EXHIBIT 10.1 EMPLOYMENT AGREEMENT This EMPLOYMENT AGREEMENT (the "Agreement") is dated as of August 26, 2003 and is entered into by and between ALLEGHENY TECHNOLOGIES INCORPORATED, a Delaware corporation (the "Company"), and L. PATRICK HASSEY (the...Employment Agreement • November 4th, 2003 • Allegheny Technologies Inc • Steel pipe & tubes • Pennsylvania
1 EXHIBIT 4.1 FIFTH AMENDMENT TO CREDIT AGREEMENTCredit Agreement • March 14th, 2001 • Allegheny Technologies Inc • Semiconductors & related devices • Pennsylvania
ANDRights Agreement • March 13th, 1998 • Allegheny Teledyne Inc • Semiconductors & related devices • Delaware
WITNESSETH:Assignment and Assumption Agreement • November 14th, 1997 • Allegheny Teledyne Inc • Semiconductors & related devices • Pennsylvania
BY AND AMONGAsset Purchase Agreement • February 18th, 2004 • Allegheny Technologies Inc • Steel pipe & tubes • Pennsylvania
1 Exhibit 10(b) RESTRICTED STOCK AGREEMENT THIS RESTRICTED STOCK AGREEMENT (the "Agreement") is made and executed as of the 16th day of September, 1999, by and between ALLEGHENY TELEDYNE INCORPORATED, a Delaware corporation with its principal place of...Restricted Stock Agreement • November 15th, 1999 • Allegheny Teledyne Inc • Semiconductors & related devices • Pennsylvania
Exhibit 99.2 FIRST AMENDMENT TO REVOLVING CREDIT AND SECURITY AGREEMENT First Amendment to Revolving Credit and Security Agreement, dated the 15th day of April, 2004, by and among by and among Oregon Metallurgical Corporation, a corporation organized...Credit and Security Agreement • June 2nd, 2004 • Allegheny Technologies Inc • Steel pipe & tubes • Pennsylvania
RECITALSSeparation Agreement • March 27th, 1997 • Allegheny Teledyne Inc • Semiconductors & related devices • California
ALLEGHENY TECHNOLOGIES INCORPORATED AND THE BANK OF NEW YORK MELLON, as Trustee INDENTURE Dated as of June 22, 2020 3.50% Convertible Senior Notes due 2025Indenture • June 22nd, 2020 • Allegheny Technologies Inc • Steel pipe & tubes • New York
INDENTURE, dated as of June 22, 2020, between ALLEGHENY TECHNOLOGIES INCORPORATED, a Delaware corporation, as issuer (the “Company”) and THE BANK OF NEW YORK MELLON, a New York banking corporation, as trustee (the “Trustee”).
THIRD AMENDMENT TO CREDIT AGREEMENTCredit Agreement • May 17th, 1999 • Allegheny Teledyne Inc • Semiconductors & related devices • Pennsylvania
and _________________, Trustee IndentureAllegheny Technologies Inc • March 22nd, 2004 • Steel pipe & tubes • New York
December 13, 2001 J.P. Morgan Securities Inc. Banc of America Securities LLC Salomon Smith Barney Inc. PNC Capital Markets, Inc. BNY Capital Markets, Inc. Mizuho International plc Tokyo-Mitsubishi International plc c/o J.P. Morgan Securities Inc. 270...Allegheny Technologies Inc • March 15th, 2002 • Semiconductors & related devices • New York
SECOND AMENDMENT TO CREDIT AGREEMENT Among ALLEGHENY TECHNOLOGIES INCORPORATED, as the Borrower THE FINANCIAL INSTITUTIONS PARTY HERETO, as the Lenders MELLON BANK, N.A., JPMORGAN CHASE BANK, and BANK OF AMERICA, N.A., as Syndication Agents andCredit Agreement • March 24th, 2003 • Allegheny Technologies Inc • Steel pipe & tubes • Pennsylvania
Attention: Telephone No.: Facsimile No.: [Title of contact] [ ] [ ]Allegheny Technologies Inc • June 22nd, 2020 • Steel pipe & tubes
The purpose of this letter agreement (this “Confirmation”) is to confirm the terms and conditions of the call option transaction entered into between [Dealer] (“Dealer”) and Allegheny Technologies Incorporated (“Counterparty”) as of the Trade Date specified below (the “Transaction”). This letter agreement constitutes a “Confirmation” as referred to in the ISDA Master Agreement specified below. Each party further agrees that this Confirmation together with the Agreement evidence a complete binding agreement between Counterparty and Dealer as to the subject matter and terms of the Transaction to which this Confirmation relates, and shall supersede all prior or contemporaneous written or oral communications with respect thereto.
BOFA SECURITIES, INC. ALLEGHENY TECHNOLOGIES INCORPORATED Underwriting AgreementAllegheny Technologies Inc • September 14th, 2021 • Steel pipe & tubes • New York
Allegheny Technologies Incorporated, a Delaware corporation (the “Company”), proposes to issue and sell to the several Underwriters listed in Schedule I hereto (the “Underwriters”), for whom you are acting as Representative (the “Representative”), an aggregate of $325,000,000 principal amount of its 4.875% Senior Notes due 2029 (the “2029 Notes”) and $350,000,000 principal amount of its 5.125% Senior Notes due 2031 (the “2031 Notes” and, together with the 2029 Notes, the “Securities”). The Securities are to be issued under a base indenture, to be dated as of the Closing Date (as defined below) (the “Base Indenture”), as supplemented by the First Supplemental Indenture, to be dated as of the Closing Date (the “First Supplemental Indenture” and, together with the Base Indenture, the “Indenture”), between the Company and Wells Fargo Bank, National Association, as trustee (the “Trustee”).
