RECITALSStock Purchase Agreement • July 27th, 1999 • Lattice Semiconductor Corp • Semiconductors & related devices • California
EXHIBIT 4.2 REGISTRATION RIGHTS AGREEMENTRegistration Rights Agreement • December 21st, 1999 • Lattice Semiconductor Corp • Semiconductors & related devices • New York
2,500,000 SHARES LATTICE SEMICONDUCTOR CORPORATION COMMON STOCK ($0.01 PER SHARE PAR VALUE) UNDERWRITING AGREEMENT October ____, 1995Lattice Semiconductor Corp • October 17th, 1995 • Semiconductors & related devices • New York
EXHIBIT 2.1Stock Purchase Agreement • May 7th, 1999 • Lattice Semiconductor Corp • Semiconductors & related devices • California
LATTICE SEMICONDUCTOR CORPORATION INDEMNIFICATION AGREEMENTIndemnification Agreement • May 8th, 2023 • Lattice Semiconductor Corp • Semiconductors & related devices • Delaware
This Indemnification Agreement (this “Agreement”) is dated as of [insert date], and is between Lattice Semiconductor Corporation, a Delaware corporation (the “Company”), and [insert name of indemnitee] (“Indemnitee”).
EXHIBIT 4.1 THIS WARRANT HAS NOT BEEN REGISTERED UNDER THE SECURITIES ACT OF 1933. NO SALE OR DISPOSITION MAY BE EFFECTED WITHOUT AN EFFECTIVE REGISTRATION STATEMENT RELATED THERETO OR AN OPINION OF COUNSEL FOR THE HOLDER, SATISFACTORY TO THE COMPANY,...Lattice Semiconductor Corp • November 7th, 1996 • Semiconductors & related devices
EXHIBIT 4.1 THIS WARRANT HAS NOT BEEN REGISTERED UNDER THE SECURITIES ACT OF 1933. NO SALE OR DISPOSITION MAY BE EFFECTED WITHOUT AN EFFECTIVE REGISTRATION STATEMENT RELATED THERETO OR AN OPINION OF COUNSEL FOR THE HOLDER, SATISFACTORY TO THE COMPANY,...Lattice Semiconductor Corp • December 22nd, 1998 • Semiconductors & related devices
COMMON STOCK ----------------Common Stock • July 20th, 2000 • Lattice Semiconductor Corp • Semiconductors & related devices • New York
SUPPORT AGREEMENTSupport Agreement • February 9th, 2015 • Lattice Semiconductor Corp • Semiconductors & related devices • Delaware
THIS SUPPORT AGREEMENT (this “Agreement”) is made and entered into as of January 26, 2015 by and between Lattice Semiconductor Corporation, a Delaware corporation (“Parent”), and the undersigned stockholder (“Stockholder”) of Silicon Image, Inc., a Delaware corporation (the “Company”).
AGREEMENT AND PLAN OF MERGER BY AND AMONG LATTICE SEMICONDUCTOR CORPORATION CAYABYAB MERGER COMPANY AND SILICON IMAGE, INC. January 26, 2015Agreement and Plan of Merger • January 27th, 2015 • Lattice Semiconductor Corp • Semiconductors & related devices • Delaware
THIS AGREEMENT AND PLAN OF MERGER (this “Agreement”) is made and entered into as of January 26, 2015 by and among Lattice Semiconductor Corporation, a Delaware corporation (“Parent”), Cayabyab Merger Company, a Delaware corporation and a direct or indirect wholly owned subsidiary of Parent (“Merger Sub”), and Silicon Image, Inc., a Delaware corporation (the “Company”). All capitalized terms that are used in this Agreement but not defined herein shall have the respective meanings ascribed thereto in Annex A.
Employment AgreementEmployment Agreement • February 24th, 2020 • Lattice Semiconductor Corp • Semiconductors & related devices • California
This Employment Agreement (the “Agreement”) is entered into by and between ____________ (the “Executive”) and LATTICE SEMICONDUCTOR CORPORATION, a Delaware corporation (the “Company”) as of _______ __, 20__(the “Effective Date”) and amends and restates that certain Employment Agreement between Executive and the Company effective as of _____________.
