT 9320   40002926   SOIC 150mil   04.3.25   MULTITEST   CORE        
155   MT93XX   MT 9320   40003072   MSOP118mil   04.5.10   MULTITEST   CORE        
156   MT93XX   MT 9320       SOIC 150mil   04.6.28   MULTITEST   CORE        
157   MT93XX   MT 9320       SOIC 150mil   04.6.28   MULTITEST   CORE        
158   MT93XX   MT 9320   40003306   SOIC 150mil   04.7.20   MULTITEST   CORE        
159   MT93XX   MT 9320   40002837   SSOP208mil   03.11.27   MULTITEST   CORE        
160   MT93XX   MT 9320   40003229   TSSOP173mil   04.10.6   MULTITEST   CORE        
161   MT93XX   MT 9320   40003355   SSOP 208mil   04.12.22   MULTITEST   CORE        
MT93XX Count   24                       20   4   0
162   MT8589   MT 8589   40002749   PLCC 44   03.8.6   MULTITEST   CORE        
163   MT8589   MT 8589   40003230   PLCC   04.10.22   MULTITEST   CORE        
MT8589 Count   2                       2   0   0
164   MT8588   MT 8588           05.11.18   MULTITEST       Excess    
165   MT8588   MT 8588           05.11.18   MULTITEST       Excess    
166   MT8588   MT 8588           05.11.18   MULTITEST           S/D
MT8588 Count   3                       0   2   1
167   MT99XX   MT 9918   40002839   TSSOP   03.12.23   MULTITEST   CORE        
168   MT99XX   MT 9918   40003304   SOIC 300mil   04.5.14   MULTITEST   CORE        
169   MT99XX   MT 9918   40003305   SOIC 150mil   04.7.20   MULTITEST   CORE        
170   MT99XX   MT 9918   40003302   MSOP 8   04.8.3   MULTITEST   CORE        
171   MT99XX   MT 9918   40003298   TSSOP   04.8.25   MULTITEST       Excess    
172   MT99XX   MT 9928       TSSOP 173mil   05.9.29   MULTITEST       Excess    
MT99XX Count   6                       4   2   0
 
Grand Count   172                       81   27   64

 

Table of Contents

Post Test Equipment Summary
                                     
                     
Type   Module   Out - Total   Core   Excess   S/D
Tape & Reel
   TR18AS     6       4       1       1  
Tape & Reel
   AT28     11       11       0       0  
Tape & Reel
   AT128     7       6       0       1  
Tape & Reel
   G6     9       9       0       0  
Tape & Reel
   AT8005     1       1       0       0  
Tape & Reel
   MV85x     3       1       0       2  
Tape & Reel   Ismeca     2     Note: Brand new systems, model & equipment details not available currently and
Lead Reconditioner
   AT4070     1       0       0       1  
Lead Reconditioner
   AT-1045     1       0       0       1  
Lead Reconditioner
   ATS-1245     2       0       0       2  
Part Counter
   PC-138     1       1       0       0  
Peel Tester
   GPD     1       1       0       0  
Dry Packing
   QUICK-7G     1       1       0       0  
Oven
   Blue M     3       3       0       0  
 
 
   Total     49                          

 

Table of Contents

SCC TR &LIS Review
                             
NO   Equ. Name   Module   Asset NO.   Device   Arrived at CPS   Vendor   Status
1   Tape Reel   TR18AS   40000778   SOIC 8   99.11.06   STI   Core
2   Tape Reel   TR18AS   40000825   SOIC 8   99.11.06   STI   Core
3   Tape Reel   TR18AS   40000779   SOIC 8   00.3.27   STI   Core
4   Tape Reel   TR18AS   40000824   SOIC 8   00.5.27   STI   Core
5   Tape Reel   TR18AS   40000826   SOIC 8   00.5.27   STI   Excess
6   Tape Reel   TR18AS   40000823   SOIC 8   00.6.2   STI   S/D
7   Tape Reel   AT 28   40002009   MSOP   01.5.3   STI   Core
8   Tape Reel   AT 28   40002010   SOIC 300mil   01.5.3   STI   Core
9   Tape Reel   AT 28   40002385   SOIC 150mil   02.2.27   STI   Core
10   Tape Reel   AT 28   40002411   SOIC 150mil   02.3.4   STI   Core
11   Tape Reel   AT 28   40002409   TSSOP 173mil   02.3.4   STI   Core
12   Tape Reel   AT 28   40002410   TSSOP 173mil   02.3.12   STI   Core
13   Tape Reel   AT 28   40002325   MSOP   02.6.10   STI   Core
14   Tape Reel   AT 28   40002960   SOIC 330mil   03.10.14   STI   Core
15   Tape Reel   AT 28   40002962   SOIC 208mil   03.11.03   STI   Core
16   Tape Reel   AT 28   40002961   SOIC 150mil   03.12.04   STI   Core
17   Tape Reel   AT 28   40003338   TSSOP   04.3.5   STI   Core
18   Tape Reel   AT 128   40002609   SOIC 150 8L   02.3.12   STI   Core
19   Tape Reel   AT 128   40002610   SOIC 150 8L   02.6.10   STI   Core
20   Tape Reel   AT 128   40003334   SOIC 150 8L   03.12.23   STI   Core
21   Tape Reel   AT 128   40003335   SOIC 150 8L   04.1.15   STI   Core
22   Tape Reel   AT 128   40003336   SOIC 150 8L   04.3.17   STI   Core
23   Tape Reel   AT 128   40003337   SOIC 150 8L   04.3.17   STI   Core
24   Tape Reel   AT 128   40003238       04.11.2   STI   S/D
25   Tape Reel   VisDynamics G6   40002793   SOIC 150mil   03.11.24   VisDynamics   Core
26   Tape Reel   VisDynamics G6   40003154   SOIC 150mil   04.3.12   VisDynamics   Core
27   Tape Reel   VisDynamics G6   40003155   SOIC 150mil   04.4.6   VisDynamics   Core
28   Tape Reel   VisDynamics G6   40003156   SOIC8/14/16   04.4.17   VisDynamics   Core
29   Tape Reel   VisDynamics G6   40003286   SOIC 150 MIL   04.5.19   VisDynamics   Core
30   Tape Reel   VisDynamics G6   40003287   SOIC 150 MIL   04.5.24   VisDynamics   Core
31   Tape Reel   VisDynamics G6   40003277   MSOP   04.6.15   VisDynamics   Core
32   Tape Reel   VisDynamics G6   40003288   SOIC 150mil   04.6.21   VisDynamics   Core
33   Tape Reel   VisDynamics G6   40003278   MSOP   04.7.7   VisDynamics   Core

 

Table of Contents

                             
NO   Equ. Name   Module   Asset NO.   Device   Arrived at CPS   Vendor   Status
34   Tape Reel   AT 8005   40000820   PLCC 44   00.5.20   STI   Core
35   Tape Reel   MICROVISION 852   40001594   SOIC 300mil   01.6.1   Microvision   Core
36   Tape Reel   MICROVISION 852   40000649   SOIC 8   01.6.1   Microvision   S/D
37   LEADSCAN   MICROVISION 851   40000688   SOIC 8   99.11.12   Microvision   S/D
38   Lead Reconditioner   AT 4070   40002884   Lead Repair   04.2.3   Curris Logic   S/D
39   Lead Reconditioner   AT-1045   40003086   Lead Repair   04.5.17   Cirrus Logic   S/D
40   Lead Reconditioner   ATS-1245   40003237   Lead Repair   04.8.12   Cirrus Logic   S/D
41   Lead Reconditioner   ATS-1245   40003236   Lead Repair   04.8.12   Cirrus Logic   S/D
42   PART COUNTER   PC-138   40002223   ALL   02.3.14   STI   Core
43   PEEL TESTER   GPD   40002568   ALL   02.8.9   GPD   Core
44   DRY PACKING   QUICK-7G   40000770   ALL   00.3.8   XXX XXXX   Core
45   OVEN   Blue M   40000401   ALL   97.12.12   BLUE M   Core
46   OVEN   Blue M   40000399   ALL   98.3.20   BLUE M   Core
47   OVEN   Blue M   40000400   ALL   98.3.20   BLUE M   Core
48   Tape Reel   Ismeca   Note: Brand New Systems — Details not available        
49   Tape Reel   Ismeca   Note: Brand New Systems — Details not available        

 

Table of Contents

Appendix 2
Technical Specifications

18

Table of Contents

Appendix 2
Technical Specifications

 

