On Semiconductor Corp Sample Contracts

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Registration Rights Agreement • September 7th, 2001 • On Semiconductor Corp • Semiconductors & related devices • New York
ON SEMICONDUCTOR CORPORATION SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC 12% SENIOR SECURED NOTES DUE 2008 REGISTRATION RIGHTS AGREEMENT
Registration Rights Agreement • August 12th, 2002 • On Semiconductor Corp • Semiconductors & related devices • New York
1 EXHIBIT 10.6
On Semiconductor Corp • August 13th, 2001 • Semiconductors & related devices • New York
INDENTURE
On Semiconductor Corp • March 25th, 2003 • Semiconductors & related devices • New York
Exhibit 4.1 ON SEMICONDUCTOR CORPORATION SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC 12% SENIOR SECURED NOTES DUE 2008 PURCHASE AGREEMENT
Pledge Agreement • August 12th, 2002 • On Semiconductor Corp • Semiconductors & related devices • New York
INDEMNIFICATION AGREEMENT
Indemnification Agreement • February 25th, 2016 • On Semiconductor Corp • Semiconductors & related devices • Delaware

This Indemnification Agreement (“Agreement”) is made as of February 19, 2016 by and between ON Semiconductor, a Delaware corporation (the “Company”), and (“Indemnitee”). This Agreement supersedes and replaces any and all previous Agreements between the Company and Indemnitee covering the subject matter of this Agreement.

INDENTURE
On Semiconductor Corp • August 12th, 2002 • Semiconductors & related devices • New York
dated as of
Credit Agreement • April 7th, 2000 • SCG Holding Corp • Semiconductors & related devices • New York
INVESTMENT AGREEMENT dated as of September 7, 2001 between TPG ON HOLDINGS LLC and ON SEMICONDUCTOR CORPORATION
Investment Agreement • September 7th, 2001 • On Semiconductor Corp • Semiconductors & related devices • New York
ON SEMICONDUCTOR CORPORATION, as Issuer AND THE GUARANTORS NAMED ON THE SIGNATURE PAGES HERETO, as Guarantors AND COMPUTERSHARE TRUST COMPANY, NATIONAL ASSOCIATION, as Trustee INDENTURE Dated as of February 28, 2023 0.50% Convertible Senior Notes due 2029
Indenture • March 2nd, 2023 • On Semiconductor Corp • Semiconductors & related devices • New York

INDENTURE dated as of February 28, 2023 among ON Semiconductor Corporation, a Delaware corporation, as issuer (the “Company”, as more fully set forth in Section 1.01), the Guarantors listed on the signature page hereof, and Computershare Trust Company, National Association, as trustee (the “Trustee”, as more fully set forth in Section 1.01).

ON SEMICONDUCTOR CORPORATION and COMPUTERSHARE TRUST COMPANY, N.A., as Rights Agent RIGHTS AGREEMENT Dated as of June 8, 2020
Rights Agreement • June 8th, 2020 • On Semiconductor Corp • Semiconductors & related devices • Delaware

RIGHTS AGREEMENT, dated as of June 8, 2020 (this “Agreement”), between ON Semiconductor Corporation, a Delaware corporation (the “Company”), and Computershare Trust Company, N.A., a federally chartered trust company, as rights agent (the “Rights Agent”). All capitalized terms used in this Agreement shall have the meanings ascribed to such terms in Section 1 hereof or as otherwise defined elsewhere in this Agreement.

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Dealer Address]
On Semiconductor Corp • March 2nd, 2023 • Semiconductors & related devices

The purpose of this letter agreement (this “Confirmation”) is to confirm the terms and conditions of the call option transaction entered into between [Dealer] (“Dealer”) and ON Semiconductor Corporation (“Counterparty”) as of the Trade Date specified below (the “Transaction”). This letter agreement constitutes a “Confirmation” as referred to in the ISDA Master Agreement specified below. This Confirmation shall replace any previous agreements and serve as the final documentation for the Transaction.

