Translation, for reference only) Equity Interest Transfer AgreementEquity Interest Transfer Agreement • April 20th, 2017 • Chipmos Technologies Inc • Semiconductors & related devices
TRANSLATION FOR REFERENCE ONLY] NT$13,200,000,000 Syndicated Loan Agreement ChipMOS TECHNOLOGIES INC. (as Borrower) Land Bank of Taiwan Co., Ltd. Bank of Taiwan Co., Ltd. Taiwan Cooperative Bank Co., Ltd. (as Lead Arrangers and Lenders) Taishin...Syndicated Loan Agreement • April 20th, 2017 • Chipmos Technologies Inc • Semiconductors & related devices
To repay the existing loans from the financial institutions (including, but not limited to, the outstanding amount under the 2014 Syndicated Loan (as defined hereunder)) and to replenish the working capital, the Borrower requests the Lead Arranger to organize the Lenders and applies for a credit facility in the amount of NT$13.2 billion (NT$13,200,000,000) (hereinafter this “Syndicated Loan”).
SHARE SUBSCRIPTION AGREEMENTShare Subscription Agreement • February 26th, 2016 • Chipmos Technologies Inc
This Share Subscription Agreement ("Agreement") is executed on this 11th day of December 2015 ("Execution Date") by and between ChipMOS TECHNOLOGIES INC., a company incorporated under the laws of Taiwan ("ChipMOS"), and Tsinghua Unigroup Ltd., a company incorporated under the laws of People's Republic of China ("PRC") ("Tsinghua Unigroup"). ChipMOS and Tsinghua Unigroup shall collectively be referred to as the "Parties."
Unimos Microelectronics (Shanghai) Co., Ltd. The 5th Supplemental Agreement for AGREEMENT FOR SINO-FOREIGN EQUITY JOINT VENTUREChipmos Technologies Inc • April 25th, 2019 • Semiconductors & related devices
WHEREAS, Tibet Unigroup Guowei Investment Co., Ltd., ChipMOS TECHNOLOGIES (BVI) LTD., Accretech (China) Co., Ltd., Chao-Jung Tsai, Shih-Jye Cheng, Shanghai Zuzhu Business Consulting Partnership (Limited Partnership), Shou-Kang Chen, David W. Wang, and Gongqingcheng Changhou Hong Xin Investment Management Partnership (Limited Partnership) made and executed the “AGREEMENT FOR SINO-FOREIGN EQUITY JOINT VENTURE” and the supplemental agreements thereof (hereinafter collectively referred to as “JV Agreement”) respectively on November 30, 2016, April 10, 2017, November 28, 2017, August 1, 2018 and December 29, 2018, for the matter of joint venture of Unimos Microelectronics (Shanghai) Co., Ltd. (“Unimos Shanghai” or the “Company”);
Proprietary & Strictly Confidential) UNIMOS MICROELECTRONICS (SHANGHAI) CO., LTD. AMENDED AND RESTATED AGREEMENT FOR SINO-FOREIGN EQUITY JOINT VENTURE (Translation, for reference only)Amended and Restated Agreement • April 23rd, 2020 • Chipmos Technologies Inc • Semiconductors & related devices
ChipMOS TECHNOLOGIES (Shanghai) LTD. The 2nd Supplemental Agreement for AGREEMENT FOR SINO-FOREIGN EQUITY JOINT VENTUREChipmos Technologies Inc • April 25th, 2019 • Semiconductors & related devices
