CREDIT AGREEMENT* Dated as of January 8, 2013 among DIODES INCORPORATED, as the Domestic Borrower, DIODES INTERNATIONAL B.V., as the Foreign Borrower, DIODES INVESTMENT COMPANY, DIODES FABTECH INC., DIODES HOLDINGS UK LIMITED and DIODES ZETEX LIMITED,...Credit Agreement • January 11th, 2013 • Diodes Inc /Del/ • Semiconductors & related devices • New York
This CREDIT AGREEMENT (“Agreement”) is entered into as of January 8, 2013, among DIODES INCORPORATED, a Delaware corporation (the “Domestic Borrower”), DIODES INTERNATIONAL B.V., a besloten vennootschap met beperkte aansprakelijkheid organized under the laws of the Netherlands, having its statutory seat in Amsterdam, the Netherlands and registered with the trade register of the Chambers of Commerce in the Netherlands under number 34274981 (the “Foreign Borrower” and together with the Domestic Borrower, the “Borrowers” and each, individually, a “Borrower”), certain Subsidiaries of the Domestic Borrower identified on the signature pages hereto as guarantors, each lender from time to time party hereto (collectively, the “Lenders” and individually, a “Lender”), and BANK OF AMERICA, N.A., as Administrative Agent, Swing Line Lender and L/C Issuer.
57 2 c. The Borrower hereby authorizes the Bank, if and to the extent the Guarantor shall be required to pay any amount whatsoever to any person pursuant to, in connection with or as a result of or relating to the Guaranty, to set- off and apply for...Guaranty Agreement • March 31st, 1997 • Diodes Inc /Del/ • Semiconductors & related devices • California
SECOND AMENDMENT THIS SECOND AMENDMENT is made and effective as of October 31, 2006, by and among Diodes Incorporated, a Delaware corporation ("Diodes"), DII Taiwan Corporation Ltd., a Taiwan corporation ("Buyer"), APD Semiconductor, Inc., a...Consulting Agreement • November 7th, 2006 • Diodes Inc /Del/ • Semiconductors & related devices • California
EXHIBIT 10.26Consulting Agreement • November 13th, 1998 • Diodes Inc /Del/ • Semiconductors & related devices • California
42- 2 Agreement (ii) to cooperate with Intelic in the enforcement of such compliance by RECIPIENT's employees, agents and third parties; (iii) not to permit the removal or alteration of any copyright or confidentiality labels or notices contained in...Software License Agreement • March 30th, 1999 • Diodes Inc /Del/ • Semiconductors & related devices • California
Exhibit 2.1 STOCK PURCHASE AGREEMENT By and Among DII TAIWAN CORPORATION LTD., LITE-ON SEMICONDUCTOR CORPORATION, SHIN SHENG INVESTMENT LIMITED, SUN SHINING INVESTMENT CORP.Stock Purchase Agreement • December 21st, 2005 • Diodes Inc /Del/ • Semiconductors & related devices
RECITALS:Credit Agreement • March 31st, 2003 • Diodes Inc /Del/ • Semiconductors & related devices • California
EXHIBIT 10.24Diodes Inc /Del/ • May 15th, 1998 • Semiconductors & related devices
AMENDED AND RESTATED CREDIT AGREEMENT Dated as of October 26, 2016 among DIODES INCORPORATED, as the Domestic Borrower, DIODES INTERNATIONAL B.V., as the Foreign Borrower, DIODES INVESTMENT COMPANY, DIODES FABTECH INC., PERICOM SEMICONDUCTOR...Credit Agreement • November 1st, 2016 • Diodes Inc /Del/ • Semiconductors & related devices • New York
This AMENDED AND RESTATED CREDIT AGREEMENT (“Agreement”) is entered into as of October 26, 2016, among DIODES INCORPORATED, a Delaware corporation (the “Domestic Borrower”), DIODES INTERNATIONAL B.V., a besloten vennootschap met beperkte aansprakelijkheid organized under the laws of the Netherlands, having its statutory seat in Amsterdam, the Netherlands and registered with the trade register of the Chambers of Commerce in the Netherlands under number 34274981 (the “Foreign Borrower” and together with the Domestic Borrower, the “Borrowers” and each, individually, a “Borrower”), certain Subsidiaries of the Domestic Borrower identified on the signature pages hereto as guarantors, each lender from time to time party hereto (collectively, the “Lenders” and individually, a “Lender”), and BANK OF AMERICA, N.A., as Administrative Agent, Swing Line Lender and L/C Issuer.