Table of Contents

Technical Specifications — Assembly
                             
Type   Document Number   Doc Title   Doc Rev   Doc Level (1/2/3/4)   DEPT
Spec.
  CS711-0002   LEAD FRAME     10       3     LDP ENG
Spec.
  CS711-0007   TUBE AND PIN/PLUG     11       3     LDP ENG
Spec.
  CS711-0008   MARKING INK     8       3     LDP ENG
Spec.
  CS711-0014   SAW BLADE     5       3     LDP ENG
Spec.
  CS711-0019   PLASTIC PKG. HEAT SPREADER/SLUG     1       3     LDP ENG
Spec.
  CS712-0105   MATERIAL FOR METAL FINISH     14       3     LDP ENG
Spec.
  CMC720-0001   WAFER MAPPING HANGLING SPECIFICATION FOR INKLESS WAFER     5       3     LDP ENG
Spec.
  CMC720-0004   LASER DEFLASH     3       3     LDP ENG
Spec.
  CS720-0005   EPOXY DIE ATTACH     24       3     LDP ENG
Spec.
  CS720-0006   DIE ATTACH POST CURE     15       3     LDP ENG
Spec.
  CS720-0007   THERMOSONIC WIRE BONDING     19       3     LDP ENG
Spec.
  CS720-0009   LDP MOLD HANDLING PROCEDURE     20       3     LDP ENG
Spec.
  CS720-0010   POST MOLD CURE     12       3     LDP ENG
Spec.
  CS720-0014   TRIM / FORM FOR P-DIP     11       3     LDP ENG
Spec.
  CS720-0017   TOP & BOTTOME SIDE MARKING     23       3     LDP ENG
Spec.
  CS720-0022   SCC LDP MOLDING REJECT CRITERIA     12       3     LDP ENG
Spec.
  CS720-0023   LEAD FINISH     21       3     LDP ENG
Spec.
  CS720-0026   EXTERNAL VISUAL INSPECTION FOR PLCC PACKAGE     9       3     LDP ENG
Spec.
  CS720-0028   WAFER MOUNT PROCESS SPEC FOR ASS’Y     21       3     LDP ENG
Spec.
  CS720-0032   FORM/SINGULATION FOR SMD     14       3     LDP ENG
Spec.
  CS720-0033   DEDAMBER/DEJUNK FOR SMD     8       3     LDP ENG
Spec.
  CS720-0037   DIE COATING     12       3     LDP ENG
Spec.
  CS720-0038   EXTERNAL VISUAL INSPECTION FOR PACKAGE     11       3     LDP ENG
Spec.
  CS720-0051   2ND OPTICAL INSPECTION     12       3     LDP ENG
Spec.
  CS720-0052   3RD OPTICAL INSPECTION FOR PLASTIC PACKAGE     20       3     LDP ENG
Spec.
  CS720-0053   EXTERNAL VISUAL INSPECTION FOR P-DIP     13       3     LDP ENG
Spec.
  CS720-0055   DZ-600 VACUUM PACKING MACHINE OPERATION PROCEDURE SPECIFICATION     1       3     LDP ENG
Spec.
  CS720-0901   LDP PACKING PROCEDURE     10       3     LDP ENG
Spec.
  CS724-0001   EXTERNAL VISION INSPECTION FOR TSOP,TSSOP, SSOP & MSOP PACKAGES     12       3     LDP ENG
Spec.
  CS760-0006   REWORK PROCEDURE FOR LEADED PLASTIC PKG     9       3     LDP ENG
Spec.-test
  CMT141-0014   MU851 IC LEAD/XXXX INSPECTOR OPERATION SPECIFICATION     2       3     LDP TEST
Spec.-test
  CMT141-0045   SP-6E SEMI-AUTOMATIC POLYPROPYLENE STRAPPING MACHINE OPERATION PROCEDURE SPECIFICATION     1       3     LDP TEST
Spec.-test
  CMT143-0026   TR18ASII TAPE & REEL MACHINE PM & CALIBRATION PROCEDURE SPECIFICATION     6       3     LDP TEST
Spec.-test
  CMT143-0028   DT-338 DETAPING MACHINE PM PROCEDURE SPECIFICATION     2       3     LDP TEST
Spec.-test
  CMT143-0030   QUICK-7G DRY PACKING MACHINE PM PROCEDURE SPECIFICATION     3       3     LDP TEST
Spec.-test
  CMT143-0031   MV851 IC XXXX/LEADINSPECTION PM&CAL PROCEDURE SPECIFICATION     3       3     LDP TEST
Spec.-test
  CMT143-0034   PBFT-856VS PEEL BACK FORCE TESTER PM & CALIBRATION PROCEDURE SPECIFICATION     2       3     LDP TEST
Spec.-test
  CMT143-0035   AT8005 LEAD/XXXX INSPECTION SYSTEM PM SPECIFICATION     2       3     LDP TEST
Spec.-test
  CMT143-0042   PC-138 PART COUNTER MACHINE PM PROCEDURE SPECIFICATION     2       3     LDP TEST
Spec.-test
  CMT143-0056   AT-28 TAPE & REEL MACHINE PM & CALIBRATION PROCEDURE     3       3     LDP TEST
Spec.-test
  CMT143-0063   RVSI LS-3900 LEAD AND GRID SCANNING INSPECTION SYSTEM PM & CALIBRATION PROCEDURE SPECIFICATION     3       3     LDP TEST
Spec.-test
  CMT143-0064   RVSI LS-7700 TATAL PACKAGE INSPECTION SYSTEM PM & CALIBRATION PROCEDURE SPECIFICATION     2       3     LDP TEST
Spec.-test
  CMT143-0085   AT-128 TAPE & REEL MACHINE PM & CALIBRATION PROCEDURE SPECIFICATION     1       3     LDP TEST
Spec.-test
  CMT143-0091   ICOS CI-9450 COMPONENT INSPECTION SYSTEM PREVENTIVE MAINTENANCE SPECIFICATION     1       3     LDP TEST
Spec.-test
  CMT144-0002   FINAL VISUAL INSPECTION PROCEDURE     10       3     LDP TEST
Spec.-test
  CMT144-0003   TEST INNER PACKING PROCEDURE     12       3     LDP TEST
Spec.-test
  CMT144-0010   PACKING IN TAPE AND REEL PROCEDURE SPEC.     24       3     LDP TEST
Spec.-test
  CMT144-0015   LEAD SCANNING PROCEDURE SPEC     6       3     LDP TEST
Spec.-test
  CMT145-0006   PACKING MATERIAL SPEC     6       3     LDP TEST
Spec.-LMT
  ES782-0014   PROCESS SPECIFICATION FOR SUBSTRATE PRE-BAKE     8       3     LDP ENG
C/P
  CP-CPS-ALL-001   SCC STANDARD CONTROL PLAN FOR LEADED PACKAGE     36       3     LDP ENG
MI-LDP
  MI-MS-008-001   MSOP 8/10LD     5       3     LDP ENG
MI-LDP
  MI-MS-008-002   MSOP 08/10LD EDP     0       3     LDP ENG
MI-LDP
  MI-PD-008-001   PD008 XXXX     7       3     LDP ENG
MI-LDP
  MI-PD-008M-001   PDIP 8LD X     00       0     XXX XXX
XX-XXX
  MI-PD-014-001   PD014&016LD     12       3     LDP ENG
MI-LDP
  MI-PD-014-002   PD014&016LD     5       3     LDP ENG
MI-LDP
  MI-PD-018-001   PD018LD     7       3     LDP ENG
MI-LDP
  MI-PD-020-001   PD020LD     11       3     LDP ENG
MI-LDP
  MI-PD-024N-001   PDIP 24LD N     10       3     LDP ENG
MI-LDP
  MI-PD-024W-001   PDIP 24LD W     9       3     LDP ENG
MI-LDP
  MI-PD-028-001   PDIP 28LD     8       3     LDP ENG
MI-LDP
  MI-PD-028-002   PDIP 28LD     4       3     LDP ENG
MI-LDP
  MI-PD-028N-001   PD028LDN     8       3     LDP ENG
MI-LDP
  MI-PD-032-001   PD032LD     7       3     LDP ENG
MI-LDP
  MI-PD-040-001   PD040/42LD     9       3     LDP ENG
MI-LDP
  MI-PL-020-001   PLCC 20LD     7       3     LDP ENG
MI-LDP
  MI-PL-028-001   PLCC 28LD     8       3     LDP ENG
MI-LDP
  MI-PL-032-001   PLCC 32LD     10       3     LDP ENG
MI-LDP
  MI-PL-032-002   PLCC032LD     0       3     LDP ENG
MI-LDP
  MI-PL-044-001   PLCC 44LD     11       3     LDP ENG

 