WHEREAS, Tibet Unigroup GuoWei Investment Co., Ltd., ChipMOS TECHNOLOGIES (BVI) LTD., Gongqingcheng Changhou Investment Management Ltd., Accretech (China) Co., Ltd., Chao-Jung Tsai, Shih-Jye Cheng, Shanghai Zuzhu Business Consulting Partnership (Limited Partnership), Shou-Kang Chen, David W.Wang, and Gongqingcheng Changhou Hong Xin Investment Management Partnership (Limited Partnership) (“Hong Xin Capital”) made and executed the “AGREEMENT FOR SINO-FOREIGN EQUITY JOINT VENTURE” and the supplemental agreements thereof (hereinafter collectively referred to as “JV Agreement”) respectively on November 30, 2016 and April 10, 2017 for the matter of the joint venture of ChipMOS TECHNOLOGIES (Shanghai) LTD. (“ChipMOS Shanghai” or the “Company”);
Proprietary & Strictly Confidential) UNIMOS MICROELECTRONICS (SHANGHAI) CO., LTD. AMENDED AND RESTATED AGREEMENT FOR SINO-FOREIGN EQUITY JOINT VENTUREChipmos Technologies Inc • April 13th, 2023 • Semiconductors & related devices
First Supplemental Agreement to Syndicated Loan AgreementChipmos Technologies Inc • April 23rd, 2020 • Semiconductors & related devices
Translation, for reference only) Equity Interest Transfer AgreementEquity Interest Transfer Agreement • April 20th, 2017 • Chipmos Technologies Inc • Semiconductors & related devices
English Translation] Strategic Alliance AgreementStrategic Alliance Agreement • February 26th, 2016 • Chipmos Technologies Inc
This Strategic Alliance Agreement ("Agreement") is executed on this 11th day of December, 2015 ("Execution Date") by and between ChipMOS TECHNOLOGIES INC., a company incorporated under the laws of Taiwan ("ChipMOS"), and Tsinghua Unigroup Ltd. ("Tsinghua Unigroup"), a company incorporated under the laws of the People's Republic of China ("PRC"). ChipMOS and Tsinghua Unigroup shall collectively be referred to as the "Parties."
Proprietary & Strictly Confidential) UNIMOS MICROELECTRONICS (SHANGHAI) CO., LTD. AMENDED AND RESTATED AGREEMENT FOR SINO-FOREIGN EQUITY JOINT VENTUREChipmos Technologies Inc • April 11th, 2024 • Semiconductors & related devices
ChipMOS TECHNOLOGIES (BVI) LTD. AND SUZHOU ORIZA PUHUA ZHIXIN EQUITY INVESTMENT PARTNERSHIP (L.P.) SUZHOU PUHUA CHUANXIN VENTURE CAPITAL PARTNERSHIP (LIMITED PARTNERSHIP) SUZHOU PUHUA XINCHENG VENTURE CAPITAL PARTNERSHIP (LIMITED PARTNERSHIP) SUZHOU...Equity Interest Transfer Agreement • April 11th, 2024 • Chipmos Technologies Inc • Semiconductors & related devices
This Equity Interest Transfer Agreement (this "Agreement") is executed by the following parties in Qingpu District, Shanghai, PRC on December 21, 2023 ("Execution Date").
Unimos Microelectronics (Shanghai) Co., Ltd. The 4th Supplemental Agreement for AGREEMENT FOR SINO-FOREIGN EQUITY JOINT VENTUREChipmos Technologies Inc • April 25th, 2019 • Semiconductors & related devices
WHEREAS, Tibet Unigroup Guowei Investment Co., Ltd., ChipMOS TECHNOLOGIES (BVI) LTD., Accretech (China) Co., Ltd., Chao-Jung Tsai, Shih-Jye Cheng, Shanghai Zuzhu Business Consulting Partnership (Limited Partnership), Shou-Kang Chen, David W. Wang, and Gongqingcheng Changhou Hong Xin Investment Management Partnership (Limited Partnership) made and executed the “AGREEMENT FOR SINO-FOREIGN EQUITY JOINT VENTURE” and the supplemental agreements thereof (hereinafter collectively referred to as “JV Agreement”) respectively on November 30, 2016, April 10, 2017, November 28, 2017, and August 1, 2018, for the matter of joint venture of Unimos Microelectronics (Shanghai) Co., Ltd. (“Unimos Shanghai” or the “Company”);