EXHIBIT 10.43Agreement • April 1st, 2002 • Diodes Inc /Del/ • Semiconductors & related devices
AMENDMENT NO. 3 TO CREDIT AGREEMENT, INCREMENTAL TERM ASSUMPTION AGREEMENT, LIMITED WAIVER AND CONSENT*Credit Agreement • September 3rd, 2015 • Diodes Inc /Del/ • Semiconductors & related devices • New York
This CREDIT AGREEMENT (“Agreement”) is entered into as of January 8, 2013, among DIODES INCORPORATED, a Delaware corporation (the “Domestic Borrower”), DIODES INTERNATIONAL B.V., a besloten vennootschap met beperkte aansprakelijkheid organized under the laws of the Netherlands, having its statutory seat in Amsterdam, the Netherlands and registered with the trade register of the Chambers of Commerce in the Netherlands under number 34274981 (the “Foreign Borrower” and together with the Domestic Borrower, the “Borrowers” and each, individually, a “Borrower”), certain Subsidiaries of the Domestic Borrower identified on the signature pages hereto as guarantors, each lender from time to time party hereto (collectively, the “Lenders” and individually, a “Lender”), and BANK OF AMERICA, N.A., as Administrative Agent, Swing Line Lender and L/C Issuer.
1 EXHIBIT 10.31Volume Purchase Agreement • December 18th, 2000 • Diodes Inc /Del/ • Semiconductors & related devices
EXHIBIT 10.23Loan Agreement • May 15th, 1998 • Diodes Inc /Del/ • Semiconductors & related devices
EXHIBIT 10.3Diodes Inc /Del/ • October 27th, 1995 • Semiconductors & related devices
1 EXHIBIT 10.29 SEPARATION AGREEMENT THIS SEPARATION AGREEMENT (the "Agreement"), which shall be effective as of March 31, 2000, by and between DIODES INCORPORATED, 3050 East Hillcrest Drive, Suite 200, Westlake Village, California 91362 ("DIODES"),...Separation Agreement • March 30th, 2000 • Diodes Inc /Del/ • Semiconductors & related devices • California
EXHIBIT 10.30Stock Purchase Agreement • December 18th, 2000 • Diodes Inc /Del/ • Semiconductors & related devices • California
AGREEMENT AND PLAN OF MERGER BY AND AMONG DIODES INCORPORATED PSI MERGER SUB, INC. AND PERICOM SEMICONDUCTOR CORPORATION Dated as of September 2, 2015Agreement and Plan of Merger • September 3rd, 2015 • Diodes Inc /Del/ • Semiconductors & related devices • California
AGREEMENT AND PLAN OF MERGER, dated as of September 2, 2015 (this “Agreement”), by and among DIODES INCORPORATED, a corporation incorporated in the State of Delaware (“Parent”), PSI Merger Sub, Inc., a corporation incorporated in the State of California (“Merger Sub”), and PERICOM SEMICONDUCTOR CORPORATION, a corporation incorporated in the State of California (the “Company”). Each of the parties to this Agreement is individually referred to herein as a “Party” and collectively as the “Parties.” Capitalized terms used herein that are not otherwise defined herein shall have the meanings ascribed to them in Annex A hereto.
EXHIBIT 10.38 SWAP AGREEMENT BETWEEN THE COMPANY AND UNION BANK Union Bank of California Global Markets Group Securities Funding Operations 445 South Figueroa Street G11-101 Los Angeles, CA 90071 Date: July 24, 2001 To: Diodes, Inc. Attn: Carl Wertz...Swap Agreement • April 1st, 2002 • Diodes Inc /Del/ • Semiconductors & related devices • California
EMPLOYMENT AGREEMENTEmployment Agreement • September 2nd, 2005 • Diodes Inc /Del/ • Semiconductors & related devices • California
THIS EMPLOYMENT AGREEMENT is made and effective as of the 29th day of August 2005, by and between Diodes Incorporated, a Delaware corporation (the "Company"), and DR. KEH-SHEW LU (the "Employee"), with respect to the following facts:
DIODES INCORPORATED NONSTATUTORY STOCK OPTION AGREEMENTNonstatutory Stock Option Agreement • February 27th, 2014 • Diodes Inc /Del/ • Semiconductors & related devices
Diodes Incorporated, a Delaware corporation, (the “Company”), hereby grants an Option to purchase Shares to the Optionee named below. The terms and conditions of the Option are set forth in this cover sheet and the attached Nonstatutory Stock Option Agreement (together, this “Agreement”) and in the Diodes Incorporated 2013 Equity Incentive Plan as it may be amended from time to time.
