INDEMNITY AGREEMENTIndemnity Agreement • March 10th, 2015 • eASIC Corp • Semiconductors & related devices • Delaware
THIS INDEMNITY AGREEMENT (this “Agreement”) dated as of , 2015, is made by and between EASIC CORPORATION, a Delaware corporation (the “Company”), and (“Indemnitee”).
ContracteASIC Corp • December 18th, 2014 • Semiconductors & related devices • New York
THIS WARRANT HAS NOT BEEN REGISTERED UNDER THE SECURITIES ACT OF 1933, AS AMENDED OR ANY STATE SECURITIES LAWS. NO SALE OR DISPOSITION MAY BE EFFECTED WITHOUT (i) EFFECTIVE REGISTRATION STATEMENTS RELATED THERETO, (ii) AN OPINION OF COUNSEL OR OTHER EVIDENCE, REASONABLY SATISFACTORY TO THE COMPANY, THAT SUCH REGISTRATIONS ARE NOT REQUIRED, (iii) RECEIPT OF NO-ACTION LETTERS FROM THE APPROPRIATE GOVERNMENTAL AUTHORITIES, OR (iv) OTHERWISE COMPLYING WITH THE PROVISIONS OF SECTION 7 OF THIS WARRANT.
LEASE BETWEEN FREEDOM CIRCLE LLC AND EASIC CORPORATIONLease • August 10th, 2015 • eASIC Corp • Semiconductors & related devices • California
THIS LEASE is made as of July 20, 2015, by and between FREEDOM CIRCLE LLC, a Delaware limited liability company, hereafter called “Landlord,” and EASIC CORPORATION, a Delaware corporation, hereafter called “Tenant,”
eASIC CORPORATION CHANGE IN CONTROL AND SEVERANCE AGREEMENTRelease Agreement • August 10th, 2015 • eASIC Corp • Semiconductors & related devices • California
This Change in Control and Severance Agreement (this “Agreement”) is entered into by and between (“Executive”) and eASIC Corporation, a Delaware corporation (the “Company”), to become effective upon the date of the Company’s initial public offering.
eASIC CORPORATION AMENDED AND RESTATED INVESTORS’ RIGHTS AGREEMENT December 13, 2012Investors’ Rights Agreement • February 19th, 2015 • eASIC Corp • Semiconductors & related devices • California
This Amended and Restated Investors’ Rights Agreement (this “Agreement”) is made as of December 13, 2012, by and among eASIC Corporation, a Delaware corporation (the “Company”), the holders of shares of Common Stock of the Company listed on Exhibit A hereto (each a “Common Stockholder”), the holders of shares of the Prior Preferred Stock (as defined below) listed on Exhibit B hereto (each a “Preferred Stockholder” and collectively, the “Preferred Stockholders”) and the persons and entities listed on Exhibit C hereto (each, an “Investor” and collectively, the “Investors”). Unless otherwise defined herein, capitalized terms used in this Agreement have the meanings ascribed to them in Section 1.
AMENDED AND RESTATED VENTURE LOAN AND SECURITY AGREEMENTVenture Loan and Security Agreement • February 19th, 2015 • eASIC Corp • Semiconductors & related devices • New York
WHEREAS, Borrower, Lenders and the Collateral Agent are parties to a certain Venture Loan and Security Agreement dated as of September 30, 2013, as amended (as amended, amended and restated, supplemented or otherwise modified from time to time, the “Original Loan Agreement”) pursuant to which, among other things, (i) Horizon provided a loan to eASIC as evidenced by a certain Secured Promissory Note (Loan A) executed by eASIC in favor of Horizon, dated September 30, 2013, in the original principal amount of Two Million and 00/100 Dollars ($2,000,000.00) (the “Loan A Note”), (ii) DBD provided a loan to eASIC as evidenced by a certain Secured Promissory Note (Loan B) executed by eASIC in favor of DBD, dated September 30, 2013, in the original principal amount of Four Million and 00/100 Dollars ($4,000,000.00) (the “Loan B Note” and collectively with the Loan A Note, the “Notes”) and (iii) Collateral Agent and Lenders have been granted a security interest in all assets of eASIC, except wit
LOAN AND SECURITY AGREEMENTLoan and Security Agreement • August 10th, 2015 • eASIC Corp • Semiconductors & related devices • Delaware
THIS LOAN AND SECURITY AGREEMENT (this “Agreement”) dated as of September 29, 2010 (the “Effective Date”) between SILICON VALLEY BANK, a California corporation (“Bank”), and EASIC CORPORATION, a Delaware corporation (“Borrower”), provides the terms on which Bank shall lend to Borrower and Borrower shall repay Bank. The parties agree as follows:
October 15, 2010 Ronnie Vasishta eASIC Corporation Santa Clara, CA 95054 Re: Amended and Restated Employment Agreement Dear Ronnie:eASIC Corp • December 18th, 2014 • Semiconductors & related devices • California
As we have discussed, this letter agreement sets forth your amended and restated employment agreement (the “Agreement”) with eASIC Corporation (the “Company”), which supersedes and replaces in full your previous employment agreement with the Company dated January 29, 2008. This Agreement is effective as of October 15, 2010 (the “Effective Date”), provided that you have signed and returned this Agreement within ten (10) business days after receipt.
