English Translation]Sale and Purchase Agreement • June 30th, 2003 • Chipmos Technologies Bermuda LTD • Semiconductors & related devices
ChipMOS TECHNOLOGIES INC., a company duly established and validly existing under the law of the Republic of China, with its principal office at No. 1, Research and Development Road 1, Science-based Industrial Park, Hsinchu (“Party A”), and
Tester Equipment Lease AgreementTester Equipment Lease Agreement • June 30th, 2003 • Chipmos Technologies Bermuda LTD • Semiconductors & related devices
The Lease Agreement (the “Lease Agreement”), dated as of December 3, 2002 is made by and between ThaiLin Semiconductor Corp. (“Party A”) and ChinpMOS TECHNOLOGIES INC. (“Party B”) for the leasing of tester related equipment from Party A to Party B. The agreement shall be executed in two counterparts, with one copy retained by Party A and Party B, respectively.
CHIPMOS TECHNOLOGIES (BERMUDA) LTD. Common Shares UNDERWRITING AGREEMENTUnderwriting Agreement • July 8th, 2004 • Chipmos Technologies Bermuda LTD • Semiconductors & related devices • New York
SHARE PURCHASE AGREEMENTShare Purchase Agreement • April 24th, 2015 • Chipmos Technologies Bermuda LTD • Semiconductors & related devices
THIS SHARE PURCHASE AGREEMENT (this “Agreement”) is made as of August 14, 2014, by and between Siliconware Precision Industries Co., Ltd., a company organized under the laws of Taiwan, Republic of China, with its principle address of business at No. 123, Sec. 3, Da Fong Rd., Tantzu, Taichung , Taiwan, R. O. C. (the “Seller”) and ChipMOS TECHNOLOGIES (Bermuda) LTD., a Bermuda company, with its principle address of business at No. 1 R&D Rd. 1, Hsinchu Science Park, Hsinchu, Taiwan, R. O. C. (the “Buyer”) (the Seller and the Buyer hereinafter collectively referred to as the “Parties”, or individually referred to as the “Party”).
English Translation] Laser Stamping Machine Lease Agreement between ChipMOS TECHNOLOGIES INC. and CHANTEK ELECTRONIC CO. LTD. Contract No. 91001 November 1, 2002Machine Lease Agreement • June 30th, 2003 • Chipmos Technologies Bermuda LTD • Semiconductors & related devices
This Agreement (the “Agreement”) was entered into by ChipMOS TECHNOLOGIES INC. (“Party A” hereafter) and CHANTEK ELECTRONIC CO., LTD. (“Party B” hereafter) for the purpose of leasing the laser stamping machine designated by both Parties, who have agreed as follows:
Translation) NT$10,000,000,000 Syndicated Loan AgreementSyndicated Loan Agreement • April 24th, 2015 • Chipmos Technologies Bermuda LTD • Semiconductors & related devices
To repay the existing loans from the financial institutions (including, but not limited to, the outstanding amount under the 2011 Syndicated Loan (as defined hereunder)) and to replenish the medium-term operating working capital, the Borrower requests the Lead Arranger to organize the Lenders and applies for a credit facility in the amount of NT$10 billion (NT$10,000,000,000) (hereafter this “Syndicated Loan”).
Translation, for reference only) SHARE SUBSCRIPTION AGREEMENT between ChipMOS TECHNOLOGIES INC. and Tsinghua Unigroup Ltd.Share Subscription Agreement • April 18th, 2016 • Chipmos Technologies Bermuda LTD • Semiconductors & related devices
This Share Subscription Agreement (“Agreement”) is executed on this 11th day of December 2015 (“Execution Date”) by and between ChipMOS TECHNOLOGIES INC., a company incorporated under the laws of Taiwan (“ChipMOS”), and Tsinghua Unigroup Ltd., a company incorporated under the laws of People’s Republic of China (“PRC”) (“Tsinghua Unigroup”). ChipMOS and Tsinghua Unigroup shall collectively be referred to as the “Parties.”