Exhibit 10.51 NON REVOLVING-TO-TERM NOTE Borrower's Name: Diodes Incorporated Borrower's Address: 3050 East Hillcrest Drive Westlake Village, California 91362-3154 Office: 30361 Loan Number: Maturity Date: June 1, 2009 Amount: $2,000,000 Westlake...Diodes Inc /Del/ • March 31st, 2003 • Semiconductors & related devices • California
CONSENT TO CREDIT AGREEMENTCredit Agreement • August 5th, 2019 • Diodes Inc /Del/ • Semiconductors & related devices • New York
THIS CONSENT TO CREDIT AGREEMENT dated as of January 30, 2019 (this “Consent”) is entered into among DIODES INCORPORATED, a Delaware corporation (the “Domestic Borrower”), DIODES HOLDING B.V., a besloten vennootschap met beperkte aansprakelijkheid, organized under the laws of the Netherlands, having its statutory seat in Amsterdam, the Netherlands, and registered with the trade register of the Chamber of Commerce in the Netherlands under number 65823060 (the “Foreign Borrower” and together with the Domestic Borrower, the “Borrowers” and each, individually, a “Borrower”), certain Subsidiaries of the Domestic Borrower identified on the signature pages hereto as subsidiary guarantors (the “Subsidiary Guarantors”), the Lenders identified on the signature pages hereto and BANK OF AMERICA, N.A., as Administrative Agent (in such capacity, the “Administrative Agent”).
EXHIBIT 10.28 DIODES-TAIWAN RELATIONSHIP AGREEMENT FOR FABTECH WAFER SALES I. Product for DII Internal Consumption (existing business, no change): A. Product transferred to Diodes Taiwan for internal consumption will be sold at such discount as to...Diodes Inc /Del/ • August 11th, 1999 • Semiconductors & related devices
DIODES INCORPORATED STOCK UNIT AGREEMENTStock Unit Agreement • February 27th, 2014 • Diodes Inc /Del/ • Semiconductors & related devices
Diodes Incorporated, a Delaware corporation, (the “Company”), hereby awards Stock Units to the Participant named below. The terms and conditions of the Award are set forth in this cover sheet and in the attached Stock Unit Agreement (together, this “Agreement”) and in the Diodes Incorporated 2013 Equity Incentive Plan as it may be amended from time to time (the “Plan”).
third AMENDED AND RESTATED CREDIT AGREEMENT Dated as of May 26, 2023 among DIODES INCORPORATED, as the Domestic Borrower, DIODES HOLDINGS UK LIMITED, as the Foreign Borrower, DIODES ZETEX LIMITED and Diodes US Manufacturing Incorporated as Guarantors,...Credit Agreement • June 2nd, 2023 • Diodes Inc /Del/ • Semiconductors & related devices • New York
This THIRD AMENDED AND RESTATED CREDIT AGREEMENT (“Agreement”) is entered into as of May 26, 2023, among DIODES INCORPORATED, a Delaware corporation (the “Domestic Borrower”), DIODES HOLDINGS UK LIMITED, a company incorporated and registered under the laws of England and Wales with registration number 06475363 (the “Foreign Borrower” and together with the Domestic Borrower, the “Borrowers” and each, individually, a “Borrower”), certain Subsidiaries of the Domestic Borrower identified on the signature pages hereto as guarantors, each lender from time to time party hereto (collectively, the “Lenders” and individually, a “Lender”), BANK OF AMERICA, N.A., as Administrative Agent, Swingline Lender and an L/C Issuer and the other L/C Issuers from time to time party hereto.
EXHIBIT A INDEMNIFICATION AGREEMENT DIODES INCORPORATED INDEMNIFICATION AGREEMENTIndemnification Agreement • July 27th, 2015 • Diodes Inc /Del/ • Semiconductors & related devices • California
This Indemnification Agreement (this “Agreement”) is entered into and made effective on September 20, 2000, by and between Diodes, Inc., a Delaware corporation (the “Company”), and Keh-Shew Lu ("Indemnitee").