RECITALSStock Purchase Agreement • July 27th, 1999 • Lattice Semiconductor Corp • Semiconductors & related devices • California
EMPLOYMENT AGREEMENTEmployment Agreement • November 4th, 2016 • Lattice Semiconductor Corp • Semiconductors & related devices • Oregon
THIS EMPLOYMENT AGREEMENT (the “Agreement”) is entered into by and between Max Downing (the “Executive”) and LATTICE SEMICONDUCTOR CORPORATION, a Delaware corporation (the “Company”) as of November 3, 2016. Reference is made to the Agreement and Plan of Merger by and among the Company (the “Company”), Canyon Bridge Capital Partners, Inc. (“Parent”) and the other parties thereto, dated as of November 3, 2016 (the “Merger Agreement”). Capitalized terms used but not otherwise defined herein have the meaning set forth in the Merger Agreement. The Closing Date as contemplated therein shall be the Effective Date for purposes of this Agreement.
EMPLOYMENT AGREEMENTEmployment Agreement • November 4th, 2005 • Lattice Semiconductor Corp • Semiconductors & related devices • Oregon
THIS AGREEMENT is entered into by and between Stephen M. Donovan (the “Executive”) and LATTICE SEMICONDUCTOR CORPORATION, a Delaware corporation (the “Company”) as of November 1, 2005 (the “Effective Date”).
REGISTRATION RIGHTS AGREEMENT by and between LATTICE SEMICONDUCTOR CORPORATION as Issuer and GOLDMAN, SACHS & CO. as Initial Purchaser Dated as of June 20, 2003Registration Rights Agreement • August 13th, 2003 • Lattice Semiconductor Corp • Semiconductors & related devices • New York
THIS REGISTRATION RIGHTS AGREEMENT is made and entered into as of June 20, 2003 by and among Lattice Semiconductor Corporation, a Delaware corporation (the “Company”), and Goldman, Sachs & Co., (the “Initial Purchaser”) pursuant to the Purchase Agreement, dated June 17, 2003 (the “Purchase Agreement”), between the Company and the Initial Purchaser. In order to induce the Initial Purchaser to enter into the Purchase Agreement, the Company has agreed to provide the registration rights set forth in this Agreement. The execution of this Agreement is a condition to the closing under the Purchase Agreement.
LATTICE SEMICONDUCTOR CORPORATIONStock Option Agreement • February 17th, 2023 • Lattice Semiconductor Corp • Semiconductors & related devices
Unless otherwise defined herein, the terms defined in the Plan shall have the same defined meanings in this Option Agreement.
CREDIT AGREEMENT among LATTICE SEMICONDUCTOR CORPORATION, THE SUBSIDIARY GUARANTORS FROM TIME TO TIME PARTY HERETO, THE VARIOUS LENDERS FROM TIME TO TIME PARTY HERETO and JEFFERIES FINANCE LLC, as ADMINISTRATIVE AGENT Dated as of March 10, 2015...Credit Agreement • March 11th, 2015 • Lattice Semiconductor Corp • Semiconductors & related devices
CREDIT AGREEMENT, dated as of March 10, 2015 among LATTICE SEMICONDUCTOR CORPORATION, a Delaware corporation (the “Borrower”), the Subsidiary Guarantors party hereto from time to time, the Lenders party hereto from time to time and JEFFERIES FINANCE LLC, as Administrative Agent. All capitalized terms used herein and defined in Section 1.01 are used herein as therein defined.
Exhibit 10.2Lattice Semiconductor Corp • October 3rd, 1995 • Semiconductors & related devices
LATTICE SEMICONDUCTOR CORPORATION INDEMNIFICATION AGREEMENTIndemnification Agreement • April 1st, 2004 • Lattice Semiconductor Corp • Semiconductors & related devices • Delaware
This Indemnification Agreement (“Agreement”) is made as of May 6, 2003 by and between Lattice Semiconductor Corporation, a Delaware corporation (the “Company”), and (“Indemnitee”).