Table of Contents

                             
Type   Document Number   Doc Title   Doc Rev   Doc Xxxxx (0/0/0/0)   XXXX
XX-XXX
  XX-XX-000-000   XXXX 00XX     7       3     LDP ENG
MI-LDP
  MI-PL-084-001   PLCC 84LD     8       3     LDP ENG
MI-LDP
  MI-PS-008M-001   SOIC 8LD X     00       0     XXX XXX
XX-XXX
  XX-XX-000X-000   SOIC 8LD X     0       0     XXX XXX
XX-XXX
  XX-XX-000X-000   SOIC 8LD M     6       3     LDP ENG
MI-LDP
  MI-PS-008M-004   SOIC 8LD (M) EDP     9       3     LDP ENG
MI-LDP
  MI-PS-008M-006   SOIC 8LD M EDP     2       3     LDP ENG
MI-LDP
  MI-PS-008M-007   SOIC008LDM     3       3     LDP ENG
MI-LDP
  MI-PS-008M-008   SOIC008LDM     1       3     LDP ENG
XX-XXX
  XX-XX-000X-000   SOIC 8LD W     11       3     LDP ENG
MI-LDP
  MI-PS-014-001   SOIC 14LD     13       3     LDP ENG
MI-LDP
  MI-PS-014-002   SOIC 14LD     9       3     LDP ENG
XX-XXX
  XX-XX-000X-000   SOIC 16LD N     12       3     LDP ENG
MI-LDP
  MI-PS-016N-002   SOIC 16LD N     9       3     LDP ENG
XX-XXX
  XX-XX-000X-000   SOIC 16LD W     8       3     LDP ENG
XX-XXX
  XX-XX-000X-000   SOIC 016W MATRIX     0       3     LDP ENG
MI-LDP
  MI-PS-020-001   SOIC 20LD     8       3     LDP ENG
MI-LDP
  MI-PS-020M-001   SOIC 20LD MATRIX     8       3     LDP ENG
MI-LDP
  MI-PS-024-001   SOIC 24LD     9       3     LDP ENG
XX-XXX
  XX-XX-000X-000   SOIC 28LD N     9       3     LDP ENG
XX-XXX
  XX-XX-000X-000   SOIC 28LD W     10       3     LDP ENG
MI-LDP
  MI-PS-032-001   SOIC 32LD     5       3     LDP ENG
MI-LDP
  MI-SP-036-001   SSOP 36LD     2       3     LDP ENG
MI-LDP
  MI-SP-048-001   SSOP 48LD/56LD     5       3     LDP ENG
MI-LDP
  MI-SP-048-002   SSOP 48LD     3       3     LDP ENG
MI-LDP
  MI-SP-056-001   SSOP 56LD     12       3     LDP ENG
MI-LDP
  MI-TP-008-001   TSSOP 8LD     5       3     LDP ENG
MI-LDP
  MI-TP-014-001   TSSOP 14/16LD     9       3     LDP ENG
MI-LDP
  MI-TP-014-002   TSSOP 014/016LD     0       3     LDP ENG
MI-LDP
  MI-TP-020-001   TSSOP 20/24LD     8       3     LDP ENG
MI-LDP
  MI-TP-020-002   TSSOP 20/24LD     3       3     LDP ENG
MI-LDP
  MI-TP-024-001   TSSOP 24LD     4       3     LDP ENG
MI-LDP
  MI-TP-028-001   TSSOP 28LD     8       3     LDP ENG
MI-LDP
  MI-TP-028ep-001   TSSOP028-EDP     3       3     LDP ENG
MI-LDP
  MI-TP-030-001   TSSOP 30LD     5       3     LDP ENG
MI-LDP
  MI-TP-048-001   TSSOP 48LD     3       3     LDP ENG
MI-LDP
  MI-Iquad-120-001   IQUAD 28x28 (120LD)     1       3     LDP ENG
PM
  PM-0021   MANUAL MOLD PRESS     12       3     LDP MAINT
PM
  PM-0024   AUTO PAD XXXX M/C (I.R.)     9       3     LDP MAINT
PM
  PM-0025   AUTO LASER XXXX M/C     12       3     LDP MAINT
PM
  PM-0079   PREHEATER     5       3     LDP MAINT
PM
  PM-0082   MANUAL MOLD DIE     10       3     LDP MAINT
PM
  PM-0084   MAINTENANCE/BACK END     12       3     LDP MAINT
PM
  PM-0087   MANUAL FRIM/FORM MACHINE     6       3     LDP MAINT
PM
  PM-0090   PLATE MAKER 612     5       3     LDP MAINT
PM
  PM-0094   AUTO LOADER     4       3     LDP MAINT
PM
  PM-0129   TOWA AUTO MOLD SYSTEM     11       3     LDP MAINT
PM
  PM-0131   ASM AUTO MOLD SYSTEM     6       3     LDP MAINT
PM
  PM-0132   ASM AUTO MOLD SYSTEM     7       3     LDP MAINT
PM
  PM-0135   BOND TOOLING     5       3     LDP MAINT
PM
  PM-0148   MAINTENANCE/BACK END     4       3     LDP MAINT
PM
  PM-0150   TRIM DIE     6       3     LDP MAINT
PM
  PM-0151   FORM DIE     3       3     LDP MAINT
PM
  PM-0158   TOWA AUTO MOLDING SYSTEM     3       3     LDP MAINT
PM
  PM-0159   SEMI-AUTO L/F LOADER     2       3     LDP MAINT
PM
  PM-0164   AUTO LASER DEFLASH M/C     2       3     LDP MAINT
PM
  PM-0166   TUBE CHANGE SEESAW     2       3     LDP MAINT
PM
  PM-0197   FICO AUTO MOLD SYSTEM     2       3     LDP MAINT
PM
  PM-0213   GO-NO-GO JIG     1       3     LDP MAINT
PM
  PM-0222   PMC OVEN     1       3     LDP MAINT
Visual Aid
  VPA4-00001-1   TUBE TYPE FOR FK PDIP 300MIL     1       3     LDP ENG
Visual Aid
  VPB3-00008-8   ATTENTION AT OVEN CURE PROCESS     8       3     LDP ENG
Visual Aid
  VPB3-00009-27   SUMMARY OF DICING SAW CONTROL     27       3     LDP ENG
Visual Aid
  VPB3-00018-8   WAFER MOUNT BAKING     8       3     LDP ENG
Visual Aid
  VPB3-00021-30   OPERATOR, MAINTENANCE, QA USE REFERENCE TABLE AT W/B PROCESS     30       3     LDP ENG
Visual Aid
  VPB3-00022-16   SUMMARY OF DIE ATTACH PROCESS CONTROL     16       3     LDP ENG
Visual Aid
  VPB3-00024-1   EPOXY STORAGE CONDITION AND LIFE TIME     1       3     LDP ENG
Visual Aid
  VPB3-00025-5   ATTENTION AT 2ND OPTICAL INSPECTION     5       3     LDP ENG
Visual Aid
  VPB4-00001-6   B-CODE PROCEDURE     6       3     LDP ENG
Visual Aid
  VPB4-00005-1   WAFER MAPPING FILE DOWNLOAD     1       3     LDP ENG
Visual Aid
  VPB5-00001-1   DIE ATTACH CV ON HOLD CRITERIA     1       3     LDP ENG
Visual Aid
  VPB5-00002-0   0 XX XXXXXXX XXX XXXXX XX HOLD CRITERIA     0       3     LDP ENG
Visual Aid
  VPB5-00003-9   SUMMARY OF STACK DIE PRODUCT FOL CONTROL     9       3     LDP ENG
Visual Aid
  VPD4-00004-1   DIFFERENT FORM DIE SET FOR MSOP8/10 TSSOP8/14/16/28 TSSOP20/24     1       3     LDP ENG
Visual Aid
  VPD4-00010-2   CUSTOMERS WITH SPECIAL REQUIREMENT IN WAFER MOUNT PROCESS     2       3     LDP ENG
Visual Aid
  VPD4-00011-6   CUSTOMERS WITH SPECIAL REQUIREMENT IN DICING SAW PROCESS     6       3     LDP ENG
Visual Aid
  VPD4-00012-5   CUSTOMERS WITH SPECIAL REQUIREMENT IN DIE ATTACH PROCESS     5       3     LDP ENG
Visual Aid
  VPD4-00013-4   CUSTOMERS WITH SPECIAL REQUIREMENT IN WIRE BOND PROCESS     4       3     LDP ENG

 