ChipMOS TECHNOLOGIES (Shanghai) LTD. The Supplemental Agreement for AGREEMENT FOR SINO-FOREIGN EQUITY JOINT VENTUREChipmos Technologies Inc • April 25th, 2019 • Semiconductors & related devices
WHEREAS, Tibet Unigroup GuoWei Investment Co., Ltd., ChipMOS TECHNOLOGIES (BVI) LTD., Gongqingcheng Changhou Investment Management Ltd. (“Changhou Capital”), Accretech (China) Co Ltd., Chao-Jung Tsai, Shih-Jye Cheng, Shanghai Zuzhu Business Consulting Partnership (Limited Partnership), Shou-Kang Chen, and David W. Wang made and executed the “AGREEMENT FOR SINO-FOREIGN EQUITY JOINT VENTURE” (hereinafter referred to as “JV Agreement”) on November 30, 2016 for the matter of joint venture of ChipMOS TECHNOLOGIES (Shanghai) LTD. (“ChipMOS Shanghai”);
The 7th Supplemental Agreement for AGREEMENT FOR SINO-FOREIGN EQUITY JOINT VENTUREChipmos Technologies Inc • April 23rd, 2020 • Semiconductors & related devices
WHEREAS, Tibet Unigroup Guowei Investment Co., Ltd. ("Investor A"), ChipMOS TECHNOLOGIES (BVI) LTD. ("Investor B"), Accretech (China) Co., Ltd., Chao-Jung Tsai, Shih-Jye Cheng, Shanghai Zuzhu Business Consulting Partnership (Limited Partnership), Shou-Kang Chen, David W. Wang, and Gongqingcheng Changhou Hong Xin Investment Management Partnership (Limited Partnership) (the parties hereunder other than Investor A and Investor B shall be referred to as "Investor C" individually or collectively) made and executed the "AGREEMENT FOR SINO-FOREIGN EQUITY JOINT VENTURE" and the 1st, 2nd, and 3rd supplemental agreements thereof (hereinafter collectively referred to as "JV Agreement") respectively on November 30, 2016, April 10, 2017, November 28, 2017 and August 1, 2018, for the matter of joint venture of Unimos Microelectronics (Shanghai) Co., Ltd. ("Unimos Shanghai" or the "Company"). Furthermore, as the shareholder of Investor A, Beijing Unis Memory Technology Co., Ltd. made and executed the
Translation, for reference only) Termination AgreementTermination Agreement • April 20th, 2017 • Chipmos Technologies Inc • Semiconductors & related devices
THIS TERMINATION AGREEMENT (“Agreement”) is made and entered into as of November 30, 2016 (“Execution Date”), by and between ChipMOS TECHNOLOGIES INC., a company incorporated under the laws of Taiwan (“ChipMOS Taiwan”), and Tibet MaoYeChaungXin INVESTMENT CO., LIMITED., a company incorporated under the laws of the People’s Republic of China (“Subscriber”).
Translation, for reference only) Termination AgreementTermination Agreement • April 20th, 2017 • Chipmos Technologies Inc • Semiconductors & related devices
THIS TERMINATION AGREEMENT (“Agreement”) is made and entered into as of November 30, 2016 (“Execution Date”), by and between ChipMOS TECHNOLOGIES INC., a company incorporated under the laws of Taiwan (“ChipMOS Taiwan”), and Tsinghua Unigroup Ltd., a company incorporated under the laws of the People’s Republic of China (“Tsinghua Unigroup”).
