EXECUTION VERSION CREDIT AGREEMENT (364-DAY) Dated as of December 6, 2001Credit Agreement • May 13th, 2002 • Sanmina-Sci Corp • Printed circuit boards • California
ARTICLE ONE DEFINITIONS AND OTHER PROVISIONS OF GENERAL APPLICATION SECTION 101. Definitions.................................................. 1 SECTION 102. Compliance Certificates and Opinions......................... 42 SECTION 103. Form of...Indenture • February 11th, 2003 • Sanmina-Sci Corp • Printed circuit boards • New York
RECITALSVoting Agreement • August 10th, 2001 • Sanmina Corp/De • Printed circuit boards • Delaware
ADDENDUM TO ASSET PURCHASE AGREEMENT RELATING TO REAL ESTATE MATTERSAsset Purchase Agreement • November 15th, 1996 • Sanmina Corp/De • Printed circuit boards • Delaware
EXHIBIT 4.11 AMENDMENT NO. 1 TO CREDIT AGREEMENT AMENDMENT NO. 1 TO CREDIT AGREEMENT (this "AMENDMENT"), dated as of June 30, 2003, among Sanmina-SCI Corporation, a Delaware corporation ("COMPANY"), each of the Guarantors listed on the signature pages...Credit Agreement • August 11th, 2003 • Sanmina-Sci Corp • Printed circuit boards • New York
EXHIBIT 10.48.2 SECOND AMENDMENT TO THIRD AMENDED AND RESTATED RECEIVABLES PURCHASE AGREEMENT This Second Amendment to Third Amended and Restated Receivables Purchase Agreement, dated as of October 8, 2002 (this "Amendment"), is among SCI FUNDING,...Receivables Purchase Agreement • December 4th, 2002 • Sanmina-Sci Corp • Printed circuit boards • New York
STATEMENT OF ELIGIBILITY UNDER THE TRUST INDENTURE ACT OF 1939 OF A CORPORATION DESIGNATED TO ACT AS TRUSTEESanmina Corp/De • May 16th, 2001 • Printed circuit boards
1 EXHIBIT 2.4 AMENDMENT TO MERGER AGREEMENT AMENDMENT, dated September 14, 2001, to AMENDED AND RESTATED AGREEMENT AND PLAN OF REORGANIZATION (the "AGREEMENT") made and entered into as of July 13, 2001, among Sanmina Corporation, a Delaware...Merger Agreement • September 26th, 2001 • Sanmina Corp/De • Printed circuit boards
December 23, 2002 Goldman, Sachs & Co., Banc of America Securities LLC Salomon Smith Barney Inc. Morgan Stanley & Co. Incorporated Merrill Lynch, Pierce, Fenner & Smith Incorporated Scotia Capital (USA) Inc. RBC Dominion Securities Corporation c/o...Rights Agreement • February 11th, 2003 • Sanmina-Sci Corp • Printed circuit boards • New York
AMENDMENT AGREEMENTAmendment Agreement • December 4th, 2002 • Sanmina-Sci Corp • Printed circuit boards • California
ARTICLE 1 RELATION TO BASE INDENTURE; DEFINITIONSSanmina-Sci Corp • December 4th, 2002 • Printed circuit boards • New York
Relating to 5 1/2% Convertible Subordinated Notes Due 2002Indenture • June 23rd, 1997 • Sanmina Corp/De • Printed circuit boards • New York
BY AND AMONGRegistration Rights Agreement • July 30th, 1999 • Sanmina Corp/De • Printed circuit boards • New York
1 EXHIBIT 4.3 REGISTRATION RIGHTS AGREEMENTRegistration Rights Agreement • November 20th, 2000 • Sanmina Corp/De • Printed circuit boards • New York
EXHIBIT 4.1 SCI SYSTEMS, INC. NON-QUALIFIED STOCK OPTION PLAN THIS INDENTURE made as of the 1st day of December, 1988, by SCI Systems (Alabama), Inc., a corporation organized and doing business under the laws of the State of Alabama; W I T N E S S E T...Sanmina-Sci Corp • May 9th, 2002 • Printed circuit boards • Alabama
EXHIBIT 4.6 CREDIT AND GUARANTY AGREEMENT DATED AS OF DECEMBER 23, 2002Credit and Guaranty Agreement • February 11th, 2003 • Sanmina-Sci Corp • Printed circuit boards • New York
Sanmina – SCI Corporation Underwriting AgreementUnderwriting Agreement • February 3rd, 2006 • Sanmina-Sci Corp • Printed circuit boards • New York