SECOND AMENDMENT TO ASSEMBLY AND TEST SERVICES AGREEMENTAssembly and Test Services Agreement • June 6th, 2008 • Chipmos Technologies Bermuda LTD • Semiconductors & related devices
THIS SECOND AMENDMENT is made effective the 16th day of July, 2007 (the “Effective Date”) by and between SPANSION LLC, having its principal place of business at 915 DeGuigne Drive, Sunnyvale, California, 94088-3453 (hereinafter referred to as “Spansion”), and ChipMOS TECHNOLOGIES, INC., having its principal place of business at No. 1 R&D Rd.1, Hsinchu Science Park, Hsinchu, Taiwan, R.O.C. (hereinafter referred to as “ChipMOS”).
SHARE PURCHASE AGREEMENT between CHIPMOS TECHNOLOGIES (BERMUDA) LTD. and SILICONWARE PRECISION INDUSTRIES CO., LTD. February 26, 2010Share Purchase Agreement • June 4th, 2010 • Chipmos Technologies Bermuda LTD • Semiconductors & related devices
This SHARE PURCHASE AGREEMENT (this “Agreement”) is made and entered into as of February 26, 2010, by and between ChipMOS TECHNOLOGIES (Bermuda) LTD., an exempted company under the laws of Bermuda (“ChipMOS Bermuda”), and Siliconware Precision Industries Co., Ltd., a company incorporated under the laws of the Republic of China (the “SPIL”). Capitalized terms used herein shall have the meaning ascribed to them in Article IX hereto.
English Translation] COOPERATION AGREEMENTCooperation Agreement • June 30th, 2003 • Chipmos Technologies Bermuda LTD • Semiconductors & related devices
This Cooperation Agreement (“Agreement”) is made and entered into this 27th day of March, 2002 by and between the following two parties: Shanghai Qingpu Industrial Zone Development Group Co., Ltd. (hereinafter referred to as Party A), and Modern Mind Technology Limited (hereinafter referred to as Party B).
Translation, for reference only) Subscriber Joinder Agreement ChipMOS TECHNOLOGIES INC. and Tsinghua Unigroup Ltd.Subscriber Joinder Agreement • April 18th, 2016 • Chipmos Technologies Bermuda LTD • Semiconductors & related devices
This Subscriber Joinder Agreement (“Agreement”) is executed on February 25, 2016 (“Execution Date”) between ChipMOS TECHNOLOGIES INC., a company incorporated under the laws of Taiwan (“ChipMOS”), and Tsinghua Unigroup Ltd., a company incorporated under the laws of People’s Republic of China (“PRC”) (“Tsinghua Unigroup”). ChipMOS and Tsinghua Unigroup shall collectively be referred to as the “Parties.”
Translation, for reference only) Strategic Alliance AgreementStrategic Alliance Agreement • April 18th, 2016 • Chipmos Technologies Bermuda LTD • Semiconductors & related devices
This Strategic Alliance Agreement (“Agreement”) is executed on this 11th day of December, 2015 (“Execution Date”) by and between ChipMOS TECHNOLOGIES INC., a company incorporated under the laws of Taiwan (“ChipMOS”), and Tsinghua Unigroup Ltd. (“Tsinghua Unigroup”), a company incorporated under the laws of the People’s Republic of China (“PRC”). ChipMOS and Tsinghua Unigroup shall collectively be referred to as the “Parties.”
