LEASE SUMMARYLease Agreement • November 12th, 1999 • Intersil Holding Co • Semiconductors & related devices • Florida
AGREEMENT between theAgreement • November 12th, 1999 • Intersil Holding Co • Semiconductors & related devices
BetweenInvestment Advisory Agreement • November 12th, 1999 • Intersil Holding Co • Semiconductors & related devices • Maryland
EXHIBIT 2.1 ----------- AGREEMENT AND PLAN OF MERGER BY AND AMONG INTERSIL CORPORATION, ECHO ACQUISITION, INC.Agreement and Plan of Merger • March 12th, 2002 • Intersil Corp/De • Semiconductors & related devices • Delaware
EXHIBIT 10.22 Site Services Agreement by and among Harris Corporation Semiconductor Business UnitServices Agreement • November 12th, 1999 • Intersil Holding Co • Semiconductors & related devices • Florida
INTERSIL B.V.Share Purchase Agreement • August 17th, 2000 • Intersil Holding Co • Semiconductors & related devices
Exhibit 11 ---------- AMENDMENT TO RIGHTS AGREEMENT AMENDMENT, dated March 10, 2002 (this "Amendment"), to the Rights Agreement, dated as of September 14, 1998 (the "Rights Agreement"), between Elantec Semiconductor, Inc., a Delaware corporation...Rights Agreement • March 20th, 2002 • Intersil Corp/De • Semiconductors & related devices • Delaware
CONFORMED COPY CREDIT AGREEMENT dated as of August 13, 1999,Credit Agreement • November 12th, 1999 • Intersil Holding Co • Semiconductors & related devices • New York
OPTUM SOFTWARE ORDER FORMMaster Agreement • November 12th, 1999 • Intersil Holding Co • Semiconductors & related devices • California
EXHIBIT 4.02 AMENDED AND RESTATED REGISTRATION RIGHTS AGREEMENT AMENDED AND RESTATED REGISTRATION RIGHTS AGREEMENT (the "Agreement") dated as of January 21, 2000 amends and restates the Registration Rights Agreement dated August 13, 1999, by and among...Registration Rights Agreement • February 18th, 2000 • Intersil Holding Co • Semiconductors & related devices • Delaware
Exhibit 1.01 14,000,000 SHARES INTERSIL CORPORATION CLASS A COMMON STOCK UNDERWRITING AGREEMENTIntersil Corp/De • October 23rd, 2001 • Semiconductors & related devices • New York
o SharesIntersil Holding Co • February 4th, 2000 • Semiconductors & related devices • New York
AMENDED AND RESTATED CREDIT AGREEMENT Dated as of July 19, 2016 among INTERSIL CORPORATION, as the Borrower, BANK OF AMERICA, N.A., as Administrative Agent, Swing Line Lender and L/C Issuer, and The Other Lenders Party Hereto BANK OF AMERICA MERRILL...Credit Agreement • July 21st, 2016 • Intersil Corp/De • Semiconductors & related devices • New York
This AMENDED AND RESTATED CREDIT AGREEMENT (“Agreement”) is entered into as of July 19, 2016, among INTERSIL CORPORATION, a Delaware corporation (the “Borrower”), each lender from time to time party hereto (collectively, the “Lenders” and individually, a “Lender”), and BANK OF AMERICA, N.A., as Administrative Agent, Swing Line Lender and L/C Issuer.
Background ----------Employment Agreement • April 10th, 2002 • Intersil Corp/De • Semiconductors & related devices • New York
andRights Agreement • September 5th, 2003 • Intersil Corp/De • Semiconductors & related devices • New York
INDENTUREIndenture • November 12th, 1999 • Intersil Holding Co • Semiconductors & related devices • New York
10,000,000 Shares INTERSIL HOLDING CORPORATION Class A Common Stock UNDERWRITING AGREEMENTIntersil Holding Co • September 14th, 2000 • Semiconductors & related devices • New York
Background ----------Employment Agreement • April 10th, 2002 • Intersil Corp/De • Semiconductors & related devices • New York
PURCHASE AGREEMENT BETWEEN HARRIS SEMICONDUCTOR AND PRAXAIR, INC.Purchase Agreement • November 12th, 1999 • Intersil Holding Co • Semiconductors & related devices • Florida
200,000 UnitsIntersil Holding Co • November 12th, 1999 • Semiconductors & related devices • New York
AGREEMENT between theAgreement • November 12th, 1999 • Intersil Holding Co • Semiconductors & related devices
andIntersil Holding Co • November 12th, 1999 • Semiconductors & related devices
CONFORMED COPY AMENDMENT NO. 1 AND WAIVER dated as of January 28, 2000 (this "Amendment"), to the CREDIT AGREEMENT dated as of August 13, 1999 (the "Credit Agreement"), among INTERSIL CORPORATION, a Delaware corporation (the "Borrower"), INTERSIL...Conformed Copy • February 23rd, 2000 • Intersil Holding Co • Semiconductors & related devices • New York
