Exhibit 10.14 EMPLOYMENT AGREEMENT THIS EMPLOYMENT AGREEMENT (the "Agreement"), made this 1st day of November, 2002, is entered into by Parthus Technologies plc with its principal place of business at 32-34 Harcourt Street, Dublin 2, Ireland (the...Employment Agreement • March 28th, 2003 • Parthusceva Inc • Semiconductors & related devices
Exhibit 10.19 EMPLOYMENT AGREEMENT THIS EMPLOYMENT AGREEMENT (the "Agreement"), made this 1st day of November, 2002, is entered into by ParthusCeva, Ltd. with its principal place of business at 5 Shenkar Street, Herzelia, Israel 46120 (the "Company"),...Employment Agreement • March 28th, 2003 • Parthusceva Inc • Semiconductors & related devices
RECITALSTransition Services Agreement • March 28th, 2003 • Parthusceva Inc • Semiconductors & related devices • Delaware
EMPLOYMENT AGREEMENTEmployment Agreement • October 21st, 2002 • Ceva Inc • Semiconductors & related devices
THIS EMPLOYMENT AGREEMENT (the “Agreement”), made this day of , 2002, is entered into by ParthusCeva, Ltd. with its principal place of business at 5 Shenkar Street, Herzelia, Israel 46120 (the “Company”), and Eliyahu Ayalon, residing at (the “Employee”).
EMPLOYMENT AGREEMENTEmployment Agreement • October 15th, 2002 • Ceva Inc • Semiconductors & related devices
THIS EMPLOYMENT AGREEMENT (the “Agreement”), made this day of , 2002, is entered into by ParthusCeva, Ltd. with its principal place of business at 5 Shenkar Street, Herzelia, Israel 46120 (the “Company”), and Bat Sheva Ovadia, residing in Israel (the “Employee”).
SEPARATION AGREEMENTSeparation Agreement • July 30th, 2002 • Ceva Inc • Semiconductors & related devices • Delaware
This Separation Agreement (this “Agreement”) is made and entered into as of , 2002, by and among DSP Group, Inc., a Delaware corporation (“DSPGI”), DSP Group Ltd., an Israeli corporation (“DSPGL”), Ceva, Inc., a Delaware corporation (“Ceva, Inc.”), DSP Ceva, Inc., a Delaware corporation (“DSP Ceva”), and Corage, Ltd., an Israeli corporation (“Corage, Ltd.”).
CORAGE, LTD. TECHNOLOGY TRANSFER AGREEMENTTechnology Transfer Agreement • July 10th, 2002 • Ceva Inc • Semiconductors & related devices • Delaware
This Technology Transfer Agreement (this “Agreement”), effective as of , 2002 (the “Effective Date”), is entered into by and between DSP Group Ltd. (“DSPGL”), an Israeli corporation, and Corage, Ltd. (“Corage”), an Israeli corporation and a wholly owned subsidiary of DSPGL.
CEVA, INC. TECHNOLOGY TRANSFER AGREEMENTTechnology Transfer Agreement • July 10th, 2002 • Ceva Inc • Semiconductors & related devices • Delaware
This Technology Transfer Agreement (this “Agreement”), effective as of , 2002 (the “Effective Date”), is entered into by and between DSP Group Inc. (“DSPGI”), a Delaware corporation, and Ceva, Inc. (“Ceva”), a Delaware corporation and a wholly owned subsidiary of DSPGI.
TAX INDEMNIFICATION AND ALLOCATION AGREEMENTTax Indemnification and Allocation Agreement • July 10th, 2002 • Ceva Inc • Semiconductors & related devices • Delaware
This Tax Indemnification and Allocation Agreement (the “Agreement”) is entered into as of , 2002, by and between DSP Group, Inc., a Delaware corporation (“DSPGI”), and Ceva, Inc., a Delaware corporation (“Ceva”). (DSPGI and Ceva are sometimes collectively referred to herein as the “Companies”).
AMENDMENT TO EMPLOYMENT AGREEMENT Made and signed on the 18 of February 2021Employment Agreement • February 19th, 2021 • Ceva Inc • Services-computer programming, data processing, etc.
This Amendment to the Employment Agreement (this “Amendment”) is entered into as of 18 February 2021 (“Amendment Effective Date”) by and between CEVA D.S.P. Ltd (the “Company”), and Gideon Wertheizer, ID 054540414 of Beer Ganim 87, Even Yehuda (the “Executive”).
RECITALSTechnology Transfer Agreement • March 28th, 2003 • Parthusceva Inc • Semiconductors & related devices • Delaware
TRANSITION SERVICES AGREEMENTTransition Services Agreement • October 1st, 2002 • Ceva Inc • Semiconductors & related devices • Delaware
This Transition Services Agreement (this “Agreement”), effective as of the day of , 2002 (“Effective Date”), is entered into by and between DSP Group, Ltd. (“DSPGL”), an Israeli corporation having its principal place of business in Herzeliya, Israel and Corage, Ltd. (“Corage”), an Israeli corporation having its principal place of business in Herzeliya, Israel. (DSPGL and Corage sometimes are collectively referred to in this agreement as the “Parties” and each individually as a “Party”.)