Sanmina-SCI Corporation, a corporation organized under the laws of Delaware (the “Company”), proposes to issue and sell to the several underwriters named in Schedule A hereto (the “Underwriters”), for whom you (the “Representatives”) are acting as representatives, $600,000,000 principal amount of its 8.125% Senior Subordinated Notes due 2016 (the “Notes”). The Notes will be guaranteed (collectively, the “Guarantees”) by each of the subsidiary guarantors named in Schedule B hereto (the “Notes Guarantors”). The Notes and the Guarantees are collectively referred to herein as the “Securities.” The Securities are to be issued under an indenture (the “Indenture”), to be dated as of the Closing Date (as defined in Section 4 hereof), among the Company, the Notes Guarantors and U.S. Bank National Association, as trustee (the “Trustee”). To the extent there are no additional underwriters listed on Schedule A other than you, the term Representatives as used herein shall mean you as the Underwrite
EXHIBIT 2.7 EMPLOYMENT AGREEMENT THIS AGREEMENT, by and among Sanmina Corporation, a Delaware corporation ("Sanmina"), SCI Systems, Inc., a Delaware corporation (the "Corporation"), and James E. Moylan (the "Executive"), dated as of this ____ day of...Employment Agreement • November 1st, 2001 • Sanmina Corp/De • Printed circuit boards • Delaware
STATEMENT OF ELIGIBILITY UNDER THE TRUST INDENTURE ACT OF 1939 OF A CORPORATION DESIGNATED TO ACT AS TRUSTEESanmina Corp/De • May 16th, 2001 • Printed circuit boards
1 EXHIBIT 2.1Registration Rights Agreement • April 14th, 1999 • Sanmina Corp/De • Printed circuit boards • California
EXECUTION VERSION CREDIT AGREEMENT (MULTI-YEAR) Dated as of December 6, 2001 among SANMINA CORPORATION and CERTAIN SUBSIDIARIES, as Borrowers, BANK OF AMERICA, N.A., as Administrative Agent and L/C Issuer, CITICORP USA, INC. as Syndication Agent,...Credit Agreement • May 13th, 2002 • Sanmina-Sci Corp • Printed circuit boards
ANDPreferred Stock Rights Agreement • May 25th, 2001 • Sanmina Corp/De • Printed circuit boards • Delaware
BY AND AMONGAgreement and Plan of Reorganization • July 17th, 2001 • Sanmina Corp/De • Printed circuit boards • Delaware
1 Exhibit 8.1 September 25, 1997 Sanmina Corporation 355 East Trimble Road San Jose, California 95131 Ladies and Gentlemen: This opinion is being delivered to you in accordance with Section 6.3(d) of the Agreement and Plan of Merger dated as of July...Sanmina Corp/De • September 26th, 1997 • Printed circuit boards
EXHIBIT 2.5 EMPLOYMENT AGREEMENT THIS AGREEMENT, by and between Sanmina Corporation ("Sanmina") and SCI SYSTEMS, INC., a Delaware corporation (the "Corporation"), and A. Eugene Sapp, Jr. (the "Executive"), dated as of this ____ day of _______, 2001. W...Employment Agreement • November 1st, 2001 • Sanmina Corp/De • Printed circuit boards • Delaware
EXHIBIT 4.10 SANMINA-SCI CORPORATION SECOND LIEN COLLATERAL TRUST AGREEMENT DATED AS OF DECEMBER 23, 2002Collateral Trust Agreement • February 11th, 2003 • Sanmina-Sci Corp • Printed circuit boards • New York
October 28, 1998Sanmina Corp/De • October 28th, 1998 • Printed circuit boards
1 EXHIBIT 8.1 August 10, 2001 Sanmina Corporation 2700 North First Street San Jose, CA 95134 Re: Merger pursuant to the Agreement and Plan of Reorganization (the "Agreement") dated July 13, 2001 among Sanmina Corporation, a Delaware corporation...Sanmina Corp/De • August 10th, 2001 • Printed circuit boards
FOURTH AMENDED AND RESTATED CREDIT AGREEMENT Dated as of November 30, 2018 amongCredit Agreement • February 7th, 2019 • Sanmina Corp • Printed circuit boards • New York
THIS FOURTH AMENDED AND RESTATED CREDIT AGREEMENT (this “Agreement”) is entered into as of November 30, 2018, among SANMINA CORPORATION, a Delaware corporation (the “Borrower”), each lender from time to time party hereto (collectively, the “Lenders” and individually, a “Lender”), and BANK OF AMERICA, N.A., as Administrative Agent, Swing Line Lender and an Issuing Lender.