Table of Contents

                             
Type   Document Number   Doc Title   Doc Rev   Doc Level (1/2/3/4)   DEPT
Visual Aid
  VPD4-00014-1   CUSTOMERS WITH SPECIAL REQUIREMENT IN MOLD PROCESS     1       3     LDP ENG
Visual Aid
  VPD4-00015-0   CUSTOMERS WITH SPECIAL REQUIREMENT IN PMC PROCESS     0       3     LDP ENG
Visual Aid
  VPD4-00016-1   CUSTOMERS WITH SPECIAL REQUIREMENT IN TRIM PROCESS     1       3     LDP ENG
Visual Aid
  VPD4-00017-1   CUSTOMERS WITH SPECIAL REQUIREMENT IN TIN PLATING PROCESS     1       3     LDP ENG
Visual Aid
  VPD4-00018-1   CUSTOMERS WITH SPECIAL REQUIREMENT IN MARKING PROCESS     1       3     LDP ENG
Visual Aid
  VPD4-00019-1   CUSTOMERS WITH SPECIAL REQUIREMENT IN TRIM&FORM PROCESS     1       3     LDP ENG
Visual Aid
  VPD4-00020-1   CUSTOMERS WITH SPECIAL REQUIREMENT IN EVI PROCESS     1       3     LDP ENG
Visual Aid
  VPD4-00022-0   ProblemSoure OCAP flowchart     0       3     LDP ENG
Visual Aid
  VPD5-00008-0   D/A WAFER MAPPING BUY-OFF REPORT     0       3     LDP ENG
Visual Aid
  VPD5-00014-1   TYPE OF THE TRAY     1       3     LDP ENG
Visual Aid
  VPD5-00027-0   IN-LINE FOL LOW YIELD CONTROL     0       3     LDP ENG
Visual Aid
  VPD5-00029-1   SUMMARY OF 3RD PROCESS CONTROL     1       3     LDP ENG
Visual Aid
  VPD5-00040-0   VISUAL AID FOR XXXXXX ISSUE IN EVI PROCESS     0       3     LDP ENG
Visual Aid
  VPD5-00051-0   VISUAL AIDS FOR EVI MAJOR DEFECT SPSEC     0       3     LDP ENG
Visual Aid
  VPD5-00053-0   EVI CHECKING METHOD FOR UNITS IN TUBE     0       3     LDP ENG
Visual Aid
  VPD6-00003-0   TRAINING MATERIAL FOR FUJITSU WRONG TRAY LSSUE     0       3     LDP ENG
Visual Aid
  XXX0-00000-0   XXXXXXXXXXX VISUAL AID FOR TRAY LOADING IN MACHINE AND UNIT IN TAPE (TRAY TO REEL PRODUCTS)     0       3     LDP TEST
Visual Aid
  VPD6-00013-0   VISUAL AID FOR EOL PACKAGE F/M     0       3     LDP ENG
Visual Aid
  VPC4-00002-0   BARCODE LABEL FOR LDP ASS’Y ONLY PRODUCTS     0       3     LDP ENG
Visual Aid
  VPE5-00002-0   DIE SET POLISH REQUIREMENT FOR PB FREE PRODUCTS     0       3     LDP ENG
TCM
  TCMLDPMK   MARKING TOTAL CONTROL METHODOLOGY     12       3     LDP ENG
TCM
  TCMLDPPL   LEAD FINISH TOTAL CONTROL METHODOLOGY     12       3     LDP ENG
TCM
  TCMLDPMD   MOLD TOTAL CONTROL METHODOLOGY     12       3     LDP ENG
TCM
  TCMLDPTF   TRIM/FORM TOTAL CONTROL METHODOLOGY     19       3     LDP ENG
TCM
  TCMLDPDP   DIE PREPARATION TOTAL CONTROL METHODOLGY     23       3     LDP ENG
TCM
  TCMLDPDA   DIE ATTACH TOTAL CONTROL METHODOLOGY     26       3     LDP MAINT
TCM
  TCMLDPWB   WIRE BONDING TOTAL CONTROL METHODOLGY     25       3     LDP MAINT
TCM
  TCMLDPPK   PACKING TOTAL CONTROL METHODOLOGY     7       3     LDP ENG
TCM
  TCMLDPEVI   EVI TOTAL CONTROL METHODOLOGY     7       3     LDP ENG
FMEA
  FMEA-LDPDP-001   DIE PREPARATION FAILURE MODE AND EFFECTS ANALYSIS     0       3     LDP ENG
FMEA
  FMEA-LDPPL-001   PROCESS FMEA FOR TIN/LEAD LEAD FINISH     0       3     LDP ENG
FMEA
  FMEA-LDPPL-002   PROCESS FMEA FOR PURE TIN LEAD FINISH     0       3     LDP ENG
FMEA
  FMEA-LDPTF-001   SMD TRIM PROCESS FAILURE MODE AND EFFECTS ANALYSIS     0       3     LDP ENG
FMEA
  FMEA-LDPTF-002   SMD FORM PROCESS FAILURE MODE AND EFFECTS ANALYSIS     1       3     LDP ENG
FMEA
  FMEA-LDPTF-003   PDIP TRIM/FORM PROCESS FAILURE MODE AND EFFECTS ANALYSIS     0       3     LDP ENG
FMEA
  FMEA-LDPWB-001   WIRE BONDING PROCESS XXXX     0       0     XXX XXX
XXXX
  XXXX-XXXXX-000   XXXX FOR LDP MARKING PROCESS     0       3     LDP ENG
FMEA
  FMEA-LDPDA-001   DIE ATTACH FAILURE MODE AND EFFECTS ANALYSIS     1       3     LDP ENG
FMEA
  FMEA-LDPMD-001   PROCESS FMEA FOR MOLD & PMC     1       3     LDP ENG
FMEA
  FMEA-LDPEVI-001   LDP EVI FAIL URE MODE AND EFFECTS ANALYSIS     0       3     LDP ENG
Procedure
  CPS-M-05   IN PROCESS MATERIAL AND PRODUCT STORAGE AND HANDLING PROCEDURE     6       2     LDP ENG
Procedure
  CPS-P-05   PROCESS CONTROL PROCEDURE     8       2     LDP ENG
Procedure
  CPS-P-14   TOOL MANAGEMENT PROCEDURE STANDARD     7       2     LDP MAINT
Procedure
  CPS-P-49   LDP W/B PROCESS RTI PROCEDURE     0       2     LDP ENG
Procedure
  CPS-R-08   BASELINE SPECIFICATION PREPARATION PROCEDURE     9       2     LDP ENG
Cal
  PI-046   MANUAL MOLD PRESS     6       3     LDP MAINT
Cal
  PI-047   MANUAL PRESS     4       3     LDP MAINT
Cal
  CAL-100   MECO AUTO SOLDER PLATING EDF-EPL 1800S     7       3     LDP MAINT
Cal
  CAL-109   ASM AUTO MOLDING SYSTEM     5       3     LDP MAINT
Cal
  CAL-111   AUTOMATIC WIRE BONDER(UTC-200/250,KNS 1488, KNS 8028)     5       0     XXX XXXXX
Xxx
  XXX-000   XXXX AUTO MOLD (Y-SERIES)     3       3     LDP MAINT
Cal
  CAL-162   FICO AUTO MOLD TEMP’ SYSTEM     2       0     XXX XXXXX
Xxx
  XXX-000   XXXX AUTO MOLD TEMP’ SYSTEM(UPS80)     3       0     XXX XXXXX
Xxx
  XXX-000   XXXX AUTOMOLD TEMP’ SYSTEM(UPS120)     3       3     LDP MAINT
Cal
  CAL-185   WAFER BAKING TIMER CALIBRATION     1       3     LDP MAINT
Cal
  CAL-193   BLUE-M-OVEN     0       3     LDP MAINT
Cal
  CAL-195   BLUE-M-OVEN     0       3     LDP MAINT
Cal
  CAL-198   HOT PLATE     0       3     LDP MAINT
Cal
  CAL-199   FREEZER     0       3     LDP MAINT
Cal
  CAL-206   GO NO GO GAUGE CALIBRATION SPEC FOR FORM PROCESS     0       3     LDP ENG
Cal
  CAL-210   4-CHAMBER CURE OVEN     0       0     XXX XXXXX
Xxx-XXX
  XXXX-0000   TAPE REMOVE     2       3     LDP ENG
WI
  WI-ENG-021   STANDARD QUALITY PROCEDURE FOR NEW LEADFRAME AND EXPIRED LEADFRAME     2       3     LDP ENG
WI
  WI-ENG-046   MARKING FILE SELECTION AND BUY OFF     13       3     LDP ENG
WI
  WI-ENG-049   3RD OPTICAL INSPECTION M/C MENU     2       3     LDP ENG
WI
  WI-ENG-062   FOL MAGAZINE CLEANING     3       3     LDP ENG
WI
  WI-ENG-066   PROCESS OF MATERIAL-LOT TRAVELLER     2       3     LDP ENG
WI
  WI-ENG-084   DESIGN OF EXPERIMENT FOR GOLD WIRE BONDING OPTIMIZATION IN MANUFACTURING     2       3     LDP ENG
WI
  WI-ENG-085   WAFER SAWING OPERATION METHOD     5       3     LDP ENG