April 25, 2008 Mr. Ranko Šćepanović Dear Ranko,eASIC Corp • December 18th, 2014 • Semiconductors & related devices • California
It gives us great pleasure to invite you to join eASIC (the “Company”) as a full time employee. This letter agreement (the “Agreement”) sets forth the basic terms and conditions of your employment. Such employment shall begin May 19th, 2008. By signing this letter, you will be agreeing to these terms. You will be entitled to all Company employee benefits consistent with the Company’s plans.
GENERAL PURCHASE AGREEMENT (GPA) betweenGeneral Purchase Agreement • May 12th, 2015 • eASIC Corp • Semiconductors & related devices
Whereas, Ericsson Companies develop, produce, sell and provide telecommunication systems, products and services globally.
ContracteASIC Corp • February 19th, 2015 • Semiconductors & related devices • California
THIS WARRANT AND THE SHARES ISSUABLE HEREUNDER HAVE NOT BEEN REGISTERED UNDER THE SECURITIES ACT OF 1933, AS AMENDED (THE “ACT”), OR THE SECURITIES LAWS OF ANY STATE AND, EXCEPT AND PURSUANT TO THE PROVISIONS OF ARTICLE 5 BELOW, MAY NOT BE OFFERED, SOLD OR OTHERWISE TRANSFERRED, PLEDGED OR HYPOTHECATED UNLESS AND UNTIL REGISTERED UNDER SAID ACT AND APPLICABLE STATE SECURITIES LAW OR, IN THE OPINION OF LEGAL COUNSEL IN FORM AND SUBSTANCE SATISFACTORY TO THE ISSUER OF THESE SECURITIES, SUCH OFFER, SALE OR TRANSFER, PLEDGE OR HYPOTHECATION IS EXEMPT FROM REGISTRATION.
GENERAL PURCHASE AGREEMENT (GPA) betweenGeneral Purchase Agreement • March 4th, 2015 • eASIC Corp • Semiconductors & related devices
Whereas, Ericsson Companies develop, produce, sell and provide telecommunication systems, products and services globally.
GENERAL PURCHASE AGREEMENT (GPA) betweenGeneral Purchase Agreement • August 10th, 2015 • eASIC Corp • Semiconductors & related devices
Whereas, Ericsson Companies develop, produce, sell and provide telecommunication systems, products and services globally.
PRODUCT SUPPLY AGREEMENTProduct Supply Agreement • August 10th, 2015 • eASIC Corp • Semiconductors & related devices
This Product Supply Agreement (“Agreement”) is between Seagate Technology LLC (“Seagate”) and the supplier identified below (“Supplier”). The individuals signing this Agreement represent that they are authorized to sign on behalf of their companies.
PRODUCT SUPPLY AGREEMENTProduct Supply Agreement • May 12th, 2015 • eASIC Corp • Semiconductors & related devices
This Product Supply Agreement (“Agreement”) is between Seagate Technology LLC (“Seagate”) and the supplier identified below (“Supplier”). The individuals signing this Agreement represent that they are authorized to sign on behalf of their companies.
CONSULTING AGREEMENTConsulting Agreement • April 21st, 2015 • eASIC Corp • Semiconductors & related devices • California
THIS CONSULTING AGREEMENT is entered into as of January 3, 2013 (“Effective Date”) between EASIC CORPORATION, a Delaware corporation (the “Company”), and MIKE KOUREY (“Advisor”).
PRODUCT SUPPLY AGREEMENTProduct Supply Agreement • March 4th, 2015 • eASIC Corp • Semiconductors & related devices
This Product Supply Agreement (“Agreement”) is between Seagate Technology LLC (“Seagate”) and the supplier identified below (“Supplier”). The individuals signing this Agreement represent that they are authorized to sign on behalf of their companies.
