Stats Chippac Ltd. Sample Contracts

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Indenture • March 18th, 2005 • Stats Chippac Ltd. • Instruments for meas & testing of electricity & elec signals • New York
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Indenture • March 31st, 2003 • St Assembly Test Services LTD • Instruments for meas & testing of electricity & elec signals • New York
RECITALS
Pledge Agreement • March 19th, 2004 • St Assembly Test Services LTD • Instruments for meas & testing of electricity & elec signals
BETWEEN
Agreement • March 19th, 2004 • St Assembly Test Services LTD • Instruments for meas & testing of electricity & elec signals
DATED AS OF NOVEMBER 18, 2004 BY AND AMONG
Registration Rights Agreement • March 18th, 2005 • Stats Chippac Ltd. • Instruments for meas & testing of electricity & elec signals • New York
1 EXHIBIT 2.2 DEPOSIT AGREEMENT
Deposit Agreement • March 30th, 2001 • St Assembly Test Services LTD • Instruments for meas & testing of electricity & elec signals • New York
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St Assembly Test Services LTD • March 19th, 2004 • Instruments for meas & testing of electricity & elec signals • New York
RECITALS
Execution • March 19th, 2004 • St Assembly Test Services LTD • Instruments for meas & testing of electricity & elec signals
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Indenture • March 18th, 2005 • Stats Chippac Ltd. • Instruments for meas & testing of electricity & elec signals • New York
16 JANUARY 2004
Securities Pledge Agreement • March 19th, 2004 • St Assembly Test Services LTD • Instruments for meas & testing of electricity & elec signals • London
ARTICLE 2 NOTE GUARANTEES
Subsidiary Guarantee Agreement • March 18th, 2005 • Stats Chippac Ltd. • Instruments for meas & testing of electricity & elec signals • New York
among
Agreement and Plan of Merger and Reorganization • March 19th, 2004 • St Assembly Test Services LTD • Instruments for meas & testing of electricity & elec signals • Delaware
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ARTICLE 2 NOTE GUARANTEES
Supplemental Subsidiary Guarantee Agreement • February 28th, 2006 • Stats Chippac Ltd. • Instruments for meas & testing of electricity & elec signals • New York
GLOBAL NOTE
St Assembly Test Services LTD • March 19th, 2004 • Instruments for meas & testing of electricity & elec signals

THIS SECURITY IS A GLOBAL NOTE WITHIN THE MEANING OF THE INDENTURE HEREINAFTER REFERRED TO AND IS REGISTERED IN THE NAME OF THE BANK OF NEW YORK DEPOSITARY (NOMINEES) LIMITED AS NOMINEE FOR THE COMMON DEPOSITARY (THE "COMMON DEPOSITARY") FOR EUROCLEAR BANK S.A./N.V. ("EUROCLEAR") AND CLEARSTREAM BANKING, SOCIETE ANONYME ("CLEARSTREAM") OR A NOMINEE THEREOF, WHICH MAY BE TREATED BY THE COMPANY, THE TRUSTEE OR ANY AGENT THEREOF AS OWNER AND HOLDER OF THIS SECURITY FOR ALL PURPOSES. THIS GLOBAL NOTE MAY NOT BE EXCHANGED, IN WHOLE OR IN PART, FOR A SECURITY REGISTERED, AND NO TRANSFER OF THIS GLOBAL NOTE IN WHOLE OR IN PART MAY BE REGISTERED, IN THE NAME OF ANY PERSON OTHER THAN THE BANK OF NEW YORK DEPOSITORY (NOMINEES) LIMITED OR A NOMINEE THEREOF, EXCEPT IN THE LIMITED CIRCUMSTANCES SET FORTH IN THE INDENTURE.