 

Table of Contents

                             
Type   Document Number   Doc Title   Doc Rev   Doc Level (1/2/3/4)   DEPT
WI
  WI-ENG-102   COUNT VARIANCE CONTROL     11       3     LDP ENG
WI
  WI-ENG-103   WORK INSTRUCTION FOR TRIM& FORM PROCESS     6       3     LDP ENG
WI
  WI-ENG-114   DIE ATTACH SET BUY-OFF SYSTEM     7       3     LDP ENG
WI
  WI-ENG-121   OPERATION MANUAL FOR XX-0000 XXXXXXX INSPECTION SYSTEM     2       3     LDP ENG
WI
  WI-ENG-142   PMC CLAMPING METHOD FOR THIN PACKAGE     5       3     LDP ENG
WI
  WI-ENG-150   WAFER MOUNT OPERATION METHOD     2       3     LDP ENG
WI
  WI-ENG-153   OPERATION STANDARD TO PREVENT DAMAGED LEAD IN PLATING LINE     3       3     LDP ENG
WI
  WI-ENG-154   CHEMICAL ACCIDENT PREVENTIVE & EMERGENCY ACTION IN M/D,B/E, M/F LINE     4       3     LDP ENG
WI
  WI-ENG-157   OPERATION MANUAL OF MARKING MACHINE     6       3     LDP ENG
WI
  WI-ENG-163   HOW TO PREVENT DISCOLOR     2       3     LDP ENG
WI
  WI-ENG-164   DIE BONDER OPERATION MENU     4       3     LDP ENG
WI
  WI-ENG-186   MARKING SPECIAL CONTROL     9       3     LDP ENG
WI
  WI-ENG-199   LEAD FINISH LINE WATER FLOW MONITOR     2       3     LDP MAINT
WI
  WI-ENG-202   BULK PACKING METHOD FOR MONOLITHIC POWER SYSTEMS(MPS)     14       3     LDP ENG
WI
  WI-ENG-219   FOL & MOLD MATERIAL TRANSPORTATION PROCEDURE     3       3     LDP ENG
WI
  WI-ENG-227   MARKING FILE SET UP AND CHECK     2       3     LDP ENG
WI
  WI-ENG-233   SPECIAL PROCESS CONTROL FOR WAFER THICKNESS OUT OF REQUIREMENT PROCEDURE     3       3     LDP ENG
WI
  WI-ENG-250   ENGINEER LOT LOADING PROCEDURE     4       3     LDP ENG
WI
  WI-ENG-254   MOLDING L/F LOCATION     1       3     LDP ENG
WI
  WI-ENG-256   PACKING METHOD FOR WU/WUX     1       3     LDP ENG
WI
  WI-ENG-258   RADAR SYSTEM     2       3     LDP ENG
WI
  WI-ENG-262   LEADED FINISH RECIPE CONTROL     1       3     LDP ENG
WI
  WI-ENG-263   LEAD FINISH PLATING MATERIAL CONTROL IN LINE CHEMICAL STORAGE ROOM     1       3     LDP MAINT
WI
  WI-ENG-264   SPECIAL PROCESS CONTROL FOR DIE PREPARE PROCESS     1       3     LDP ENG
WI
  WI-ENG-271   EPOXY THICKNESS CONTROL CRITRIA IN LDP FOL     3       3     LDP ENG
WI
  WI-ENG-276   REJECT MARKING METHOD FOR FOL & MOLD, AND FOL RTI PROCEDURE     3       3     LDP PROD
WI
  WI-ENG-277   3RD OPTICAL INSPECTION MACHINE SET-UP AND BUY-OFF PROCEDURE     0       3     LDP ENG
WI
  WI-ENG-280   WAFER MAPPING WORKING INSTRUCTION     2       3     LDP ENG
WI
  WI-ENG-283   MOLD CLEANING     3       3     LDP ENG
WI
  WI-ENG-284   OPERATING REQUIREMENT OF AUTOMOLD SYSTEM     0       3     LDP ENG
WI
  WI-ENG-285   WIRE BONDER OPERATION MANUAL     1       3     LDP ENG
WI
  WI-ENG-286   MANUAL MOLD SEMI-AUTO FRAME LOADING HANDLING PROCEDURE     1       3     LDP ENG
WI
  WI-ENG-288   LDP D/A STANDARD OPERATION PROCEDURE     1       3     LDP ENG
WI
  WI-ENG-289   OVEN CURE PROCEDURE     0       3     LDP ENG
WI
  WI-ENG-291   VISUAL AID FOR ALL EOL DEFECT     0       3     LDP ENG
WI
  WI-ENG-292   TIN FLAKE MONITOR PROCEDURE     0       3     LDP ENG
WI
  WI-ENG-294   SPECIAL REQUIREMENT FOR IL PRODUCTS     3       3     LDP ENG
WI
  WI-ENG-297   CHEMICAL MAKE-UP AND CONTROL METHOD IN LEAD FINISH     3       3     LDP ENG
WI
  WI-ENG-299   TRIM & FORM RTI MONITOR CONTROL     0       3     LDP ENG
WI
  WI-ENG-301   NEW DEVICE SET UP BUY OFF ON LASER MARKING MACHINE     0       3     LDP ENG
WI
  WI-ENG-305   WAFFLE PACK ASSEMBLY     0       3     LDP ENG
WI
  WI-ENG-306   HP WATER JET DEFLASH     1       3     LDP ENG
WI
  WI-ENG-307   SPECIAL REQUIREMENT FOR ISL PRODUCTS     1       3     LDP ENG
WI
  WI-ENG-308   LDP W/B PROCESS RTI     0       3     LDP ENG
WI
  WI-ENG-314   HOW TO USE GO&NO-GO GAUGE     0       3     LDP ENG
WI
  WI-ENG-316   CONSUMABLE TOOLING QUALIFICATION PROCEDURE     0       3     LDP ENG
WI
  WI-ENG-319   LDAD FINISH SOLDERABILITY TEST     0       3     LDP ENG
WI
  WI-MTN-001   WIRE BONDER AIR FLOW METER SETTING     8       3     LDP MAINT
WI
  WI-MTN-002   W/B MACHINE SET-UP PROCEDURE FOR PRODUCT TYPE CONVERSION     11       3     LDP MAINT
WI
  WI-MTN-003   HEATER BLOCK & WINDOW CLAMP CONTROL     5       3     LDP MAINT
WI
  WI-MTN-004   PROCEDURES FOR PM CHECKING OF D/P MACHINE     3       3     LDP MAINT
WI
  WI-MTN-005   AUTOMATIC WIRE BONDER OVER-HAUL     5       3     LDP MAINT
WI
  WI-MTN-006   MANUFACTURING EQUIPMENT SOFTWARE CONTROL     3       3     LDP MAINT
WI
  WI-MTN-007   TAPE CHANGE METHOD     2       3     LDP MAINT
WI
  WI-MTN-010   AUTOMATIC DIE BONDER OVEN-HAUL     1       3     LDP MAINT
WI
  WI-MTN-011   D/A MACHINE SET-UP PROCEDURE FOR PRODUCT TYPE CONVERSION     3       3     LDP ENG
WI
  WI-MTN-013   EOL TRAINING MANUAL FOR MAINTENANCE     0       3     LDP MAINT
WI
  WI-MTN-014   LDP EQUIPMENT SHUT DOWN & START-UP WORK INSTRUCTION     0       3     LDP MAINT
WI
  WI-MTN-015   FOL TRAINING MANUAL FOR MAINTENANCE     0       3     LDP MAINT
WI
  WI-PRD-010   HANDLING OF SKELETON WAFER     8       3     LDP ENG
WI
  WI-PRD-011   DO,DON`T DO AT MARKING AND TRIM&FROM PROCESS     14       3     LDP PROD
WI
  WI-PRD-013   RETURN LOT SYSTEM     2       3     LDP PROD
WI
  WI-PRD-016   HOUSEKEEPING PROCEDURE     4       3     LDP PROD
WI
  WI-PRD-018   MOLD COMPOUND CONTROL     3       3     LDP PROD
WI
  WI-PRD-021   L/F MATERIAL HANDLE CONTROL PRODURE     2       3     LDP PROD
WI
  WI-PRD-022   DO & DO’T DO FOR FOL OPERATOR     4       3     LDP PROD
WI
  WI-PRD-027   PREVENTIVE ACTION FOR POTENTIAL HUMAN INDUCED DEFECT     8       3     LDP PROD
WI
  WI-PRD-028   GOLD WIRE CONTROL PROCEDURE     2       3     LDP PROD
WI
  WI-PRD-030   HOW TO THE INDICATOR DATA     1       3     LDP PROD
WI
  WI-PRD-032   LDP LINE TOOLING MANAGEMENT     5       3     LDP MAINT
WI
  WI-PRD-038   LDP M/H STANDARD OPERATION PROCEDURE     1       3     LDP PROD
WI
  WI-PRD-041   D/A TRAINING MANUAL FOR OPERATOR AND QA INSPECTOR     1       3     LDP ENG
WI
  WI-PRD-042   D/A DO & DON’T DO VISUAL AID     2       3     LDP PROD