LICENSING & DISTRIBUTION AGREEMENT by and between Parthus Technologies plc. and Silaria CorporationDistribution Agreement • October 21st, 2002 • Ceva Inc • Semiconductors & related devices • California
This DEVELOPMENT, LICENSING & DISTRIBUTION AGREEMENT with an Effective Date of September 30, 2002, is made by and between Silaria Ltd., a Republic of Ireland company doing business at Dominic Court, 41 Dominic Street, Dublin 1, Ireland (“Silaria”), and Parthus Technologies, Inc., a Republic of Ireland corporation qualified to do business in California and doing business at 32-34 Harcourt Street, Dublin 2, Ireland and at 2033 Gateway Place, Suite 150, San Jose, CA 95110 (“Licensee”). Silaria and Licensee are referred to individually as a “Party” and collectively as the “Parties.”
Separation and Release AgreementSeparation and Release Agreement • December 12th, 2022 • Ceva Inc • Services-computer programming, data processing, etc.
This Separation and Release Agreement (the “Agreement”), dated December 7, 2022, 2022, is made by and between Issachar Ohana (“you”) and CEVA Development, Inc. (the “Company”). This Agreement is effective on the 8th day after you sign it, provided you do not revoke it before that day in accordance with Section 5(b) of this Agreement (the “Effective Date”).
ADDENDUM TO EMPLOYMENT AGREEMENTEmployment Agreement • December 12th, 2022 • Ceva Inc • Services-computer programming, data processing, etc.
CEVA, INC. Nonstatutory Stock Option Agreement Granted Under 2000 Stock Incentive PlanNonstatutory Stock Option Agreement • August 9th, 2006 • Ceva Inc • Semiconductors & related devices • Delaware
SHARE PURCHASE AGREEMENT by and among CADENCE DESIGN SYSTEMS, INC. a Delaware corporation, INTRINSIX CORP. a Massachusetts corporation, and CEVA, INC. a Delaware corporation,Share Purchase Agreement • September 20th, 2023 • Ceva Inc • Services-computer programming, data processing, etc. • Delaware
This SHARE PURCHASE AGREEMENT (this “Agreement”) is made and entered into as of September 14, 2023 (the “Agreement Date”), by and among Cadence Design Systems, Inc., a Delaware corporation (“Acquiror”), Intrinsix Corp., a Massachusetts corporation (the “Company”), and CEVA, Inc. a Delaware corporation (the “Shareholder”). Certain other capitalized terms used herein are defined in Exhibit A.
Dear Employee, Personal and Special Employment Agreement (“Special Agreement”)Special Agreement • November 9th, 2005 • Ceva Inc • Semiconductors & related devices
We are pleased to extend an offer of employment to you at Ceva D.S.P Ltd. (the “Company”), as a new employee of the Company for every purpose and matter and this commencing on August 1st, 2005.
EMPLOYMENT AGREEMENTEmployment Agreement • July 30th, 2002 • Ceva Inc • Semiconductors & related devices
THIS EMPLOYMENT AGREEMENT (the “Agreement”), made this day of , 2002, is entered into by with its principal place of business at (the “Company”), and , residing at (the “Employee”).
RECITALSTechnology Transfer Agreement • March 28th, 2003 • Parthusceva Inc • Semiconductors & related devices • Delaware
EMPLOYMENT AGREEMENT Serves as notice to the Employee pursuant to the Notice to Employee and Candidate (Employment Terms and Screening Procedures) Law, 5762-2002Employment Agreement • April 9th, 2019 • Ceva Inc • Semiconductors & related devices
This Employment Agreement (this "Agreement") is entered by and between CEVA D.S.P. Ltd., with offices at 2 Maskit Street, Herzlia, Israel, (the "Company") and Michael Boukaya I.D. No. 313701112 (the "Employee"1)
CEVA, INC. Nonstatutory Stock Option Agreement Granted Under 2003 Director Stock Option PlanNonstatutory Stock Option Agreement • August 9th, 2006 • Ceva Inc • Semiconductors & related devices
Exhibit 10.1 SEPARATION AGREEMENT This Separation Agreement (this "Agreement") is made and entered into as of November 1, 2002, by and among DSP Group, Inc., a Delaware corporation ("DSPGI"), DSP Group Ltd., an Israeli corporation ("DSPGL"), Ceva,...Separation Agreement • March 28th, 2003 • Parthusceva Inc • Semiconductors & related devices • Delaware
AMENDMENT TO EMPLOYMENT AGREEMENTEmployment Agreement • November 8th, 2013 • Ceva Inc • Semiconductors & related devices
THIS AMENDEMNT TO EMPLOYMENT AGREEMENT (the “Amendment”), effective as of November 6, 2013, is entered into by CEVA, Inc. (the “Parent”), CEVA D.S.P. Ltd. (the “Company”) and Yaniv Arieli, the Chief Financial Officer of the Parent and the Company (the “Employee”).