Employment AgreementEmployment Agreement • May 5th, 2011 • Lattice Semiconductor Corp • Semiconductors & related devices • Oregon
This Employment Agreement (the “Agreement”) is entered into by and between Joe Bedewi (the “Executive”) and LATTICE SEMICONDUCTOR CORPORATION, a Delaware corporation (the “Company”) as of April 11, 2011 (the “Effective Date”).
by and betweenWafer Fabrication Agreement • March 30th, 2000 • Lattice Semiconductor Corp • Semiconductors & related devices • California
EXHIBIT 10.25 NORTH AMERICA SALES REPRESENTATIVE AGREEMENT THIS AGREEMENT is entered into in Hillsboro, Oregon, as of ______________("Effective Date"), between Lattice Semiconductor Corporation, a Delaware corporation with principal offices at 5555...Representative Agreement • June 25th, 1998 • Lattice Semiconductor Corp • Semiconductors & related devices • Oregon
MUTUAL CONFIDENTIALITY AGREEMENTMutual Confidentiality Agreement • February 9th, 2015 • Lattice Semiconductor Corp • Semiconductors & related devices • California
This MUTUAL CONFIDENTIALITY AGREEMENT (this “Agreement”) is entered into as of September 26, 2014 by and between Lattice Semiconductor Corporation (including its subsidiaries, “L Company”), and Silicon Image, Inc. (including its subsidiaries, “S Company”).
AGREEMENT AND PLAN OF MERGER Dated as of November 3, 2016 among LATTICE SEMICONDUCTOR CORPORATION, CANYON BRIDGE ACQUISITION COMPANY, INC. and CANYON BRIDGE MERGER SUB, INC.Agreement and Plan of Merger • November 3rd, 2016 • Lattice Semiconductor Corp • Semiconductors & related devices • Delaware
This AGREEMENT AND PLAN OF MERGER (this “Agreement”), dated as of November 3, 2016, is entered into among Lattice Semiconductor Corporation, a Delaware corporation (the “Company”), Canyon Bridge Acquisition Company, Inc., a Delaware corporation (“Parent”), and Canyon Bridge Merger Sub, Inc., a Delaware corporation and wholly owned subsidiary of Parent (“Merger Sub” and, collectively with the Company and Parent, the “Parties”).
Omitted and filed separately with the SEC pursuant to a confidential treatment request. ADVANCE PRODUCTION PAYMENT AGREEMENT THIS ADVANCE PAYMENT AGREEMENT ("this Agreement"), is entered into this March 17, 1997, by and among SEIKO EPSON CORPORATION,...Advance Payment Agreement • June 26th, 1997 • Lattice Semiconductor Corp • Semiconductors & related devices • California
LETTER AGREEMENTLetter Agreement • March 13th, 2008 • Lattice Semiconductor Corp • Semiconductors & related devices • Oregon
This Letter Agreement (the “Letter Agreement”) is entered into by and between Stephen A. Skaggs (“Executive”) and LATTICE SEMICONDUCTOR CORPORATION, a Delaware corporation (the “Company”) as of January 31, 2008.
VSP SEPARATION AGREEMENTVSP Separation Agreement • December 12th, 2005 • Lattice Semiconductor Corp • Semiconductors & related devices
This VSP Separation Agreement (“Agreement”) is made by and between Lattice Semiconductor Corporation and Frank Barone (“Employee”). Lattice Semiconductor Corporation, together with its divisions, subsidiaries, parents, predecessor and successor corporations, officers, agents, and employees, is hereafter referred to as the “Company.”
2nd AMENDMENT TO ADVANCE PRODUCTION PAYMENT AGREEMENTLattice Semiconductor Corp • May 12th, 2004 • Semiconductors & related devices
THIS 2nd AMENDMENT TO THE ADVANCE PAYMENT AGREEMENT of March 17, 1997 (“this Amendment”), is entered into this 25th day of March, 2004, by and among SEIKO EPSON CORPORATION, a Japanese corporation having its principal place of business at 3-5, Owa 3-chome, Suwa-shi, Nagano-ken 392, Japan (“Epson”), EPSON ELECTRONICS AMERICA, INCORPORATED (formerly known as S MOS Systems Inc.), a California corporation, having a place of business at 150 River Oaks Parkway, San Jose, CA 95134-1951, U.S.A. (“EEA”) and Lattice Semiconductor Corporation, a Delaware corporation, having a place of business at 5555 N.E. Moore Ct., Hillsboro, Oregon 97124-6421, U.S.A. (“Lattice”).