CREDIT AGREEMENT Dated as of November 25, 2009 among DIODES INCORPORATED, and DIODES ZETEX LIMITED as Borrowers, and BANK OF AMERICA, N.A., as LenderCredit Agreement • August 6th, 2010 • Diodes Inc /Del/ • Semiconductors & related devices • Texas
This CREDIT AGREEMENT (“Agreement”) is entered into as of November 25, 2009, among Diodes Incorporated, a Delaware corporation (“Company”), Diodes Zetex Limited, a United Kingdom corporation (together with Company, the “Borrowers” and, each a “Borrower”), and BANK OF AMERICA, N.A., (“Lender”).
EXHIBIT 10.32Credit Agreement • December 18th, 2000 • Diodes Inc /Del/ • Semiconductors & related devices • California
EXCHANGE AGREEMENTExchange Agreement • October 2nd, 2009 • Diodes Inc /Del/ • Semiconductors & related devices • New York
This Exchange Agreement (this “Agreement”) is entered into by and between Diodes Incorporated (the “Company”) and [REDACTED] (“Holder” and, collectively with the Company, the “Parties”), effective as of September 28, 2009. The Company and Holder hereby agree, covenant, represent and warrant as follows:
DIODES INCORPORATEDDiodes Incorporated • May 26th, 2022 • Diodes Inc /Del/ • Semiconductors & related devices
Diodes Incorporated, a Delaware corporation, (the “Company”), hereby awards [Restricted][Performance] Stock Units to the Participant named below. The terms and conditions of the Award are set forth in this cover sheet and in the attached [Restricted][Performance] Stock Unit Agreement (together, this “Agreement”) and in the Diodes Incorporated 2022 Equity Incentive Plan as it may be amended from time to time (the “Plan”).
CREDIT AGREEMENT* Dated as of January 8, 2013 among DIODES INCORPORATED, as the Domestic Borrower, DIODES INTERNATIONAL B.V., as the Foreign Borrower, DIODES INVESTMENT COMPANY, DIODES FABTECH INC., DIODES HOLDINGS UK LIMITED and DIODES ZETEX LIMITED,...Credit Agreement • March 29th, 2013 • Diodes Inc /Del/ • Semiconductors & related devices • New York
This CREDIT AGREEMENT (“Agreement”) is entered into as of January 8, 2013, among DIODES INCORPORATED, a Delaware corporation (the “Domestic Borrower”), DIODES INTERNATIONAL B.V., a besloten vennootschap met beperkte aansprakelijkheid organized under the laws of the Netherlands, having its statutory seat in Amsterdam, the Netherlands and registered with the trade register of the Chambers of Commerce in the Netherlands under number 34274981 (the “Foreign Borrower” and together with the Domestic Borrower, the “Borrowers” and each, individually, a “Borrower”), certain Subsidiaries of the Domestic Borrower identified on the signature pages hereto as guarantors, each lender from time to time party hereto (collectively, the “Lenders” and individually, a “Lender”), and BANK OF AMERICA, N.A., as Administrative Agent, Swing Line Lender and L/C Issuer.
RECITALS:Credit Agreement • August 14th, 2002 • Diodes Inc /Del/ • Semiconductors & related devices • California
Union Bank of California July 6, 2004 FabTech, Inc.Covenant Agreement • August 9th, 2004 • Diodes Inc /Del/ • Semiconductors & related devices
Exhibit - 10.15 Supplementary Agreement to Lease Agreement dated on 28th June 2004Supplementary Agreement to Lease Agreement • May 10th, 2006 • Diodes Inc /Del/ • Semiconductors & related devices
This Supplementary Agreement (hereinafter referred to as "the Supplementary Agreement") is entered into on March 15, 2006, in the city of Shanghai, by and between Diodes Shanghai Company Limited (hereinafter referred to as "Party A") with its registered office at No.1, Lane 18, SanZhuang Road Songjiang export zone Shanghai, China and Shanghai Yuanhao Electronic Co., Ltd. (hereinafter referred to as "Party B") with its registered office at No.1, Lane 18, SanZhuang Road Songjiang Export Processing Zone, Shanghai, China.
SIXTH AMENDMENT TO CREDIT AGREEMENTCredit Agreement • November 9th, 2012 • Diodes Inc /Del/ • Semiconductors & related devices
THIS SIXTH AMENDMENT TO CREDIT AGREEMENT is made as of April 30, 2012 (the “Sixth Amendment to Credit Agreement,” or this “Amendment”), among Diodes Incorporated, a Delaware corporation, Diodes Zetex Limited, a United Kingdom corporation, Diodes International B.V., a Netherlands corporation (collectively, “Borrowers”), and Bank of America, N.A. (“Lender”).