English Translation] Science Park Administration Land Lease AgreementAdministration Land Lease Agreement • June 6th, 2008 • Chipmos Technologies Bermuda LTD • Semiconductors & related devices
Whereas, Party B is a science park enterprise, research institution, incubator center or unit of authority as prescribed in Article 4 or 8 of the Act for Establishment and Administration of Science Parks, the Parties agree to enter into this Lease Agreement whereby Party A shall lease to Party B a parcel of land located in the Science Park as set forth in Article 1 of this Lease Agreement (the “Leased Land”) in accordance with the following terms and conditions:
THIRD AMENDMENT TO ASSEMBLY AND TEST SERVICES AGREEMENTAssembly and Test Services Agreement • June 6th, 2008 • Chipmos Technologies Bermuda LTD • Semiconductors & related devices
THIS THIRD AMENDMENT (“Amendment”) is made effective the 30th day of November, 2007 (the “Effective Date”) by and between SPANSION LLC, having its principal place of business at 915 DeGuigne Drive, Sunnyvale, California, 94088-3453 (hereinafter referred to as “Spansion”), and ChipMOS TECHNOLOGIES, INC., having its principal place of business at No. 1 R&D Rd. 1, Hsinchu Science park, Hsinchu, Taiwan, R.O.C. (hereinafter referred to as “ChipMOS”).
This Second Supplemental Assignment Agreement is made on October 11, 2004 between:Second Supplemental Assignment Agreement • June 29th, 2005 • Chipmos Technologies Bermuda LTD • Semiconductors & related devices
THIS DEED OF ASSIGNMENT is made the 17th day of Dec., 2003Chipmos Technologies Bermuda LTD • June 17th, 2004 • Semiconductors & related devices • Virgin Islands
This Second Supplemental Deed of Assignment is made on October 11, 2004 between:Chipmos Technologies Bermuda LTD • June 29th, 2005 • Semiconductors & related devices
This Supplemental Patent License Agreement is made on July 8, 2004 between:Supplemental Patent License Agreement • June 29th, 2005 • Chipmos Technologies Bermuda LTD • Semiconductors & related devices
MASTER LOAN AGREEMENT dated as of July 12, 2004 among ChipMOS TECHNOLOGIES (Bermuda) LTD., as lender, Modern Mind Technology Limited, as borrower, and Jesper Limited, as guarantorMaster Loan Agreement • June 29th, 2005 • Chipmos Technologies Bermuda LTD • Semiconductors & related devices • New York
MASTER LOAN AGREEMENT, dated as of July 12, 2004, among ChipMOS TECHNOLOGIES (Bermuda) LTD., an exempted company incorporated under the laws of Bermuda (the “Company”), Jesper Limited, a company incorporated under the laws of the British Virgin Islands (“Jesper Limited”), and Modern Mind Technology Limited, a company incorporated under the laws of the British Virgin Islands and a wholly-owned subsidiary of Jesper Limited (“Modern Mind”) (“this Agreement”).
Translation) Merger AgreementMerger Agreement • April 24th, 2015 • Chipmos Technologies Bermuda LTD • Semiconductors & related devices
ChipMOS TECHNOLOGIES INC., a company organized under the laws of the Republic of China (“ROC”), with its registered office at No.1 R&D Rd. 1, Hsinchu Science Park, Baoshan Township, Hsinchu County (“Party A”); and
English Translation] ChipMOS TECHNOLOGIES INC. And CHANTEK ELECTRONIC CO. LTD. Integrated Circuit Processing Agreement Period of Validity: January 1, 2003 – December 31, 2003Chipmos Technologies Bermuda LTD • June 30th, 2003 • Semiconductors & related devices
This agreement is executed by Party A and Party B with regard to the processing of integrated circuits. The two parties have agreed as follows:
THIS DEED OF VARIATION is made 2nd day of December, 2002 BETWEENChipmos Technologies Bermuda LTD • June 30th, 2003 • Semiconductors & related devices • Virgin Islands
THIS DEED OF ASSIGNMENT is made the 27thday of December, 2002 BETWEENChipmos Technologies Bermuda LTD • June 30th, 2003 • Semiconductors & related devices • Virgin Islands
TECHNOLOGY TRANSFER AGREEMENTTechnology Transfer Agreement • June 30th, 2003 • Chipmos Technologies Bermuda LTD • Semiconductors & related devices • Hong Kong
This Technology Transfer Agreement (this “Agreement”) is made and executed as of this 1st day of August, 2002, by and between ChipMOS TECHNOLOGIES (Bermuda) LTD., a company incorporated under the laws of Bermuda, and having its principal office of business located at Cedar House, 41 Cedar Avenue, Hamilton HM 12, Bermuda (hereinafter referred to as “ChipMOS (Bermuda)”), and ChipMOS TECHNOLOGIES (Shanghai) LTD., a company incorporated under the laws of the People’s Republic of China, and having its principal office of business located at 1688, Xin-Qu Road, Qingpu Industrial Zone, Shanghai, China.