EXHIBIT 4.17 ON SEMICONDUCTOR CORPORATION SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC 12% SENIOR SECURED NOTES DUE 2010 PURCHASE AGREEMENT
Purchase Agreement • March 25th, 2003 • On Semiconductor Corp • Semiconductors & related devices • New York
1 EXHIBIT 10.3 STOCK PURCHASE AGREEMENT BY AND BETWEEN THE CHERRY CORPORATION, SELLER
Stock Purchase Agreement • April 7th, 2000 • SCG Holding Corp • Semiconductors & related devices • Illinois
1 EXHIBIT 1.1 30,000,000 Shares Common Stock SCG HOLDING CORPORATION FORM OF UNDERWRITING AGREEMENT
SCG Holding Corp • April 7th, 2000 • Semiconductors & related devices • New York
AMENDMENT NO. 1 Dated as of May 1, 2015 to AMENDED AND RESTATED CREDIT AGREEMENT Dated as of October 10, 2013
Credit Agreement • May 4th, 2015 • On Semiconductor Corp • Semiconductors & related devices • New York

AMENDED AND RESTATED CREDIT AGREEMENT (this “Agreement”) dated as of October 10, 2013 and amended as of the First Amendment Effective Date among SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, ON SEMICONDUCTOR CORPORATION, the LENDERS from time to time party hereto, JPMORGAN CHASE BANK, N.A., as Administrative Agent, BANK OF AMERICA, N.A., THE ROYAL BANK OF SCOTLAND plc and SUMITOMO MITSUI BANKING CORPORATION, as Co-Syndication Agents, and MORGAN STANLEY MUFG LOAN PARTNERS, LLC, BARCLAYS and MIZUHO BANK PLC , LTD., as Co-Syndication Agents, and FIFTH THIRD BANK and COMPASS BANK, as Co-Documentation Agents.

LOAN FACILITY between
On Semiconductor Corp • August 13th, 2001 • Semiconductors & related devices
June 2, 2015
Letter Agreement • June 8th, 2015 • On Semiconductor Corp • Semiconductors & related devices

The purpose of this letter agreement (this “Confirmation”) is to confirm the terms and conditions of the Warrants issued by ON Semiconductor Corporation (“Company”) to [Dealer] (“Dealer”) as of the Trade Date specified below (the “Transaction”). This letter agreement constitutes a “Confirmation” as referred to in the ISDA Master Agreement specified below. This Confirmation shall replace any previous agreements and serve as the final documentation for the Transaction.

Dealer Address]
On Semiconductor Corp • March 2nd, 2023 • Semiconductors & related devices

The purpose of this letter agreement (this “Confirmation”) is to confirm the terms and conditions of the Warrants issued by ON Semiconductor Corporation (“Company”) to [Dealer] (“Dealer”) as of the Trade Date specified below (the “Transaction”). This letter agreement constitutes a “Confirmation” as referred to in the ISDA Master Agreement specified below. This Confirmation shall replace any previous agreements and serve as the final documentation for the Transaction.

AMENDED AND RESTATED CREDIT AGREEMENT dated as of October 10, 2013 among SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, as the Borrower ON SEMICONDUCTOR CORPORATION, as Holdings The Lenders Party Hereto JPMORGAN CHASE BANK, N.A. as Administrative Agent,...
Credit Agreement • August 1st, 2014 • On Semiconductor Corp • Semiconductors & related devices • New York

AMENDED AND RESTATED CREDIT AGREEMENT (this “Agreement”) dated as of October 10, 2013 among SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, ON SEMICONDUCTOR CORPORATION, the LENDERS from time to time party hereto, JPMORGAN CHASE BANK, N.A., as Administrative Agent, BANK OF AMERICA, N.A., THE ROYAL BANK OF SCOTLAND plc and SUMITOMO MITSUI BANKING CORPORATION, as Co-Syndication Agents, and MORGAN STANLEY MUFG LOAN PARTNERS, LLC, BARCLAYS BANK PLC and FIFTH THIRD BANK, as Co-Documentation Agents.

ARTICLE I GRANT OF WARRANT
Warrant Agreement • March 29th, 2002 • On Semiconductor Corp • Semiconductors & related devices • Delaware
SCG HOLDING CORPORATION 2000 STOCK INCENTIVE PLAN NON-QUALIFIED STOCK OPTION AGREEMENT FOR DIRECTORS
Qualified Stock Option Agreement • May 14th, 2001 • On Semiconductor Corp • Semiconductors & related devices • Delaware
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