Chipmos Technologies Inc Sample Contracts

Chipmos Technologies Inc – Unimos Microelectronics (Shanghai) Co., Ltd. The 5th Supplemental Agreement for AGREEMENT FOR SINO-FOREIGN EQUITY JOINT VENTURE (April 25th, 2019)

WHEREAS, Tibet Unigroup Guowei Investment Co., Ltd., ChipMOS TECHNOLOGIES (BVI) LTD., Accretech (China) Co., Ltd., Chao-Jung Tsai, Shih-Jye Cheng, Shanghai Zuzhu Business Consulting Partnership (Limited Partnership), Shou-Kang Chen, David W. Wang, and Gongqingcheng Changhou Hong Xin Investment Management Partnership (Limited Partnership) made and executed the “AGREEMENT FOR SINO-FOREIGN EQUITY JOINT VENTURE” and the supplemental agreements thereof (hereinafter collectively referred to as “JV Agreement”) respectively on November 30, 2016, April 10, 2017, November 28, 2017, August 1, 2018 and December 29, 2018, for the matter of joint venture of Unimos Microelectronics (Shanghai) Co., Ltd. (“Unimos Shanghai” or the “Company”);

Chipmos Technologies Inc – ChipMOS TECHNOLOGIES (Shanghai) LTD. The 2nd Supplemental Agreement for AGREEMENT FOR SINO-FOREIGN EQUITY JOINT VENTURE (April 25th, 2019)

WHEREAS, Tibet Unigroup GuoWei Investment Co., Ltd., ChipMOS TECHNOLOGIES (BVI) LTD., Gongqingcheng Changhou Investment Management Ltd., Accretech (China) Co., Ltd., Chao-Jung Tsai, Shih-Jye Cheng, Shanghai Zuzhu Business Consulting Partnership (Limited Partnership), Shou-Kang Chen, David W.Wang, and Gongqingcheng Changhou Hong Xin Investment Management Partnership (Limited Partnership) (“Hong Xin Capital”) made and executed the “AGREEMENT FOR SINO-FOREIGN EQUITY JOINT VENTURE” and the supplemental agreements thereof (hereinafter collectively referred to as “JV Agreement”) respectively on November 30, 2016 and April 10, 2017 for the matter of the joint venture of ChipMOS TECHNOLOGIES (Shanghai) LTD. (“ChipMOS Shanghai” or the “Company”);

Chipmos Technologies Inc – Unimos Microelectronics (Shanghai) Co., Ltd. The 4th Supplemental Agreement for AGREEMENT FOR SINO-FOREIGN EQUITY JOINT VENTURE (April 25th, 2019)

WHEREAS, Tibet Unigroup Guowei Investment Co., Ltd., ChipMOS TECHNOLOGIES (BVI) LTD., Accretech (China) Co., Ltd., Chao-Jung Tsai, Shih-Jye Cheng, Shanghai Zuzhu Business Consulting Partnership (Limited Partnership), Shou-Kang Chen, David W. Wang, and Gongqingcheng Changhou Hong Xin Investment Management Partnership (Limited Partnership) made and executed the “AGREEMENT FOR SINO-FOREIGN EQUITY JOINT VENTURE” and the supplemental agreements thereof (hereinafter collectively referred to as “JV Agreement”) respectively on November 30, 2016, April 10, 2017, November 28, 2017, and August 1, 2018, for the matter of joint venture of Unimos Microelectronics (Shanghai) Co., Ltd. (“Unimos Shanghai” or the “Company”);

Chipmos Technologies Inc – ChipMOS TECHNOLOGIES (Shanghai) LTD. The Supplemental Agreement for AGREEMENT FOR SINO-FOREIGN EQUITY JOINT VENTURE (April 25th, 2019)

WHEREAS, Tibet Unigroup GuoWei Investment Co., Ltd., ChipMOS TECHNOLOGIES (BVI) LTD., Gongqingcheng Changhou Investment Management Ltd. (“Changhou Capital”), Accretech (China) Co Ltd., Chao-Jung Tsai, Shih-Jye Cheng, Shanghai Zuzhu Business Consulting Partnership (Limited Partnership), Shou-Kang Chen, and David W. Wang made and executed the “AGREEMENT FOR SINO-FOREIGN EQUITY JOINT VENTURE” (hereinafter referred to as “JV Agreement”) on November 30, 2016 for the matter of joint venture of ChipMOS TECHNOLOGIES (Shanghai) LTD. (“ChipMOS Shanghai”);

Chipmos Technologies Inc – Unimos Microelectronics (Shanghai) Co., Ltd. The 3rd Supplemental Agreement for AGREEMENT FOR SINO-FOREIGN EQUITY JOINT VENTURE (April 25th, 2019)

WHEREAS, Tibet Unigroup GuoWei Investment Co., Ltd., ChipMOS TECHNOLOGIES (BVI) LTD., Gongqingcheng Changhou Investment Management Ltd., Accretech (China) Co., Ltd., Chao-Jung Tsai, Shih-Jye Cheng, Shanghai Zuzhu Business Consulting Partnership (Limited Partnership), Shou-Kang Chen, David W. Wang, and Gongqingcheng Changhou Hong Xin Investment Management Partnership (Limited Partnership) made and executed the “AGREEMENT FOR SINO-FOREIGN EQUITY JOINT VENTURE” and the supplemental agreements thereof (hereinafter collectively referred to as “JV Agreement”) respectively on November 30, 2016, April 10, 2017 and November 28, 2017 for the matter of joint venture of ChipMOS TECHNOLOGIES (Shanghai) LTD. (“ChipMOS Shanghai”);