 

Table of Contents

                             
Type   Document Number   Doc Title   Doc Rev   Doc Level (1/2/3/4)   DEPT
WI
  WI-PRD-043   D/P TRAINING MANUAL FOR OPERATOR AND INSPECTOR     1       3     LDP ENG
WI
  WI-PRD-044   EVI TRAINING MANUAL FOR OPERATOR AND QA INSPECTOR     0       3     LDP PROD
WI
  WI-PRD-045   MOLD & PMC TRAINING MANUAL FOR OPERATOR & INSPECTOR     0       3     LDP PROD
WI
  WI-PRD-046   M/D DO & DON’T VISUAL AID     0       3     LDP PROD
WI
  WI-PRD-047   M/F TRAINING MANUAL OPERATOR AND QA INSPECTOR     0       3     LDP PROD
WI
  WI-PRD-048   M/F DO & DON’T VISUAL AID     0       3     LDP PROD
WI
  WI-PRD-049   M/K TRAINING MANUAL FOR OPERATOR AND QA INSPECTOR     0       3     LDP PROD
WI
  WI-PRD-050   MK DO & DON’T VISUAL AID     1       3     LDP PROD
WI
  WI-PRD-051   T/F TRAINING MANUAL FOR OPERATOR AND QA INSPECTOR     0       3     LDP PROD
WI
  WI-PRD-052   TF DO & DON’T VISUAL AID     0       3     LDP PROD
WI
  WI-PRD-053   W/B TRAINING MANUAL FOR OPERATOR AND INSPECTOR     1       3     LDP PROD
WI
  WI-PRD-055   PROCEDURE FOR DUMMY L/F SAVING     0       3     LDP PROD
WI
  WI-PRD-057   MESPLUS LOT MOVEMENT OPERATION MANUAL     0       3     LDP PROD
WI
  WI-PRD-058   LDP LINE XXXX DEFINE     0       3     LDP PROD
WI
  WI-TST-013   BARCODE PRINTER OPERATION GUIDELINE     2       3     LDP TEST
WI
  WI-TST-039   LATTICE TUBE PACKING METHOD     5       3     LDP TEST
WI
  WI-QA-108   CETS Packing Trainning Manual For Operator     0       3     LDP PROD
WI
  WI-QA-147   D/P DO & DON’T DO VISUAL AID     2       3     LDP PROD
WI
  WI-QA-148   EVI DO & DON’T DO VISUAL AID     0       3     LDP PROD
WI
  WI-QA-161   WB DO & DON’T DO VISUAL AID     2       3     LDP PROD

 

Table of Contents

Technical Specifications — Test

 

Table of Contents

DOCUMENT RECEIVING LIST
                     
NO.   REC. DATE   DOC. NO.   DOC. TITLE   REV.
1
    2004.12.17     WI-ENG-059   WORKMANSHIP OF WRIST STRAP   B
2
    2005.10.13     WI-TST-006   STRAY UNITS HANDLING GUIDELINE   B
3
    2004.12.22     WI-TST-010   TEST EQUIPMENT CLEANING POLICY   A
4
    2000.12.15     WI-TST-026   T-CARD AND TEST SUMMARY CHECK PROCEDURE   B
5
    2005.06.07     WI-TST-044   REJECT HANDLING PROCEDURE OF TEST OPERATION   E
6
    2004.12.14     WI-TST-084   LTX MODULE/BOARD REPLACEMENT INSTRUCTION   A
7
    2003.09.22     WI-TST-085   ETS364 DOCKING WORK INSTRUCTION   O
8
    2004.11.15     WI-TST-095   INTERSIL BIN CART LABELING WORK INSTRUCTION   A
9
    2004.12.17     WI-TST-099   YAMAOICHI TEST CONTACTORS CLEANING PROCEDURE   A
10
    2004.11.15     WI-TST-112   PRODUCTION INTERRUPTION   A
11
    2004.11.15     WI-TST-119   TEST PRODUCT IDENTIFICATION   A
12
    2004.10.12     WI-TST-143   FT POSITROL LOG FILLING METHOD   O
13
    2005.09.20     WI-TST-194   LOCATION INDICATE OF TEST BANK SHELF   O
14
    2005.11.15     WI-TST-198   TEST OPERATION MATERIAL RECYCLE PROCEDURE   O
15
    2005.11.15     WI-TST-210   TOTE BOX COV ER PURPOSE AND PROCEDURE   O

 

Table of Contents

DOCUMENT RECEIVING LIST
                 
NO.   REC. DATE   DOC. NO.   DOC. TITLE   REV.
1
   2004.12.22   CMT143-0004   MCT-5100 HANDLER JAM CLEAR SPECIFICATION   B
2
   2004.12.22   CMT143-0006   MCT-3608/3616 HANDLER JAM CLEAR SPECIFICATION   C
3
   2005.08.02   CMT143-0009   BAKE OVEN OPERATION SPEC.   E
4
   2004.12.22   CMT143-0013   NEW EQUIPMENT SETUP PROCEDURE   C
5
   2004.12.22   CMT143-0014   MACHINE QUALIFICATION FOR ELECTRICAL TEST   B
6
   2004.12.20   CMT143-0016   TEST LOAD BOARD & ADAPTOR P.M SPECIFICATAION   B
7
   2005.06.07   CMT143-0020   TEST EQUIPMENT JAM CLEAR PROCEDURE   F
8
       CMT143-0036   LOAD BOARD CONTROL SPECIFICATION   6
13
   2004.12.20   CMT143-0071   SPARE PARTS CONTROL PROCEDURE   A
15
   2005.01.05   CMT143-0079   TEST EQUIPMENT CONTROL SPECIFICATION   A
17
   2004.12.15   CMT143-0101   SPARE PARTS VERIFICATION PROCEDURE SPECIFICATION   O
18
   2005.05.20   CMT143-0102   TEST EQUIPMENT BUY-OFF/QUALIFICATION PROCEDURE-TEST   B
19
   2005.04.28   CMT143-0104   PROCEDURE USED FOR ELECTRICAL TEST SET-UP BUY-OFF   A
20
   2004.12.14   CMT143-0105   XXX 0000 HANDLER JAM CLEAR SPECIFICATION-TEST   O
21
   2004.12.14   XXX000-0000   XXXXX HANDLER JAM CLEAR SPECIFICATION-TEST   O
22
   2004.12.15   CMT143-0108   MTT93XX HANDLER JAM CLEAR SPECIFICATION-TEST   O
23
   2004.12.14   XXX000-0000   XXXXXX HANDLER JAM CLEAR SPECIFICATION-TEST   O
24
   2004.12.15   CMT143-0110   MTT-85XX HANDLER JAM CLEAR SPECIFICATION-TEST   O
25
   2004.12.14   CMT143-0111   AET5050X HANDLER JAM CLEAR SPECIFICATION-TEST   O

 

Table of Contents

DOCUMENT RECEIVING LIST
                     
NO.   REC. DATE   DOC. NO.   DOC. TITLE   REV.
1
    2005.10.10     CMT140-0044   STANDARD SCC FINAL TEST BASELINE SPECS   O
2
              All other customer baseline can only be transferred once customer approved.    

