EXHIBIT 10.22 NEITHER THIS WARRANT NOR THE SECURITIES ISSUABLE UPON THE EXERCISE HEREOF HAVE BEEN REGISTERED UNDER THE SECURITIES ACT OF 1933, AS AMENDED, OR ANY STATE SECURITIES LAWS. NO SALE OR DISPOSITION THEREOF MAY BE EFFECTED WITHOUT (i)...Integrated Packaging Assembly Corp • November 3rd, 1997 • Semiconductors & related devices • California
AMENDMENT TO LOAN AND SECURITY AGREEMENTLoan and Security Agreement • May 16th, 2001 • Integrated Packaging Assembly Corp • Semiconductors & related devices • California
LEASE AGREEMENT This Lease Agreement is made by and between Jaswinder S. Saini and Surinder K. Saini, hereinafter, "Landlord", and Integrated Packaging Assembly Corporation (IPAC), a California corporation, and its assigns, hereinafter, "Tenant", to...Lease Agreement • November 3rd, 1997 • Integrated Packaging Assembly Corp • Semiconductors & related devices
5. REPRESENTATIONS AND WARRANTIES 12 5.1. Due Organization and Qualification 12 5.2. Due Authorization; No Conflict 12 5.3. No Prior Encumbrances 12 5.4. Intellectual Property 12 5.5. Name; Location of Chief Executive Office 13 5.6. Financial...Loan and Security Agreement • March 10th, 1999 • Integrated Packaging Assembly Corp • Semiconductors & related devices • California
EXHIBIT 4.1 STOCK PURCHASE AGREEMENTStock Purchase Agreement • May 7th, 1999 • Integrated Packaging Assembly Corp • Semiconductors & related devices • California
INTEGRATED PACKAGING ASSEMBLY CORPORATION AND OSE, INC.Loan and Security Agreement • March 30th, 2001 • Integrated Packaging Assembly Corp • Semiconductors & related devices • California
INTEGRATED PACKAGING ASSEMBLY CORPORATION LOAN AND SECURITY AGREEMENT BANK SINOPAC, LOS ANGELES BRANCH ADMINISTRATIVE AGENT FAR EAST NATIONAL BANK SERVICING AGENT This LOAN AND SECURITY AGREEMENT is entered into as of September 17, 1999, by and among...Loan and Security Agreement • November 17th, 1999 • Integrated Packaging Assembly Corp • Semiconductors & related devices • California
THIS WARRANT ANND THE SECURITIES ISSUABLE UPON TRE EXERCISE HEREOF HAVE NOT BEEN REGISTERED UNDER THE SECURITIES ACT OF 1933, AS AMENDED~ OR ANY STATE SECURITIES LAWS. THEY MAY NOT BE SOLD OR OFFERED FOR SALE IN THE ABSENCE OF AN EFFECTIVE...Integrated Packaging Assembly Corp • March 29th, 2000 • Semiconductors & related devices
EXHIBIT 10.30 THIS WARRANT AND THE SHARES ISSUABLE HEREUNDER HAVE NOT BEEN REGISTERED UNDER THE SECURITIES ACT OF 1933, AS AMENDED, AND MAY NOT BE SOLD, PLEDGED, OR OTHERWISE TRANSFERRED ~HOUT AN EFFECTIVE REGISTRATION THEREOF UNDER SUCH ACT OR...Antidilution Agreement • March 30th, 1998 • Integrated Packaging Assembly Corp • Semiconductors & related devices • California
Exhibit 10.39 CHANGE IN TERMS AGREEMENTChange in Terms Agreement • March 30th, 2001 • Integrated Packaging Assembly Corp • Semiconductors & related devices • California
-------------------------------------------------------------------------------- References in the shaded area are for Lender's use only and do not limit the applicability of this document to any particular loan or item. Any item above containing "*****" has been omitted due to text length limitations. --------------------------------------------------------------------------------
EXHIBIT 10.26 Silicon Valley Financial Services A Division of Silicon Valley Bank 3003 Tasman Drive Santa Clara, Ca. 95054 (408) 654-1000 - Fax (408) 980-6410 ACCOUNTS RECEIVABLE PURCHASE AGREEMENT This Accounts Receivable Purchase Agreement (the...Accounts Receivable Purchase Agreement • March 10th, 1999 • Integrated Packaging Assembly Corp • Semiconductors & related devices • California