This Third Supplemental Patent License Agreement is made on December 30, 2004 between:Chipmos Technologies Bermuda LTD • June 29th, 2005 • Semiconductors & related devices
EQUIPMENT PURCHASE AGREEMENT between CHIPMOS TECHNOLOGIES INC. and SILICONWARE PRECISION INDUSTRIES CO., LTD. February 26, 2010Equipment Purchase Agreement • June 4th, 2010 • Chipmos Technologies Bermuda LTD • Semiconductors & related devices
This EQUIPMENT PURCHASE AGREEMENT (this “Agreement”) is made and entered into as of February 26, 2010, by and between ChipMOS TECHNOLOGIES INC., a company incorporated under the laws of the Republic of China (“ChipMOS Taiwan” or the “Purchaser”), and Siliconware Precision Industries Co., Ltd., a company incorporated under the laws of the Republic of China (“SPIL” or the “Seller”). Capitalized terms used herein shall have the meaning ascribed to them in Article I hereto.
English Translation] ChipMOS TECHNOLOGIES INC. And CHANTEK ELECTRONIC CO. LTD. Raw Materials Processing Agreement Period of Validity: January 1, 2003 – December 31, 2003Processing Agreement • June 30th, 2003 • Chipmos Technologies Bermuda LTD • Semiconductors & related devices
This agreement is executed by Party A and Party B with regard to the commissioning of semiconductor raw materials processing. The two parties have agreed as follows:
English Translation] MOSEL VITELIC INC.Sale and Purchase Agreement • June 30th, 2003 • Chipmos Technologies Bermuda LTD • Semiconductors & related devices
Mosel Vitelic Inc., a company duly established and validly existing under the laws of the Republic of China, with its principal office at No. 19, Li-Hsin Road, Science-based Industrial Park, Hsinchu, Taiwan (“Party A”), and
REGISTRATION RIGHTS AGREEMENT among CHIPMOS TECHNOLOGIES (BERMUDA) LTD. PROMOS TECHNOLOGIES INC. POWERTECH TECHNOLOGY INC. and GIANT HAVEN INVESTMENTS LIMITED August 8, 2007Registration Rights Agreement • June 6th, 2008 • Chipmos Technologies Bermuda LTD • Semiconductors & related devices • New York
REGISTRATION RIGHTS AGREEMENT, dated as of August 7, 2007 (this “Agreement”), among ChipMOS Technologies (Bermuda) Ltd., an exempted company under the laws of Bermuda (the “Company”), ProMOS Technologies Inc., a company incorporated under the laws of Taiwan, Republic of China (“ProMOS”), Powertech Technology Inc., a company incorporated under the laws of Taiwan, Republic of China (“Powertech”), and Giant Haven Investments Limited, a company incorporated under the laws of the British Virgin Islands (“Giant Haven”). ProMOS, Powertech and Giant Haven, are collectively referred to herein as the “Investors”, and each as an “Investor”.