Proprietary & Strictly Confidential) ChipMOS TECHNOLOGIES (Shanghai) LTD. AGREEMENT FOR SINO-FOREIGN EQUITY JOINT VENTUREJoint Venture • April 20th, 2017 • Chipmos Technologies Inc • Semiconductors & related devices
THIS “AGREEMENT FOR SINO-FOREIGN EQUITY JOINT VENTURE” (this “Agreement”) is entered into as of this 30th day of November, 2016 in Beijing by and among:
Privileged and Strictly Confidential) ChipMOS TECHNOLOGIES (SHANGHAI) LTD. EQUITY INTEREST TRANSFER AGREEMENT ChipMOS TECHNOLOGIES (BVI) LTD. (as Transferor) AND TIBET UNIGROUP GUOWEI INVESTMENT CO LTD. (as Transferee) AND ChipMOS TECHNOLOGIES INC.Equity Interest Transfer Agreement • April 20th, 2017 • Chipmos Technologies Inc • Semiconductors & related devices
Equity Interest Transfer AgreementEquity Interest Transfer Agreement • April 20th, 2017 • Chipmos Technologies Inc • Semiconductors & related devices
Proprietary & Strictly Confidential) UNIMOS MICROELECTRONICS (SHANGHAI) CO., LTD. AMENDED AND RESTATED AGREEMENT FOR SINO-FOREIGN EQUITY JOINT VENTUREAnd Restated Agreement • April 20th, 2021 • Chipmos Technologies Inc • Semiconductors & related devices
THIS “AMENDED AND RESTATED AGREEMENT FOR SINO-FOREIGN EQUITY JOINT VENTURE” (this “Agreement”) is entered into as of this 11th day of May, 2020 in Beijing by and among:
Subscriber Joinder AgreementSubscriber Joinder Agreement • February 26th, 2016 • Chipmos Technologies Inc
This Subscriber Joinder Agreement ("Agreement") is executed on February 25, 2016 ("Execution Date") between ChipMOS TECHNOLOGIES INC., a company incorporated under the laws of Taiwan ("ChipMOS"), and Tsinghua Unigroup Ltd., a company incorporated under the laws of People's Republic of China ("PRC") ("Tsinghua Unigroup"). ChipMOS and Tsinghua Unigroup shall collectively be referred to as the "Parties."
Unimos Microelectronics (Shanghai) Co., Ltd. The 3rd Supplemental Agreement for AGREEMENT FOR SINO-FOREIGN EQUITY JOINT VENTUREChipmos Technologies Inc • April 25th, 2019 • Semiconductors & related devices
WHEREAS, Tibet Unigroup GuoWei Investment Co., Ltd., ChipMOS TECHNOLOGIES (BVI) LTD., Gongqingcheng Changhou Investment Management Ltd., Accretech (China) Co., Ltd., Chao-Jung Tsai, Shih-Jye Cheng, Shanghai Zuzhu Business Consulting Partnership (Limited Partnership), Shou-Kang Chen, David W. Wang, and Gongqingcheng Changhou Hong Xin Investment Management Partnership (Limited Partnership) made and executed the “AGREEMENT FOR SINO-FOREIGN EQUITY JOINT VENTURE” and the supplemental agreements thereof (hereinafter collectively referred to as “JV Agreement”) respectively on November 30, 2016, April 10, 2017 and November 28, 2017 for the matter of joint venture of ChipMOS TECHNOLOGIES (Shanghai) LTD. (“ChipMOS Shanghai”);
Translation, for reference only) Equity Interest Transfer AgreementEquity Interest Transfer Agreement • April 20th, 2017 • Chipmos Technologies Inc • Semiconductors & related devices
Unimos Microelectronics (Shanghai) Co., Ltd. The 6th Supplemental Agreement for AGREEMENT FOR SINO-FOREIGN EQUITY JOINT VENTUREChipmos Technologies Inc • April 23rd, 2020 • Semiconductors & related devices
WHEREAS, Tibet Unigroup Guowei Investment Co., Ltd., ChipMOS TECHNOLOGIES (BVI) LTD., Accretech (China) Co., Ltd., Chao-Jung Tsai, Shih-Jye Cheng, Shanghai Zuzhu Business Consulting Partnership (Limited Partnership), Shou-Kang Chen, David W. Wang, and Gongqingcheng Changhou Hong Xin Investment Management Partnership (Limited Partnership) made and executed the “AGREEMENT FOR SINO-FOREIGN EQUITY JOINT VENTURE” and the 1st, 2nd, and 3rd supplemental agreements thereof (hereinafter collectively referred to as “JV Agreement”) respectively on November 30, 2016, April 10, 2017, November 28, 2017 and August 1, 2018, for the matter of joint venture of Unimos Microelectronics (Shanghai) Co., Ltd. (“Unimos Shanghai” or the “Company”). Furthermore, as the shareholder of Investor A, Beijing Unis Memory Technology Co., Ltd. made and executed the 4th and 5th supplemental agreements with the shareholders of the Company except Tibet Unigroup Guowei Investment Co., Ltd. on December 29, 2018 and February