EXHIBIT 10.27 ACCOUNTS RECEIVABLE PURCHASE MODIFICATION AGREEMENT This Accounts Receivable Purchase Modification Agreement is entered into as of December 8, 1998, by and between Integrated Packaging Assembly Corporation (the "Seller") whose address is...Accounts Receivable Purchase Modification Agreement • March 10th, 1999 • Integrated Packaging Assembly Corp • Semiconductors & related devices
AGREEMENT ---------Agreement of Guaranty • March 31st, 1997 • Integrated Packaging Assembly Corp • Semiconductors & related devices • California
NEITHER THIS WARRANT NOR THE SECURITIES ISSUABLE UPON THE EXERCISE HEREOF HAVE BEEN REGISTERED UNDER THE SECURITIES ACT OF 1933, AS AMENDED, OR ANY STATE SECURITIES LAWS. NO SALE OR DISPOSITION THEREOF MAY BE EFFECTED WITHOUT (I) EFFECTIVE...Integrated Packaging Assembly Corp • March 29th, 2000 • Semiconductors & related devices • California
RECITALSFirst Refusal Agreement • May 7th, 1999 • Integrated Packaging Assembly Corp • Semiconductors & related devices • California
RECITALSPurchase and Sale Agreement • January 30th, 1998 • Integrated Packaging Assembly Corp • Semiconductors & related devices • California
Exhibit 10.42 CHANGE IN TERMS AGREEMENTBusiness Loan Agreement • March 30th, 2001 • Integrated Packaging Assembly Corp • Semiconductors & related devices • California
THIS BUSINESS LOAN AGREEMENT dated November 29, 2000, is made and executed between Integrated Packaging Assembly Corporation; and OSE, Inc. ("Borrower") and Bank SinoPac, Los Angeles Branch ("Lender") on the following terms and conditions. Borrower has received prior commercial loans from Lender or has applied to Lender for a commercial loan or loans or other financial accommodations, including those which may be described on any exhibit or schedule attached to this Agreement ("Loan"). Borrower understands and agrees that: (A) in granting, renewing, or extending any Loan, Lender is relying upon Borrower's representations, warranties, and agreements as set forth in this Agreement, and (B) all such Loans shall be and remain subject to the terms and conditions of this Agreement.
BUSINESS LOAN AGREEMENT Principal: $7,000.000.00 Loan Date: 03-23-2000 Maturity: 07-31-2000 LOAN NO: 115-20091 CALL: COLLATERAL: ACCOUNT: OFFICER: SC INITIALS: References in the shared area are for Lender's use only and do not limit the applicability...Business Loan Agreement • May 17th, 2000 • Integrated Packaging Assembly Corp • Semiconductors & related devices • California
SECOND AMENDMENT TO WARRANT TO PURCHASE 12,800 SHARES OF SERIES A PREFERRED STOCK This Amendment to Warrant to Purchase 12,800 Shares of Series A Preferred Stock (the "Amendment") is entered into as of May 1, 1999, by and between MMC/GATX Partnership...Integrated Packaging Assembly Corp • March 29th, 2000 • Semiconductors & related devices
RECITALS --------Integrated Packaging Assembly Corp • November 3rd, 1997 • Semiconductors & related devices
SECOND AMENDMENT TO WARRANT TO PURCHASE l00,000 SHARES OF SERIES A PREFERRED STOCK This Second Amendment to Warrant to Purchase 100,000 Shares of Series A Preferred Stock (the "Amendment") is entered into as of May 1, 1999, by and between MMC/GATX...Integrated Packaging Assembly Corp • March 29th, 2000 • Semiconductors & related devices
EXCHANGE AGREEMENTExchange Agreement • August 14th, 2002 • Ose Usa Inc • Semiconductors & related devices • Delaware
THIS EXCHANGE AGREEMENT (this “Agreement”) dated as of August 9, 2002, is entered into by and between OSE USA, Inc., a Delaware corporation (the “Corporation”), and Orient Semiconductor Electronics, Limited (Taiwan)(“OSEL”).
LEASE AMENDMENTLease Amendment • March 26th, 2004 • Ose Usa Inc • Semiconductors & related devices
This lease amendment agreement (“Agreement”) is made as of the 4th day of September 2003, by and between OSE USA, Inc., a Delaware corporation (“lessee”), and Joseph A. Sully (“owner”) as assigned by Lincoln-Recp Old Oakland OPCO. LLC.