RECITALS:Asset Purchase Agreement • November 12th, 1999 • Intersil Holding Co • Semiconductors & related devices • Florida
a) (i) The Shares listed on Annex A opposite the Stockholder's name are ------- the only shares of Company capital stock, securities convertible into Company capital stock, or other rights in respect of Company capital stock (collectively, "Company...Company Voting Agreement • March 20th, 2002 • Intersil Corp/De • Semiconductors & related devices • Delaware
EXHIBIT 10.40 INTELLECTUAL PROPERTY AGREEMENTIntellectual Property Agreement • November 12th, 1999 • Intersil Holding Co • Semiconductors & related devices • Florida
EXHIBIT 10.41 ASSET TRANSFER AGREEMENTAsset Transfer Agreement • November 12th, 1999 • Intersil Holding Co • Semiconductors & related devices • Florida
EXHIBIT 10.08 REGISTRATION RIGHTS AGREEMENT REGISTRATION RIGHTS AGREEMENT (the "Agreement") dated August 13, 1999, by and among INTERSIL HOLDING CORPORATION, a Delaware corporation formerly known as HSS Holding Corporation (the "Company"), STERLING...Registration Rights Agreement • November 12th, 1999 • Intersil Holding Co • Semiconductors & related devices • Delaware
CREDIT AGREEMENT among INTERSIL CORPORATION as Borrower, The Several Lenders from Time to Time Parties Hereto, BANK OF AMERICA, N.A., as Syndication Agent, U.S. BANK NATIONAL ASSOCIATION, as Co-Documentation Agent, WELLS FARGO BANK, N.A., as...Credit Agreement • April 30th, 2010 • Intersil Corp/De • Semiconductors & related devices • New York
The Applicable Margin for Revolving Loans, Swingline Loans and the Commitment Fee Rate shall be adjusted, on and after the first Adjustment Date (as defined below) occurring after the completion of the first full fiscal quarter of the Borrower after the Closing Date, based on changes in the Consolidated Leverage Ratio, with such adjustments to become effective on the date (the “Adjustment Date”) that is three Business Days after the date on which the relevant financial statements are delivered to the Lenders pursuant to Section 7.1 and to remain in effect until the next adjustment to be effected pursuant to this paragraph. If any financial statements referred to above are not delivered within the time periods specified in Section 7.1, then, until the date that is three Business Days after the date on which such financial statements are delivered, the highest rate set forth in each column of the Pricing Grid shall apply. On each Adjustment Date, the Applicable Margin for Revolving Loans
INDEMNITY AGREEMENTIndemnity Agreement • October 28th, 2014 • Intersil Corp/De • Semiconductors & related devices • Delaware
THIS AGREEMENT is made as of the last date signed below (the “Effective Date”) by and between Intersil Corporation., a Delaware corporation ("Company"), and _______________ ("Indemnitee"), an officer or director of the Company.
AMENDMENT NO. 4 TO SECURITIES PURCHASE AND HOLDERS AGREEMENTSecurities Purchase and Holders Agreement • May 14th, 2002 • Intersil Corp/De • Semiconductors & related devices • Delaware
LOAN AGREEMENTSecurity Agreement • November 12th, 1999 • Intersil Holding Co • Semiconductors & related devices • Pennsylvania
COMPANY VOTING AGREEMENTCompany Voting Agreement • March 19th, 2004 • Intersil Corp/De • Semiconductors & related devices • California
AGREEMENT, dated as of March 14, 2004 (this “Agreement”), by and among Intersil Corporation, a Delaware corporation (“Parent”), New Castle Merger Sub Corp., a California corporation and wholly-owned subsidiary of Parent (“Merger Sub”), Xicor, Inc., a California corporation (“Company”), and the shareholders of the Company set forth in Annex A hereto (each a “Shareholder” and, collectively, the “Shareholders”).
BackgroundEmployment Agreement • November 12th, 1999 • Intersil Holding Co • Semiconductors & related devices • Delaware
FORM OF TENDER AND VOTING AGREEMENTTender and Voting Agreement • March 22nd, 2010 • Intersil Corp/De • Semiconductors & related devices • Delaware
THIS TENDER AND VOTING AGREEMENT (this “Agreement”) dated March 22, 2010, among INTERSIL CORPORATION, a Delaware corporation (“Parent”); NAVAJO MERGER SUB, INC., a Delaware corporation and an indirect wholly-owned subsidiary of Parent (“Purchaser”); TECHWELL, INC., a Delaware corporation (the “Company”) (only with respect to Section 6 and Section 11 hereof and as a third party beneficiary of Section 4(f) hereof); and the undersigned stockholder of the Company (“Stockholder”).
