Viasystems Group Inc Sample Contracts

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THIRD AMENDMENT
Viasystems Group Inc • April 1st, 2002 • Printed circuit boards • New York
W I T N E S S E T H:
Viasystems Group Inc • February 24th, 2000 • Printed circuit boards • New York
AND
Agreement • April 28th, 2004 • Viasystems Group Inc • Printed circuit boards • England
EXHIBIT 4.1 WARRANT AGREEMENT
Warrant Agreement • April 28th, 2004 • Viasystems Group Inc • Printed circuit boards • Delaware
1 EXHIBIT 2.9 STOCK PURCHASE AGREEMENT
Stock Purchase Agreement • September 28th, 2000 • Viasystems Group Inc • Printed circuit boards • Missouri
WITNESSETH:
Viasystems Group Inc • July 30th, 2001 • Printed circuit boards • New York
14% SENIOR NOTES DUE 2007
Viasystems Group Inc • April 29th, 2002 • Printed circuit boards • New York
Dated as of March 29, 2000 Among VIASYSTEMS GROUP, INC., as Guarantor,
Credit Agreement • May 10th, 2000 • Viasystems Group Inc • Printed circuit boards • New York
FIRST AMENDMENT
Stockholders Agreement • March 13th, 2000 • Viasystems Group Inc • Printed circuit boards
ARTICLE 1 DEFINITIONS
Stockholders Agreement • March 13th, 2000 • Viasystems Group Inc • Printed circuit boards • Texas
WITNESSETH:
Viasystems Group Inc • August 14th, 2002 • Printed circuit boards • New York
VIASYSTEMS, INC. AND EACH OF THE GUARANTORS PARTY HERETO 7.875% SENIOR SECURED NOTES DUE 2019 INDENTURE Dated as of April 30, 2012 Wilmington Trust, National Association Trustee
Supplemental Indenture • May 2nd, 2012 • Viasystems Group Inc • Printed circuit boards • New York

INDENTURE dated as of April 30, 2012 among Viasystems, Inc., a Delaware corporation (the “Company”), the Guarantors party hereto and Wilmington Trust, National Association, as trustee (the “Trustee”).

AGREEMENT AND PLAN OF MERGER by and among DDI CORP., VIASYSTEMS GROUP, INC. and VICTOR MERGER SUB CORP. Dated as of April 3, 2012
Agreement and Plan of Merger • April 4th, 2012 • Viasystems Group Inc • Printed circuit boards • Delaware

THIS AGREEMENT AND PLAN OF MERGER (this “Agreement”) is made and entered into as of April 3, 2012, by and among DDi Corp., a Delaware corporation (the “Company”), Viasystems Group, Inc., a Delaware corporation (“Parent”), and Victor Merger Sub Corp., a Delaware corporation and wholly-owned Subsidiary of Parent (“Merger Sub”).

RECITALS:
Contract Manufacturing Agreement • September 28th, 2000 • Viasystems Group Inc • Printed circuit boards
WITNESSETH:
This Agreement • April 29th, 2002 • Viasystems Group Inc • Printed circuit boards • Missouri
WITNESSETH:
Supply Contract • April 28th, 2004 • Viasystems Group Inc • Printed circuit boards • Delaware
AGREEMENT AND PLAN OF MERGER by and among VIASYSTEMS GROUP, INC., TTM TECHNOLOGIES, INC. and VECTOR ACQUISITION CORP. Dated as of September 21, 2014
Agreement and Plan of Merger • September 22nd, 2014 • Viasystems Group Inc • Printed circuit boards • Delaware

THIS AGREEMENT AND PLAN OF MERGER (this “Agreement”) is made and entered into as of September 21, 2014, by and among Viasystems Group, Inc., a Delaware corporation (the “Company”), TTM Technologies, Inc., a Delaware corporation (“Parent”), and Vector Acquisition Corp., a Delaware corporation and wholly owned Subsidiary of Parent (“Merger Sub” and, collectively with the Company and Parent, the “Parties”).

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1 EXHIBIT 4.10 REGISTRATION RIGHTS AGREEMENT DATED AS OF JULY 19, 2001
Registration Rights Agreement • July 30th, 2001 • Viasystems Group Inc • Printed circuit boards • New York
INDUSTRIAL SPACE LEASE (GROSS)
Industrial Space Lease • August 8th, 2012 • Viasystems Group Inc • Printed circuit boards • California

THIS LEASE, dated July 1, 2012, for reference purposes only, is made by and between ROBERT D. DUCOTE and GAIL H. DUCOTE (“Landlord”), and Viasystems Corporation (“Tenant”), to be effective and binding upon the parties as of the date of the last designated signatories to this Lease shall have executed this Lease (the “Effective Date of this Lease”).

VOTING AGREEMENT
Voting Agreement • April 13th, 2012 • Viasystems Group Inc • Printed circuit boards • Delaware

This Voting Agreement (this “Agreement”), dated as of April 3, 2012, is between the individual or entity listed on the signature page hereto (the “Voting Stockholder”) and Viasystems Group, Inc., a Delaware corporation (“Parent”).