EMPLOYMENT AGREEMENT
Employment Agreement • April 6th, 2004 • St Assembly Test Services LTD • Instruments for meas & testing of electricity & elec signals

THIS EMPLOYMENT AGREEMENT is dated as of this 26th day of February, 2004 by and among ST Assembly Test Services Ltd, a Singapore public company limited by shares (the “Company”), ChipPAC, Inc., a Delaware corporation (“ChipPAC”), Dennis Daniels, an individual (the “Employee”).

MANAGEMENT AND UNDERWRITING AGREEMENT RELATING TO THE SINGAPORE RETAIL OFFERING ALLEN & GLEDHILL, 36, ROBINSON ROAD, #18-01, CITY HOUSE, SINGAPORE 068877.
Management and Underwriting Agreement • January 25th, 2000 • St Assembly Test Services LTD • Instruments for meas & testing of electricity & elec signals
CHIPPAC, INC. RETENTION AND SEVERANCE AGREEMENT
Retention and Severance Agreement • June 10th, 2004 • St Assembly Test Services LTD • Instruments for meas & testing of electricity & elec signals

In recognition of your committed efforts as an employee of ChipPAC, Inc. (the “Company”), we are offering you the opportunity to receive a special retention payment in the amount set forth below (the “Retention Payment”) and a special severance payment in the amount set forth below (the “Severance Payment,” together with other benefits, the “Severance Benefits”) in connection with the closing (the “Closing”) of the transactions contemplated by the Agreement and Plan of Merger and Reorganization among ST Assembly Test Services Ltd, Camelot Merger, Inc. and ChipPAC, Inc. dated as of February 10, 2004. The Retention Benefits and Severance Benefits both will be fully subject to the terms of the ChipPAC, Inc. Employee Retention and Severance Plan (the “Plan”). Capitalized terms used and not otherwise defined herein have the meanings set forth in the Plan.

SUPPLEMENTAL SUBSIDIARY GUARANTEE AGREEMENT with respect to the of STATS CHIPPAC LTD. Dated as of September 18, 2007 GUARANTORS STATS CHIPPAC, INC. STATS HOLDINGS LIMITED STATS CHIPPAC TEST SERVICES, INC. STATS CHIPPAC (BARBADOS) LTD. CHIPPAC...
Supplemental Subsidiary Guarantee Agreement • March 7th, 2008 • Stats Chippac Ltd. • Semiconductors & related devices • New York

SUPPLEMENTAL SUBSIDIARY GUARANTEE AGREEMENT dated as of September 18, 2007 (this “Supplemental Agreement”) made among STATS ChipPAC (Thailand) Limited, a Thailand corporation (the “New Guarantor”), each other then existing Guarantor under the Indenture and Original Agreements referred to below (each, a “Guarantor” and collectively, the “Guarantors” and which shall, upon due execution and delivery of this Supplemental Agreement, include the New Guarantor), STATS ChipPAC Ltd., a corporation organized under the laws of the Republic of Singapore, as issuer (the “Company”), and the Trustee (as defined below).

RECITALS
Yangdo Tambo Agreement • March 19th, 2004 • St Assembly Test Services LTD • Instruments for meas & testing of electricity & elec signals
ASSET PURCHASE AGREEMENT Dated as of July 25, 2007 Among STATS CHIPPAC (THAILAND) LIMITED. and STATS CHIPPAC LTD and LSI (THAI) LTD. And LSI CORPORATION
Asset Purchase Agreement • March 7th, 2008 • Stats Chippac Ltd. • Semiconductors & related devices

ASSET PURCHASE AGREEMENT, dated as of July 25, 2007 (this “Agreement”) among, STATS CHIPPAC (THAILAND) LIMITED. a corporation organized under the laws of the Kingdom of Thailand (“Buyer”), STATS CHIPPAC LTD, a corporation organized under the laws of Singapore (“Buyer Guarantor”), LSI (THAI) LTD., a corporation organized under the laws of the Kingdom of Thailand (“Seller”) and LSI CORPORATION, a corporation organized under the laws of Delaware, USA (“Seller Guarantor”).

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