Chipmos Technologies Inc – [TRANSLATION FOR REFERENCE ONLY] (April 25th, 2019)

ChipMOS TECHNOLOGIES INC. (VAT No.: 16130042) is a company organized and existing under the laws of the Republic of China. In order to repay existing debts to financial institutions (including, but not limited to, the outstanding amount under the NT$13.2 billion (NT$13,200,000,000) syndicated loan agreement entered into in 2016 to which Land Bank of Taiwan acted as the lead arranger) and to replenish its mid-term operating working capital, ChipMOS TECHNOLOGIES INC. has applied for a total facility in the amount of NT$12 billion (NT$12,000,000,000) to be extended by eleven (11) financial institutions, i.e., Taiwan Cooperative Bank Co., Ltd., Bank of Taiwan Co., Ltd., Land Bank of Taiwan Co., Ltd., Taishin International Bank Co., Ltd., Hua Nan Commercial Bank, Ltd., Chang Hwa Commercial Bank Co., Ltd., Yuanta Commercial Bank Co., Ltd. (above each a “Lead Arranger”, and collectively, the “Lead Arrangers”), First Commercial Bank Co., Ltd., Taiwan Shin Kong Commercial Bank Co., Ltd., Bank o

Chipmos Technologies Inc – (Translation, for reference only) Termination Agreement (April 20th, 2017)

THIS TERMINATION AGREEMENT (“Agreement”) is made and entered into as of November 30, 2016 (“Execution Date”), by and between ChipMOS TECHNOLOGIES INC., a company incorporated under the laws of Taiwan (“ChipMOS Taiwan”), and Tsinghua Unigroup Ltd., a company incorporated under the laws of the People’s Republic of China (“Tsinghua Unigroup”).

Chipmos Technologies Inc – (Translation, for reference only) Equity Interest Transfer Agreement (April 20th, 2017)
Chipmos Technologies Inc – (Translation, for reference only) Termination Agreement (April 20th, 2017)

THIS TERMINATION AGREEMENT (“Agreement”) is made and entered into as of November 30, 2016 (“Execution Date”), by and between ChipMOS TECHNOLOGIES INC., a company incorporated under the laws of Taiwan (“ChipMOS Taiwan”), and Tibet MaoYeChaungXin INVESTMENT CO., LIMITED., a company incorporated under the laws of the People’s Republic of China (“Subscriber”).

Chipmos Technologies Inc – (Proprietary & Strictly Confidential) ChipMOS TECHNOLOGIES (Shanghai) LTD. AGREEMENT FOR SINO-FOREIGN EQUITY JOINT VENTURE (April 20th, 2017)

THIS “AGREEMENT FOR SINO-FOREIGN EQUITY JOINT VENTURE” (this “Agreement”) is entered into as of this 30th day of November, 2016 in Beijing by and among:

Chipmos Technologies Inc – (Translation, for reference only) Equity Interest Transfer Agreement (April 20th, 2017)
Chipmos Technologies Inc – (Privileged and Strictly Confidential) ChipMOS TECHNOLOGIES (SHANGHAI) LTD. EQUITY INTEREST TRANSFER AGREEMENT ChipMOS TECHNOLOGIES (BVI) LTD. (as Transferor) AND TIBET UNIGROUP GUOWEI INVESTMENT CO LTD. (as Transferee) AND ChipMOS TECHNOLOGIES INC. (April 20th, 2017)
Chipmos Technologies Inc – Equity Interest Transfer Agreement (April 20th, 2017)
Chipmos Technologies Inc – (Translation, for reference only) Equity Interest Transfer Agreement (April 20th, 2017)
Chipmos Technologies Inc – (Translation, for reference only) Equity Interest Transfer Agreement (April 20th, 2017)
Chipmos Technologies Inc – [TRANSLATION FOR REFERENCE ONLY] NT$13,200,000,000 Syndicated Loan Agreement ChipMOS TECHNOLOGIES INC. (as Borrower) Land Bank of Taiwan Co., Ltd. Bank of Taiwan Co., Ltd. Taiwan Cooperative Bank Co., Ltd. (as Lead Arrangers and Lenders) Taishin International Bank Co., Ltd. Chang Hwa Commercial Bank, Ltd. Hua Nan Commercial Bank, Ltd. Yuanta Commercial Bank Co., Ltd. Ta Chong Bank, Ltd. Taiwan Shin Kong Commercial Bank Co., Ltd. Bank of Panhsin Co., Ltd. (as Lenders) Land Bank of Taiwan Co., Ltd. (as Facility Agent) Bank of Taiwan Co., Ltd. Taiwan Cooperative Bank Co., Ltd. (as Collateral Agen (April 20th, 2017)

To repay the existing loans from the financial institutions (including, but not limited to, the outstanding amount under the 2014 Syndicated Loan (as defined hereunder)) and to replenish the working capital, the Borrower requests the Lead Arranger to organize the Lenders and applies for a credit facility in the amount of NT$13.2 billion (NT$13,200,000,000) (hereinafter this “Syndicated Loan”).

Chipmos Technologies Inc – (Translation, for reference only) Equity Interest Transfer Agreement (April 20th, 2017)
Chipmos Technologies Inc – (Translation, for reference only) Equity Interest Transfer Agreement (April 20th, 2017)