 

Table of Contents

DOCUMENT RECEIVING LIST
                     
NO.   REC. DATE   DOC. NO.   DOC. TITLE   REV.
1
    2004.12.22     CMT141-0002   MCT 5100 HANDLER OPERATING SPEC.   C
2
    2004.12.22     CMT141-0003   MCT3608/3616 HANDLER OPERATING SPEC   D
3
    2005.06.17     CMT141-0006   MH802 HANDLER OPERATION SPECIFICATION   C
4
    2004.12.22     CMT141-0008   SO1000 H HANDLER OPERATION SPECIFICATION   B
5
    2004.12.22     CMT141-0023   SYMTEK300 HANDLER OPERATION SPECIFICATION   A
6
    2005.06.13     CMT141-0035   ASECO S-130 HANDLER OPERATION SPECIFICATION   B
7
    2004.12.22     CMT141-0044   MULTITEST MT9308 HANDLER OPERATING SPEC   A
8
    2005.06.17     CMT141-0047   MULTITEST9918 HANDLER OPERATION SPECIFICATION   O
9
    2005.06.17     XXX000-0000   XXXXXX HANDLER OPERATION SPECIFICATION   O
10
    2005.06.17     CMT141-0050   ASM HANDLER OPERATION SPECIFICATION   O
11
    2004.11.08     CMT141-0061   MULTITEST 85XX OPERATION SPECTIFICATION   A
12
    2004.11.08     CMT141-0062   MULTITEST 85XX OPERATION SPECTIFICATION   A
13
    2005.04.20     CMT141-0073   AET5050X HANDLER OPERATION SPECIFICATION   O
14
    2005.06.13     CMT141-0074   MULTITEST-8704 HANDLER OPERATION SPECIFICATION   O
15
    2005.06.13     CMT141-0075   AETRIUM3300 HANDLER OPERAION SPECIFICATION   O
16
    2005.04.29     CMT144-0001   ELECTRICAL TEST PROCEDURE SPECIFICATION   H
17
    2005.09.08     CMT144-0012   MASTER DEVICE CONTROL PROCEDURE   D
18
    2005.08.11     CMT144-0016   TEST LOT RECEIVING AND DISPATCHING PROCEDURE   B
19
    2005.07.07     CMT144-0033   SET-UP VERIFICATION PROCEDURE   O
20
    2004.12.17     CMT145-0001   GENERAL WORKMANSHIP STANAARD SPEC. FOR TEST FLOOR   D
21
    2004.12.20     CMT145-0004   TEST CONTROL CENTER CONTROL SPECIFICATION   A
22
          CMT145-0007   OPERATION PROCEDURE OF TEST ONLY PRODUCT   D
23
    2005.05.20     CMT152-0001   QA ELECTRICAL TEST PROCEDURE   C
24
    2004.12.15     CMT152-0002   DATA RETENTION QA PROCEDURE   B

 

Table of Contents

DOCUMENT RECEIVING LIST
                         
NO.   REC. DATE   DOC. NO.   DOC. TITLE   REV.
1
    2005.01.14     XXXX-00-000   XXXX FOR RECYLCE TUBE     O  
2
    2005.11.08     TCMGENQC   IN-PROCESS QC TOTAL CONTROL METHODOLOGY     Q  
3
    2005.08.02     TCMTSTET   TOTAL CONTROL METHODLOGY FOR CPS FINAL TEST     F  
4
    2005.11.24     FMEA-TSTET-001   FINAL TEST PROCESS FMEA     O  
5
    2006.02.07     CP-CPS-TST-001   SCC STANDARD TEST CONTROL PLAN     14  

 

Table of Contents

DOCUMENT RECEIVING LIST
                             
NO.   REC. DATE   DOC. NO.   DOC. TITLE   REV.
1
    2004.12.15     PM-0167   CREDENCE TESTER     A  
2
    2004.12.13     PM-0168   EPRO142AX     A  
3
    2004.12.15     PM-0169   EAGLE TESTER     B  
4
    2004.12.15     PM-0170   Q2/62       A  
5
    2005.04.29     PM-0172   AAT100&AAT200     B  
6
    2006.3.13     PM-0173   ASECO130/150     5  
7
    2006.3.15     PM-0175   36XX/SESS     5  
8
    2005.4.12     PM-0178   MH-802     B  
9
    2006.3.15     PM-0180   85XX     5  
10
    2006.3.15     PM-0181   93XX     6  
11
    2006.3.15     PM-0182   SOX000     6  
12
    2005.11.2     PM-0183   SYMTEK     C  
13
    2005.10.25     PM-0186   LTX77     B  
14
    2005.10.25     PM-0187   A360     B  
15
    2005.10.25     PM-0188   A580     B  
16
    2004.12.17     PM-0190   MAVERICK PT/VT/GT     A  
17
    2004.12.15     PM-0191   ASL1000     A  
18
    2004.12.15     PM-0192   TSA     A  
19
    2004.12.17     PM-0193   SZ M3650 TESTER PM INSTRUCTION     A  
20
    2006.3.14     PM-0194   AETR-5050S     7  
21
    2005.11.2     PM-0195   KUWANO/LT-930-H222     E  
22
    2004.12.15     PM-0196   HP949X     A  
23
    2005.11.2     PM-0202   9918     C  
24
    2005.11.2     PM-0204   AETRIUM 3300     C  
25
    2004.12.06     PM-0212   BLUE-M     A  
26
    2004.12.06     PM-0230   FT1000     O  
27
    2005.11.2     PM-0231   8704     C  
28
          PM-0234   TERADYNE TESTER J750     A  
29
    2005.03.08     PM-0235   INTERFACE CABLE BETWEEN TESTER AND HANDLER     O  
30
    2005.07.08     PM-0239   SZM3670 TESTER     O  

 

Table of Contents

DOCUMENT RECEIVING LIST
                     
NO.   REC. DATE   DOC. NO.   DOC. TITLE   REV.
1
    2005.10.28     CAL-124   VISTA/DUO/QUARTET TESTER SYSTEM CAL   B
2
    2005.10.28     XXX-000   XXXX-000XX SYSTEM CALIBRATION INSTRUCTION   B
3
    2005.10.28     CAL-126   ETS364 SYSTEM CALIBRATION INSTRUCTION   C
4
    2005.10.28     CAL-127   Q2 TESTER SYSTEM CAL SPECIFICATION   B
5
    2005.10.5     CAL-129   ASECO130/150 TEMP CALIBRATION INSTRUCTION   D
6
    2005.6.17     CAL-130   ASM CALIBRATION INSTRUCTION   B
7
    2005.10.5     CAL-132   MCT-36** HANDLER CALIBRATION INSTRUCTION   D
8
    2004.12.20     XXX-000   XX-000 HANDLER CALIBRATION INSTRUCTION   C
9
    2005.10.5     CAL-136   MT-85XX CALIBRATION SPECIFICATION   E
10
    2005.10.5     CAL-137   MULTITEST-93XX HANDLER CALIBRATION INSTRUCTION   G
11
    2005.10.5     XXX-000   XX0000X/XX/X HANDLER CALIBRATION INSTRUCTION   D
12
    2005.10.5     CAL-139   SYMTRK TEMP CALIBRATION INSTRUCTION   E
13
    2005.10.25     CAL-142   A360 TEST SYSTEM CALIBRATION INSTRUCTION   B
14
    2005.10.26     CAL-143   A580 TEST SYSTEM CALIBRATION INSTRUCTION   B
15
    2005.10.28     CAL-145   ASL 1000 TESTER CALIBRATION SPECIFICATION   B
16
    2005.10.28     CAL-146   MAVERICK PT/VT/GT TESTER CALIBRATION INSTRUCTION   B
17
    2004.12.17     CAL-148   SZ M3650 TEST CALIBRATION INSTRUCTION   A
18
    2005.10.25     CAL-149   LTX77 SYSTEM CALIBRATION INSTRUCTION   H
19
    2005.10.5     CAL-151   KUWANO TEMP CALIBRATION INSTRUCTION   D
20
    2005.10.28     CAL-159   HP 949X TESTER CALIBTRTION INSTRUCTION   B
21
    2005.10.5     CAL-168   MULTITEST-9918 HANDLER CALIBRATION INSTRUCTION-TEST   C
22
    2005.01.18     CAL-173   LTX CALIBRATOR CALIBRATION INSTRUCTION   B
23
    2005.03.22     CAL-184   BLUE-M-OVEN CALIBRATION INSTRUCTION-TEST   B
24
    2005.10.5     CAL-188   MHZ2655 CALIBRATION INSTRUCTION   A
25
    2005.10.25     CAL-192   TERADYNE J750 TEST SYSTEM CALIBRATION   A
26
    2005.10.5     CAL-200   AETRIUM5050X HANDLER CALIBRATION INSTRUCTION-TEST   A
27
    2005.10.5     CAL-201   MULTITEST-8704 HANDLER CALIBRATION INSTRUCTION-TEST   A
28
    2005.7.8     CAL-205   SZ M3670 TESTER CALIBRATION INSTRUCTION   O
29
    2005.09.28     CAL-207   A312 TEST SYSTEM CALIBRATION INSTRUCTION   O

 