1 EXHIBIT 10.0 AGREEMENT AND PLAN OF MERGER dated as of July 22, 1997, among SANMINA CORPORATION, a Delaware corporation ("Parent"), SANM ACQUISITION SUBSIDIARY, INC., a Delaware corporation and a wholly owned subsidiary of Parent ("Sub"), and ELEXSYS...Agreement and Plan of Merger • July 30th, 1997 • Sanmina Corp/De • Printed circuit boards • Delaware
Indenture Dated as of June 4, 2014 4.375% Senior Secured Notes due 2019Indenture • June 5th, 2014 • Sanmina Corp • Printed circuit boards • New York
INDENTURE, dated as of June 4, 2014, among Sanmina Corporation, a corporation duly organized and existing under the laws of the State of Delaware, as issuer (herein called the “Company”), having its principal executive offices at 2700 North First Street, San Jose, California 95134, the Notes Guarantors (as defined herein) and U.S. Bank National Association, as trustee (in such capacity, the “Trustee”) and as Notes Collateral Agent (in such capacity, the “Notes Collateral Agent”).
Indenture Dated as of May 10, 2011 7% Senior Notes due 2019Indenture • May 10th, 2011 • Sanmina-Sci Corp • Printed circuit boards • New York
INDENTURE, dated as of May 10, 2011, among Sanmina-SCI Corporation, a corporation duly organized and existing under the laws of the State of Delaware, as issuer (herein called the “Company”), having its principal executive offices at 2700 North First Street, San Jose, California 95134, the Notes Guarantors (as defined herein) and U.S. Bank National Association, as trustee (herein called the “Trustee”).
SANMINA-SCI CORPORATION, as Issuer THE GUARANTORS PARTY HERETO, as Guarantors and U.S. BANK NATIONAL ASSOCIATION, as TrusteeIndenture • February 24th, 2005 • Sanmina-Sci Corp • Printed circuit boards • New York
INDENTURE, dated as of February 24, 2005, among Sanmina-SCI Corporation, a corporation duly organized and existing under the laws of the State of Delaware, as issuer (herein called the “Company”), having its principal executive offices at 2700 North First Street, San Jose, California 95134, the Notes Guarantors (as defined herein) and U.S. Bank National Association, as trustee (herein called the “Trustee”).
THIRD AMENDED AND RESTATED CREDIT AGREEMENT Dated as of February 1, 2018 amongCredit Agreement • February 2nd, 2018 • Sanmina Corp • Printed circuit boards • New York
THIS THIRD AMENDED AND RESTATED CREDIT AGREEMENT (this “Agreement”) is entered into as of February 1, 2018, among SANMINA CORPORATION, a Delaware corporation (the “Borrower”), each lender from time to time party hereto (collectively, the “Lenders” and individually, a “Lender”), and BANK OF AMERICA, N.A., as Administrative Agent, Swing Line Lender and an Issuing Lender.
INDEMNIFICATION AGREEMENTIndemnification Agreement • August 4th, 2008 • Sanmina-Sci Corp • Printed circuit boards • Delaware
This Indemnification Agreement (“Agreement”) is made as of by and between Sanmina-SCI Corporation, a Delaware corporation (the “Company”), and (“Indemnitee”).