OFFER TO PURCHASE All Outstanding Shares of Common Stock of SILICON IMAGE, INC. a Delaware corporation at $7.30 Net Per Share in Cash by CAYABYAB MERGER COMPANY a wholly owned subsidiary of LATTICE SEMICONDUCTOR CORPORATIONConfidentiality Agreement • February 9th, 2015 • Lattice Semiconductor Corp • Semiconductors & related devices
Purchaser is making this Offer pursuant to an Agreement and Plan of Merger, dated as of January 26, 2015 (as it may be amended from time to time, the “Merger Agreement”), by and among Parent, Purchaser and Silicon Image. The Merger Agreement provides, among other things, that following the consummation of the Offer and subject to the satisfaction or waiver of certain conditions, Purchaser will be merged with and into Silicon Image (the “Merger”), with Silicon Image continuing as the surviving corporation in the Merger (the “Surviving Corporation”) and a wholly owned subsidiary of Parent. In the Merger, each Share issued and outstanding immediately prior to the date and time at which the Merger becomes effective (the “Effective Time”), other than (i) Shares owned by Parent, Purchaser or Silicon Image (or by any direct or indirect wholly owned subsidiary of Parent, Purchaser or Silicon Image) and (ii) Shares that are issued and outstanding immediately prior to the Effective Time and held
ADVANCE PAYMENT AND PURCHASE AGREEMENTAdvance Payment and Purchase Agreement • November 7th, 2006 • Lattice Semiconductor Corp • Semiconductors & related devices
THIS ADDENDUM #2 TO ADVANCE PAYMENT AND PURCHASE AGREEMENT (this “2nd Addendum”) is entered into with an effective date of October 1, 2006, by and between Lattice Semiconductor Corporation, having an office at 5555 NE Moore Court, Hillsboro, OR 97124 (“Lattice”) and Fujitsu Limited, having an office at Akiruno Technology Center, 50 Fuchigami, Akiruno, Tokyo 197-0833, Japan (“Fujitsu”) and Fujitsu Microelectronics America, Inc., having an office at 1250 East Arques Avenue, M/S333 Sunnyvale, CA 94088-3470, USA (“FMA”).
LATTICE SEMICONDUCTOR CORPORATIONStock Option Agreement • February 13th, 2003 • Lattice Semiconductor Corp • Semiconductors & related devices
Unless otherwise defined herein, the terms defined in the Plan shall have the same defined meanings in this Option Agreement.
Lattice Lease A4b.doc 2 of the tenants of the Building. Such system may include designated parking stalls, parking stickers, access cards and gates or any other reasonable system. Landlord may charge its standard monthly and daily rates for all...Office Lease • October 27th, 2014 • Lattice Semiconductor Corp • Semiconductors & related devices
November 3, 2016Darin Billerbeck • November 4th, 2016 • Lattice Semiconductor Corp • Semiconductors & related devices
Reference is made to the Agreement and Plan of Merger by and among Lattice Semiconductor Corporation (the “Company”), Canyon Bridge Acquisition Company, Inc. (“Parent”) and the other parties thereto, dated as of November 3, 2016 (the “Merger Agreement”) and the Employment Agreement, dated November 8, 2010, by and between you and the Company (the “Employment Agreement”). Capitalized terms used but not otherwise defined herein have the meaning set forth in the Merger Agreement.
Exhibit 10.3 * OMITTED PURSUANT TO A CONFIDENTIAL TREATMENT REQUEST FILED WITH THE SECURITES AND EXCHANGE COMMISSION FABVEN FOUNDRY CAPACITY AGREEMENT This Foundry Capacity Agreement ("Foundry Capacity Agreement") is entered into as of August __, 1995...Foundry Capacity Agreement • October 3rd, 1995 • Lattice Semiconductor Corp • Semiconductors & related devices
Lattice Semiconductor CorporationLetter • March 13th, 2018 • Lattice Semiconductor Corp • Semiconductors & related devices • Delaware
This letter (this “Agreement”) constitutes the agreement between (a) Lattice Semiconductor Corporation (“Company”) and (b) Lion Point Capital, LP (“Lion Point”) and each of the other related Persons (as defined below) set forth on the signature pages to this Agreement (collectively with Lion Point, the “Lion Point Group”). The Lion Point Group and each of its Affiliates (as defined below) and Associates (as defined below) are collectively referred to as the “Investors.” Company and the Lion Point Group are collectively the “Parties.”