CEVA, INC. Nonstatutory Stock Option Agreement Granted Under 2002B Stock Incentive PlanNonstatutory Stock Option Agreement • August 9th, 2006 • Ceva Inc • Semiconductors & related devices
CEVA, INC. Nonstatutory Stock Option Agreement Granted Under 2000 Stock Incentive PlanNonstatutory Stock Option Agreement • August 9th, 2006 • Ceva Inc • Semiconductors & related devices • Delaware
CEVA, INC. VOTING AGREEMENTVoting Agreement • June 3rd, 2002 • Ceva Inc • Delaware
THIS VOTING AGREEMENT (this “Agreement”) is made as of [__________], 2002 by and among Ceva, Inc., a Delaware corporation (the “Company”), and [__________], a [____________] (the “Holder”).
CEVA, INC. Nonstatutory Stock Option Agreement Granted Under 2000 Stock Incentive PlanStock Option Agreement • August 9th, 2007 • Ceva Inc • Semiconductors & related devices • Delaware
COMBINATION AGREEMENT by and among PARTHUS TECHNOLOGIES PLC, DSP GROUP, INC. and CEVA, INC. Dated as of April 4, 2002Combination Agreement • June 3rd, 2002 • Ceva Inc • Delaware
THIS COMBINATION AGREEMENT (the “Agreement”), dated as of April 4, 2002, is by and among Parthus Technologies plc, an Irish public limited company (“Parthus”), DSP Group, Inc., a Delaware corporation (“DSP Group”), and Ceva, Inc., a Delaware corporation and wholly-owned subsidiary of DSP Group (“Ceva”). Parthus, DSP Group and Ceva are collectively referred to herein as the “Parties.”
AGREEMENT AND PLAN OF MERGERAgreement and Plan of Merger • May 10th, 2021 • Ceva Inc • Services-computer programming, data processing, etc. • Delaware
This Agreement and Plan of Merger (this “Agreement”) is entered into as of May 9, 2021, by and among CEVA, Inc., a Delaware corporation (“Parent”), Northstar Merger Sub, Inc., a Massachusetts corporation (“Merger Sub”), Intrinsix Corp., a Massachusetts corporation (the “Company”), and Shareholder Representative Services LLC, a Colorado limited liability company, solely in its capacity as the representative, agent and attorney-in-fact of the Sellers (the “Sellers’ Representative”). Parent, Merger Sub, the Company, and the Sellers’ Representative are referred to sometimes individually herein as a “Party” and collectively herein as the “Parties.” Capitalized terms used, but not defined, herein shall have the meanings set forth on Appendix A attached hereto.
AMENDMENT TO EMPLOYMENT AGREEMENTEmployment Agreement • November 7th, 2007 • Ceva Inc • Semiconductors & related devices
THIS AMENDMENT TO EMPLOYMENT AGREEMENT (this “Second Amendment”) is entered into to be effective on and as of November 1, 2007, between CEVA, Inc., a Delaware corporation (the “Company”), and Issachar Ohana, an individual (“Employee”), and amends in part the Employment Agreement by and among the parties dated November 1, 2002 (the “Original Agreement”) and as amended on July 22, 2003 (the “Amendment” and collectively with the Original Agreement, the “Agreement”).
AMENDMENT TO EMPLOYMENT AGREEMENT Made and signed on the 18 of February 2021Employment Agreement • February 19th, 2021 • Ceva Inc • Services-computer programming, data processing, etc.
This Amendment to the Employment Agreement (this “Amendment”) is entered into as of 18 February 2021 (“Amendment Effective Date”) by and between CEVA D.S.P. Ltd (the “Company”), and Michael Boukaya, ID 313701112 of Ben Gurion 17/6, Raanana (the “Executive”).
RECITALSTax Indemnification and Allocation Agreement • March 28th, 2003 • Parthusceva Inc • Semiconductors & related devices • Delaware
AMENDMENT NO. 1 TO THE COMBINATION AGREEMENTThe Combination Agreement • July 30th, 2002 • Ceva Inc • Semiconductors & related devices
THIS AMENDMENT NO. 1, dated , 2002, amends the Combination Agreement (the “Agreement”) dated as of April 4, 2002, by and among Parthus Technologies plc, an Irish public limited company (“Parthus”), DSP Group, Inc., a Delaware corporation (“DSP Group”), and Ceva, Inc., a Delaware corporation and wholly-owned subsidiary of DSP Group (“Ceva”). Capitalized terms used herein and not otherwise defined shall have the meanings given to them in the Agreement.
FOURTH AMENDMENT TO EMPLOYMENT AGREEMENT Made and signed on the 1st of April 2024Employment Agreement • April 5th, 2024 • Ceva Inc • Services-computer programming, data processing, etc.
This Amendment to the Employment Agreement (this “Amendment”) is entered into as of 1 April, 2024 (“Amendment Execution Date”) by and between Ceva Technologies, Ltd. (the “Company”), and Yaniv Arieli, ID No. 023832827 of Ha-Shemesh ha-Ola St. 3, Ramot HaShavim, 4359000 Israel (the “Employee”, and together with the Company, the “Parties”). Capitalized terms in this letter not otherwise defined shall have the meaning ascribed thereto in the Agreement (as defined below).