ChipMOS TECHNOLOGIES (Bermuda) LTD. as Assignor -and- THAILIN SEMICONDUCTOR CORP. as Assignee ASSIGNMENT AND ASSUMPTION AGREEMENT in respect of Master Loan Agreement dated as of July 12, 2004 among ChipMOS TECHNOLOGIES (Bermuda) LTD., as lender,...Assignment and Assumption Agreement • June 3rd, 2011 • Chipmos Technologies Bermuda LTD • Semiconductors & related devices
Whereas, the Assignor, Jesper Limited, a company incorporated under the laws of the British Virgin Islands (“Jesper Limited”) and Modern Mind Technology Limited, a company incorporated under the laws of the British Virgin Islands and a wholly-owned subsidiary of Jesper Limited (“Modern Mind”) have entered into a Master Loan Agreement dated as of July 12, 2004 (the “Master Loan Agreement”), under which the Assignor was willing to provide Modern Mind a loan of US$62,821,354.16 in the form of a demand note on the terms and conditions set forth herein and may be willing to provide Modern Mind with additional funds, should Assignor in its sole and absolute discretion decide from time to time to provide additional funds;
English Translation] THAILIN SEMICONDUCTOR CORP. (Lessor) and ChipMOS TECHNOLOGIES INC. (Lessee) Specification of Equipment – T5375 Tester & M6542AD Handler Lease AgreementLease Agreement • June 6th, 2008 • Chipmos Technologies Bermuda LTD • Semiconductors & related devices
Party B intends to lease from Party A certain equipment and therefore the Parties hereby enter into this Lease Agreement (the “Agreement”), which will stipulate any rights or obligations that may arise from such lease. This Agreement is executed in two counterparts, with each Party holding one counterpart as evidence.
English Translation] Southern Taiwan Science Park Administration Land Lease AgreementLease Agreement • June 6th, 2008 • Chipmos Technologies Bermuda LTD • Semiconductors & related devices
Whereas, Party B is a science park enterprise, research institution, incubator center, unit of authority or school as prescribed in Article 4, 8 or 9 of the Act for Establishment and Administration of Science Parks, the Parties agree to enter into this Lease Agreement whereby Party A shall lease to Party B a parcel of land located in the Taiwan Science Park as set forth in Article 1 of this Lease Agreement (the “Leased Land”) in accordance with the following terms and conditions:
English Translation] TECHNOLOGY TRANSFER AGREEMENTTechnology Transfer Agreement • June 30th, 2003 • Chipmos Technologies Bermuda LTD • Semiconductors & related devices
ThaiLin Semiconductor Corp., a company incorporated under the laws of the Republic of China, and its principal office of business is located at 4, Yende Road, Fengshan Village, Hukou, Hisinchu (hereinafter referred to as “ThaiLin”); and
English Translation] Lease Agreement between ChipMOS TECHNOLOGIES INC. and SyncMOS Technologies, Inc. Agreement No. LH0103 June 1, 2002Lease Agreement • June 30th, 2003 • Chipmos Technologies Bermuda LTD • Semiconductors & related devices
ChipMOS TECHNOLOGIES INC. (“Party A” hereafter), the Leasor, and SyncMOS Technologies, Inc. (“Party B” hereafter), the Leasee, entered into this Lease Agreement for purposes of leasing certain part of the premises at 1, R & D Road 1, Hsinchu Science-Based Industrial Park (as described in detail in the exhibit hereto) for office and storage space (the “Premises” hereafter). Both Parties hereby have agreed as follows, and this Agreement shall supersede the Lease Agreement, dated May 22, 2001, between both Parties:
ASSIGNMENT AGREEMENTAssignment Agreement • June 8th, 2007 • Chipmos Technologies Bermuda LTD • Semiconductors & related devices
This Assignment Agreement (the “Agreement”) is made and entered into as of April 12, 2007 by and between ChipMOS TECHNOLOGIES INC., a company incorporated under the laws of the Republic of China (the “ROC”) and having its principal office of business located at No. 1, R&D Rd. 1, Science Park, Hsinchu, Taiwan, ROC (the “Assignor”) and ChipMOS TECHNOLOGIES (Bermuda) LTD., a company organized under the laws of Bermuda and having its principal office of business located at 11F., No. 3, Lane 91, Dongmei Rd., Hsinchu, Taiwan, ROC (the “Assignee”).