Table of Contents

FVI SPEC LIST
                         
NO.   XXX.XXXX   XXX.XX.   XXXX.XXXXX   REV.
1
    2005.7.25     CPS-E-08   ESD Control Procedure     15  
2
    2004.11.26     WI-TST-021   SCC tested product standard packing method     C  
3
    2004.11.26     WI-TST-034   T-CARD PACKING METHOD FOR SCC TEST     B  
4
    2004.11.18     WI-TST-035   DISPOSITION FOR T&R REJECTS     C  
5
    2004.11.18     WI-TST-037   Product rework procdedure     B  
6
    2006.2.8     WI-TST-226   Rework procedure for Post Test     0  
7
    2006.2.2     FMEA-TETFVI-001   FMEA for FVI     0  
8
    2005.5.25     VPD5-00009-0   Visual Aid for Tube Product     0  
9
    2005.10.31     CMT140-0019   Tube/Tray/Plug/Plastic Bag/ToteBox Recycle Procedure     G  
10
    2004.12.1     CMT141-0072   ATM AT&ATS LEAD STRAIGHTENER OPERATION PROCEDURE SPECIFICATION     O  
11
    2005.11.1     CMT144-0002   FINAL VISUAL INSPECTION PROCEDURE     J  
12
    2004.12.17     CMT144-0015   LEAD SCANNING PROCEDURE SPEC     F  
13
    2005.11.25     CMT145-0006   Packing material spec     F  

 

Table of Contents

IPK SPEC LIST
                         
NO.   XXX.XXXX   XXX.XX.   XXXX.XXXXX   REV.
60
    2006.2.7     CP-CPS-TST-0001   SCC STANDARD TEST CONTROL PLAN     14  
61
    2005.7.22     XXXX-00-000   XXXX for IPK     B  

 

Table of Contents

TnR SPEC LIST
                         
NO.   XXX.XXXX   XXX.XX.   XXXX.XXXXX   REV.
1
    2006.2.7     FMEA-TSTTR-001   FMEA for Lead Scan/Tape and Reel     O  
2
    2005.4.1     VPD3-00001-6   VISUAL AID for T&R     6  
3
    2005.6.6     VPD4-00001-3   TnR System Critical Sensor Check     3  
4
    2005.2.4     VPD5-00003-0   Proper xxxx teaching done by opetators     O  
6
    2005.11.24     CAL-161   GENERAL CALIBRATION PROCEDURE FOR T/R MACHINE     B  
7
    2004.11.18     CMT141-0010   TR18ASII TAPE & REEL MACHINE OPERATION PROCEDURE SPECIFICATION     C  
9
    2004.12.30     CMT141-0014   MV851 IC LEAD/XXXX INSPECTOR OPERATING SPECIFITION     B  
10
    2004.11.15     CMT141-0017   PBFT-856VS PEEL BACK FORCE TESTER OPERATION PROCEDURE SPECIFICATION     B  
11
    2004.11.15     CMT141-0018   AT8005 LEAD/XXXX INSPECTION SYSTEM WITH TAPE & REEL OPERATION PROCEDURE SPECIFICATION     B  
12
    2004.11.1     CMT141-0038   AT28 TAPE & REEL MACHINE OPERATION PROCEDURE SPECIFICATION     B  
13
    2005.6.3     CMT141-0055   G6 Tape & Reel Machine Operation Specification     O  
14
    2004.11.15     CMT141-0056   AT128 TAPE & REEL MACHINE OPERATION PROCEDURE SPECIFICATION     O  
15
    2004.11.15     CMT141-0063   TAPE & REEL MACHINE RELEASE TO PRODUCTION SPECIFICATION     A  
16
    2004.12.1     CMT141-0072   ATM AT & ATS LEAD STRAIGHTENER OPERATION PROCEDURE SPECIFICATION     O  
17
    2004.11.1     CMT143-0026   TR18ASII TAPE & REEL MACHINE PM & CALIBRATION PROCEDURE SPECIFICATION     F  
18
    2004.11.1     CMT143-0031   MV851 IC XXXX/LEAD INSPECTOR PM & CALIBRATION PROCEDURE SPECIFICATION     C  
19
    2004.11.8     CMT143-0034   PBFT-856VS PEEL BACK FORCE TESTER PM & CALIBRATION PROCEDURE SPECIFICATION     B  
20
    2004.12.29     CMT143-0035   AT8005 LEAD/XXXX INSPECTION SYSTEM PM SPECIFICATION     B  
21
    2004.11.3     CMT143-0056   AT-28 TAPE & REEL MACHINE PM & CALIBRATION PROCEDURE SPECIFICATION     C  
22
    2004.11.15     CMT143-0085   AT-128 TAPE & REEL MACHINE PM & CALIBRATION PROCEDUIRE SPECIFICATION     A  
23
    2004.11.15     CMT143-0097   G6 TAPE & REEL MACHINE PM & CALIBRATION PROCEDURE SPECIFICATION     A  
24
    2006.2.7     CMT144-0010   Lead Scan and Tape & Reel procedure spec     24  
25
    2004.12.17     CMT144-0015   LEAD SCANNING PROCEDURE SPEC     F  
26
    2005.11.25     CMT145-0006   Packing material spec     F  
27
    2005.11.30     CMT145-0007   OPERATION PROCEDURE of TEST ONLY PRODUCT     D  

 

Table of Contents

APPENDIX 3
TRANSFER PLAN
The Transfer Plan may be amended and updated from time to time by mutual agreement of SCC and ANST in writing
Transfer Plan (Macro view)
                                                     
  May’06 Jun Jul Aug Sep Oct Nov   Dec Jan   Feb   Mar   Apr   May
PDIP >
 
       Rest of PDIP                          
SOIC         >
 
       SOIC                    
PLCC
            >
 
   PLCC                    
TSSOP
                >
 
       TSSOP            
MSOP
                    >
 
       MSOP        
SSOP
                        > 
 
       SSOP    
 
Comments:
 
1.   PDIC + PLCC + SOIC = 80% of total revenue
 
2.   —— “ —— quals by end Jan.
 
3.   Review forecast to focus on high volume SOIC packages
 
4.   MOU discussions — 1 year total transfer period
 
5.   Current transfer plan — ramp up 80% of volume in 8 mths.
 
6.   PDIP determines rate of trf. Speed-up (best case) — by 2 mths.

19

Table of Contents

SCHEDULE
DEFINITION OF “COMMERCIALLY REASONABLE EFFORTS” BY SCC FOR THE
PURPOSES OF CLAUSE 5.2 OF THIS AGREEMENT
1.   Letter from CEO of SCC to the active SCL Customers
 
2.   Presentation to the SCL Customers to introduce ANST
 
3.   Organise one (1) meeting for each active SCL Customer
 
4.   Technical interface through first qualification build
 
5.   Sending its engineers and operators to the premises of ANST and provide 3000 man hours on-site operational support to ANST (at ANST’s cost)
 
6.   Devote adequate time and effort of executive management, including 100 man hours by the Managing Director or Plant Manager of SCC and 250 man hours each by two (2) directors of SCC
 
7.   Provide Customer Service Support to ANST and the Transfer Customers, including to prepare customer interface and reports
 
8.   Provide cross training to the engineers and maintenance personnel of ANST at the premises of SCC
 
9.   Transfer information and details of process know-how (including control plans and process specifications), Recipe and Best Practices, Build of material and Source of Supply
 
10.   Conduct quality assurance audits on ANST and provide quality management training

20

Table of Contents

IN WITNESS WHEREOF the Parties have hereunto set their hands.
SCC
                 
SIGNED by
    )          
Tan Lay Koon
    )          
for and on behalf of
    )          
STAT ChipPAC Shanghai Co., Ltd.
    )          
in the presence of:
    )     /s/ Tan Lay Koon
 
    
 
          Name: Tan Lay Koon    
 
          Title: President & CEO    
 
                
Name:
                
Title:
                
 
                
SCL
                
 
                
SIGNED by
    )          
Tan Lay Koon
    )          
for and on behalf of
    )          
STAT ChipPAC Ltd.
    )          
in the presence of:
    )     /s/ Tan Lay Koon
 
    
 
          Name: Tan Lay Koon    
 
          Title: President & CEO    
 
                
Name:
                
Title:
                
 
                
ANST
                
 
                
SIGNED by
    )          
Xxxx Xxxxxxx
    )          
for and on behalf of
    )          
Wuxi CR Micro-Assemb Tech. Ltd.
    )          
in the presence of:
    )     /s/ Xxxx Xxxxxxx    
 
               
 
          Name: Xxxx Xxxxxxx    
 
          Title: Director and Chief Executive Officer    
 
                
Name:
                
Title:
                
 
                
CRL
                
 
                
SIGNED by
    )          
Xxxx Xxxxxxx
    )          
for and on behalf of
    )          
China Resources Logic Limited
    )          
in the presence of:
    )     /s/ Xxxx Xxxxxxx    
 
               
 
          Name: Xxxx Xxxxxxx    
 
          Title: Director and Chief Executive Officer    
 
                
Name:
                
Title:
                

21

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Filed: March 12th, 2007
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