Among VIASYSTEMS GROUP, INC., as Guarantor, VIASYSTEMS, INC., as Borrower,Credit Agreement • June 22nd, 2004 • Wire Harness Industries Inc • Printed circuit boards • New York
EXHIBIT 4.1 VIASYSTEMS, INC. AND EACH OF THE GUARANTORS PARTY HERETO 10.50% SENIOR SUBORDINATED NOTES DUE 2011Indenture • April 14th, 2004 • Wire Harness Industries Inc • Printed circuit boards • New York
AMENDED AND RESTATED LIMITED LIABILITY COMPANY AGREEMENT OF WIREKRAFT INDUSTRIES, LLCLimited Liability Company Agreement • April 14th, 2004 • Wire Harness Industries Inc • Printed circuit boards • Delaware
EXHIBIT 10.10 VIASYSTEMS, INC. 10.50% SENIOR SUBORDINATED NOTES DUE 2011 EXCHANGE AND REGISTRATION RIGHTS AGREEMENTRegistration Rights Agreement • April 14th, 2004 • Wire Harness Industries Inc • Printed circuit boards • New York
AS ISSUER,Wire Harness Industries Inc • July 2nd, 1997 • Drawing & insulating of nonferrous wire • New York
Exhibit 10.1(a) FIRST AMENDMENT TO THE CREDIT AGREEMENT FIRST AMENDMENT, dated as of March 19, 2003 (the "Amendment"), to the Credit Agreement, dated as of January 31, 2003 (as amended, supplemented or otherwise modified prior to the date hereof, the...Credit Agreement • June 22nd, 2004 • Wire Harness Industries Inc • Printed circuit boards • New York
AND IBJ SCHRODER BANK & TRUST COMPANY, AS TRUSTEE THIRD SUPPLEMENTAL INDENTURE DATED AS OF FEBRUARY 12, 1997Indenture • July 2nd, 1997 • Wire Harness Industries Inc • Drawing & insulating of nonferrous wire • New York
Exhibit 10.1(b) SECOND AMENDMENT TO THE CREDIT AGREEMENT SECOND AMENDMENT, dated as of December 3, 2003 (the "Amendment"), to the Credit Agreement, dated as of January 31, 2003, as amended by the First Amendment dated as of March 19, 2003 (the "Credit...Credit Agreement • June 22nd, 2004 • Wire Harness Industries Inc • Printed circuit boards • New York
made byGuarantee and Collateral Agreement • June 22nd, 2004 • Wire Harness Industries Inc • Printed circuit boards • New York
INDENTUREIndenture • July 2nd, 1997 • Wire Harness Industries Inc • Drawing & insulating of nonferrous wire • Missouri
1 EXHIBIT 10.28 FIRST AMENDMENT TO AMENDED AND RESTATED CREDIT AGREEMENTCredit Agreement • July 2nd, 1997 • Wire Harness Industries Inc • Drawing & insulating of nonferrous wire • New York
ARTICLE 1 DEFINITIONSStockholders Agreement • June 22nd, 2004 • Wire Harness Industries Inc • Printed circuit boards • Delaware
AMENDMENT TO PARTS SOURCING CONTRACTParts Sourcing Contract • June 22nd, 2004 • Wire Harness Industries Inc • Printed circuit boards
This Amendment to Parts Sourcing Contract (“Amendment”) is made and entered into to be effective as of the day of September, 1999, between the GENERAL ELECTRIC COMPANY, a New York corporation, acting through its GE Appliances business component (“GE”) and WIREKRAFT INDUSTRIES, INC., a Delaware corporation (“Wirekraft”), and amends further that certain Parts Sourcing Contract effective the 2nd day of December, 1994, between GE and Wirekraft (“Sourcing Contract”).
EXHIBIT 10.11(a) FIRST AMENDMENT AND CONSENT FIRST AMENDMENT AND CONSENT, dated as of October ____, 2003 (the "Amendment"), with respect to the Stockholders Agreement, dated as of January 31, 2003 (the "Stockholders Agreement"), among VIASYSTEMS...Wire Harness Industries Inc • June 22nd, 2004 • Printed circuit boards • Delaware
AMENDMENT TO PARTS SOURCING CONTRACTParts Sourcing Contract • June 22nd, 2004 • Wire Harness Industries Inc • Printed circuit boards
This Amendment to Parts Sourcing Contract (“Amendment”) is made and entered into to be effective as of the 24th day of October, 1998, between the GENERAL ELECTRIC COMPANY, a New York corporation, acting through its GE Appliances business component (“GE”) and WIREKRAFT INDUSTRIES, INC., a Delaware corporation (“Wirekraft”), and amends that certain Parts Sourcing Contract effective the 2nd day of December, 1994, between GE and Wirekraft (“Sourcing Contract”).