AMENDMENT TO OSE INC. EXCLUSIVE SALES DISTRIBUTOR AGREEMENTExclusive Sales Distributor Agreement • March 26th, 2004 • Ose Usa Inc • Semiconductors & related devices
This Amendment (the “Amendment”) to OSE Inc. Exclusive Sales Distributor Agreement dated October 29, 1999 (the “Agreement”) is made and entered into this day of March, 2003 (the “Effective Date”), between Orient Semiconductor Electronics Ltd., a Taiwanese corporation (“Manufacturer”) and OSE Inc. (U.S.), a California corporation (“Distributor”).
AMENDMENT TO BUSINESS LOAN AGREEMENT AND PROMISSORY NOTEBusiness Loan Agreement and Promissory Note • November 17th, 1999 • Integrated Packaging Assembly Corp • Semiconductors & related devices
EXHIBIT 2.1 =================================================================== ============= AGREEMENT FOR PURCHASE AND SALE OF COMMON STOCK BY AND AMONG INTEGRATED PACKAGING ASSEMBLY CORPORATION, OSE, INC. AND THE SHAREHOLDERS OF OSE, INC. October...Integrated Packaging Assembly Corp • November 15th, 1999 • Semiconductors & related devices • California
AMENDMENT TO LOAN AND SECURITY AGREEMENTLoan and Security Agreement • November 17th, 1999 • Integrated Packaging Assembly Corp • Semiconductors & related devices
EXHIBIT 10.21 ENVIRONMENTAL AGREEMENT AND INDEMNITY ------------------------------------- THIS ENVIRONMENTAL AGREEMENT AND INDEMNITY (this "Agreement") is made and entered into as of March 24, 1997 by IPAC Properties, a California corporation...Environmental Agreement • March 31st, 1997 • Integrated Packaging Assembly Corp • Semiconductors & related devices • California
AMENDMENT TO LOAN AND SECURITY AGREEMENTLoan and Security Agreement • March 31st, 2003 • Ose Usa Inc • Semiconductors & related devices
This Amendment to Loan and Security Agreement is entered into as of February 15, 2001 (the “Amendment”), by and between BANK SINOPAC, LOS ANGELES BRANCH and FAR EAST NATIONAL BANK (individually, a “Lender” and collectively, the “Lenders”) and INTEGRATED PACKAGING ASSEMBLY CORPORATION, a Delaware corporation, and OSE, INC., a California corporation (individually a “Borrower” and collectively, the “Borrowers”).
AMENDMENT TO WARRANT TO PURCHASE 100,000 SHARES OF SERIES A PREFERRED STOCK ------------------------Integrated Packaging Assembly Corp • November 3rd, 1997 • Semiconductors & related devices
ASSET PURCHASE AGREEMENTAsset Purchase Agreement • September 16th, 2003 • Ose Usa Inc • Semiconductors & related devices • California
This asset purchase agreement (“Agreement”) is made as of the 3rd day of September, 2003, by and between OSE USA, Inc., a Delaware corporation (“Seller”), and Integrated Packaging Assembly Corporation, a California corporation (“Purchaser”).
AMENDMENT TO WARRANT TO PURCHASE 72,9l7 SHARES OF COMMON STOCK This Amendment to Warrant to Purchase 72,917 Shares of Common Stock (the "Amendment") is entered into as of May 1, 1999, by and between MMC/GATX Partnership No.1 ("Partnership") and...Integrated Packaging Assembly Corp • March 29th, 2000 • Semiconductors & related devices
AMENDMENT TO BUSINESS LOAN AGREEMENT AND PROMISORY NOTEBusiness Loan Agreement and Promisory Note • May 17th, 2000 • Integrated Packaging Assembly Corp • Semiconductors & related devices
Article 2 DURATION OF THE AGREEMENT -------------------------Exclusive Sales Distributor Agreement • November 15th, 1999 • Integrated Packaging Assembly Corp • Semiconductors & related devices • California
AMENDMENT TO LOAN AND SECURITY AGREEMENTLoan and Security Agreement • March 31st, 2003 • Ose Usa Inc • Semiconductors & related devices • California
This Amendment to Loan and Security Agreement is entered into as of August 15, 2001 (the “Amendment”), by and between BANK SINOPAC, LOS ANGELES BRANCH and FAR EAST NATIONAL BANK (individually, a “Lender” and collectively, the “Lenders”) and OSE USA, INC. (fka “INTEGRATED PACKAGING ASSEMBLY CORPORATION”), a Delaware corporation, and OSE, INC., a California corporation (individually a “Borrower” and collectively, the “Borrowers”).