STOCKHOLDER AGREEMENT
Stockholder Agreement • February 17th, 2010 • Viasystems Group Inc • Printed circuit boards • New York

THIS STOCKHOLDER AGREEMENT (this “Stockholder Agreement”) is entered into as of February 11, 2010, by and between Viasystems Group, Inc., a Delaware corporation (the “Company”), and VG Holdings, LLC, a Delaware limited liability company (the “Stockholder”).

VOTING AGREEMENT
Voting Agreement • April 13th, 2012 • Viasystems Group Inc • Printed circuit boards • Delaware

This Voting Agreement (this “Agreement”), dated as of April 3, 2012, is among the individual or entity listed on the signature page hereto (the “Voting Stockholder”) and Viasystems Group, Inc., a Delaware corporation (“Parent”).

AMENDED AND RESTATED EXECUTIVE EMPLOYMENT AGREEMENT
Executive Employment Agreement • February 9th, 2011 • Viasystems Group Inc • Printed circuit boards • Missouri

This Agreement is made and entered into as of the 15th day of August, 2005 by and among Viasystems Group, Inc. ("Viasystems") and, Viasystems, Inc. ("Inc." and, together with Viasystems and the other subsidiaries of Viasystems set forth on the signature pages hereto, "Employer"), and Gerald G. Sax ("Employee").

AMENDED AND RESTATED EXECUTIVE EMPLOYMENT AGREEMENT
Executive Employment Agreement • September 24th, 2014 • Viasystems Group Inc • Printed circuit boards • Missouri

This Agreement is made and entered into as of the 21st day of September, 2014 (the “Effective Date”) by and among Viasystems Group, Inc. (“Viasystems”), Viasystems, Inc. (“Inc.”) and Viasystems Technologies Corp. LLC (“LLC” and, together with Viasystems, Inc. and the other subsidiaries listed on the signature page hereto, “Employer”), and David M. Sindelar (“Employee”).

INTERCREDITOR AGREEMENT
Intercreditor Agreement • May 2nd, 2012 • Viasystems Group Inc • Printed circuit boards • New York

This INTERCREDITOR AGREEMENT, dated as of April 30, 2012 (as amended, amended and restated, renewed, extended, supplemented or otherwise modified from time to time in accordance with the terms hereof, this “Agreement”), is entered into by and among Viasystems, Inc., a Delaware corporation (the “Company”), certain direct or indirect subsidiaries of the Company from time to time party hereto (together with the Company, the “Grantors”, and each, a “Grantor”), Wells Fargo Capital Finance, LLC, successor by merger to Wachovia Capital Finance Corporation (New England), in its capacity as collateral agent for the First Lien Claimholders (including its successors and assigns from time to time, the “First Lien Collateral Agent”), and Wilmington Trust, National Association, in its capacity as collateral trustee (including its successors and assigns from time to time, the “Collateral Trustee”) for the Second Lien Claimholders. As described in more detail in Section 8.10 hereof, this Agreement is

TEMPORARY OCCUPANCY AGREEMENT
Temporary Occupancy Agreement • February 15th, 2012 • Viasystems Group Inc • Printed circuit boards • Texas

This Temporary Occupancy Agreement (this “Agreement”) is made and entered into by and between VERDE 9580 JOE RODRIGUEZ DR., LP, a Texas limited Partnership (“Landlord”), VIASYSTEMS TECHNOLOGIES CORP. LLC (“Occupant”), effective as of June 1, 2011 (the “Effective Date”) on the following terms:

COLLATERAL TRUST AGREEMENT dated as of April 30, 2012 among VIASYSTEMS, INC., THE OTHER GRANTORS FROM TIME TO TIME PARTY HERETO, WILMINGTON TRUST, NATIONAL ASSOCIATION, as Trustee under the Indenture, THE OTHER PARITY LIEN REPRESENTATIVES FROM TIME TO...
Collateral Trust Agreement • May 2nd, 2012 • Viasystems Group Inc • Printed circuit boards • New York

This COLLATERAL TRUST AGREEMENT, dated as of April 30, 2012 (this “Agreement”), is entered into by and among Viasystems, Inc. a Delaware corporation (the “Company”), the direct or indirect subsidiaries of the Company listed in the signature pages hereto (collectively, the “Guarantors”), each Additional Grantor (together with the Company and the Guarantors, the “Grantors”, and each, a “Grantor”), Wilmington Trust, National Association, as trustee (in such capacity, together with its successors and assigns in such capacity, the “Notes Trustee”) under the Indenture referred to below, the other Parity Lien Representatives from time to time party hereto, and Wilmington Trust, National Association, as collateral trustee (in such capacity, together with its successors and assigns in such capacity, the “Collateral Trustee”) for the Secured Parties.

SECOND AMENDMENT TO LEASE
Lease • August 8th, 2012 • Viasystems Group Inc • Printed circuit boards

THIS SECOND AMENDMENT TO LEASE (“Amendment”) is entered into as of the 1st day of July 2012, by and between James Rando (“Lessor”) and Viasystems Corporation (“Lessee”), to amend the lease dated September 20, 2005 and amended October 1, 2010. The Parties enter into this Amendment based upon the following facts, intentions and understandings:

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