AMENDMENT TO THE AMENDED AND RESTATED CHANGE IN CONTROL SEVERANCE AGREEMENTControl Severance Agreement • March 15th, 2004 • Allegheny Technologies Inc • Steel pipe & tubes
ATI INC. Underwriting AgreementUnderwriting Agreement • August 11th, 2023 • Ati Inc • Steel pipe & tubes • New York
ATI Inc., a Delaware corporation (the “Company”), proposes to issue and sell to the several Underwriters listed in Schedule I hereto (the “Underwriters”), for whom you are acting as Representative (the “Representative”), an aggregate of $425,000,000 principal amount of its 7.250% Senior Notes due 2030 (the “Securities”). The Securities are to be issued under a base indenture, dated as of September 14, 2021 (the “Base Indenture”), as supplemented by the Second Supplemental Indenture, to be dated as of the Closing Date (as defined below) (the “Second Supplemental Indenture” and, together with the Base Indenture, the “Indenture”), between the Company and Computershare Trust Company, N.A., as successor trustee to Wells Fargo Bank, National Association (the “Trustee”).
ANDSecurity Agreement • June 19th, 2003 • Allegheny Technologies Inc • Steel pipe & tubes • Pennsylvania
EXHIBIT 4.11Exchange and Registration Rights Agreement • March 15th, 2002 • Allegheny Technologies Inc • Semiconductors & related devices • New York
FORM OFChange in Control Severance Agreement • May 5th, 2005 • Allegheny Technologies Inc • Steel pipe & tubes
ALLEGHENY TECHNOLOGIES INCORPORATED as Issuer and THE BANK OF NEW YORK as Trustee Indenture Dated as of December 18, 2001 ------------------------------- -------------------------------------------------Indenture • March 15th, 2002 • Allegheny Technologies Inc • Semiconductors & related devices • New York
1 EXHIBIT 4 FOURTH AMENDMENT TO CREDIT AGREEMENT AND WAIVERCredit Agreement and Waiver • August 16th, 1999 • Allegheny Teledyne Inc • Semiconductors & related devices • Pennsylvania
EXHIBIT 4.1 FIRST AMENDMENT TO CREDIT AGREEMENTCredit Agreement • August 14th, 2002 • Allegheny Technologies Inc • Steel pipe & tubes • Pennsylvania
BY AND AMONGSeparation and Distribution Agreement • December 13th, 1999 • Allegheny Technologies Inc • Semiconductors & related devices • Pennsylvania
Exhibit 10(a) EMPLOYMENT AGREEMENT THIS EMPLOYMENT AGREEMENT (the "Agreement") is executed this 17 day of August, 1999, by and between ALLEGHENY TELEDYNE INCORPORATED, a Delaware corporation with its principal place of business at 10th Floor, Six PPG...Employment Agreement • November 15th, 1999 • Allegheny Teledyne Inc • Semiconductors & related devices • Pennsylvania
COMMERCIAL PAPER DEALER AGREEMENT 4(2) PROGRAM BETWEENCommercial Paper Dealer Agreement • March 14th, 2001 • Allegheny Technologies Inc • Semiconductors & related devices • New York
July 22, 2004 J.P. MORGAN SECURITIES INC. CITIGROUP GLOBAL MARKETS INC. As Representatives of the several Underwriters listed in Schedule 1 hereto c/o J.P. Morgan Securities Inc. 277 Park Avenue New York, New York 10172 Ladies and Gentlemen: Allegheny...Allegheny Technologies Inc • July 23rd, 2004 • Steel pipe & tubes • New York
AmongCredit Agreement • May 15th, 1998 • Allegheny Teledyne Inc • Semiconductors & related devices • Pennsylvania
FORM OF TOTAL SHAREHOLDER RETURN INCENTIVE COMPENSATION PROGRAM AWARD AGREEMENTAllegheny Technologies Inc • May 15th, 2001 • Semiconductors & related devices
FIRST AMENDMENT TO COMMERCIAL PAPER DEALER AGREEMENTPaper Dealer Agreement • March 15th, 2002 • Allegheny Technologies Inc • Semiconductors & related devices
1 Exhibit 10.25 TAX SHARING AND INDEMNIFICATION AGREEMENT THIS TAX SHARING AND INDEMNIFICATION AGREEMENT (the "Agreement"), dated as of November 29, 1999, is made by and between Allegheny Teledyne Incorporated, a Delaware corporation ("ATI") on behalf...Tax Sharing and Indemnification Agreement • March 21st, 2000 • Allegheny Technologies Inc • Semiconductors & related devices • Pennsylvania
EXHIBIT 4.1 CREDIT AGREEMENT ($325,000,000 CREDIT FACILITY)Credit Agreement • March 15th, 2002 • Allegheny Technologies Inc • Semiconductors & related devices • Pennsylvania
EXHIBIT 4.6 ISSUING AND PAYING AGENCY AGREEMENT This Agreement, dated as of January 25, 2002, is by and between Allegheny Technologies Incorporated (the "ISSUER") and JPMorgan Chase Bank ("JPMORGAN"). 1. APPOINTMENT AND ACCEPTANCE The Issuer hereby...Issuing and Paying Agency Agreement • March 15th, 2002 • Allegheny Technologies Inc • Semiconductors & related devices • New York
AGREEMENT AND PLAN OF MERGER among ALLEGHENY TECHNOLOGIES INCORPORATED, LPAD CO., PADL LLC and LADISH CO., INC. Dated as of November 16, 2010Agreement and Plan of Merger • November 17th, 2010 • Allegheny Technologies Inc • Steel pipe & tubes • Delaware
This AGREEMENT AND PLAN OF MERGER, dated as of November 16, 2010 (this “Agreement”), is among ALLEGHENY TECHNOLOGIES INCORPORATED, a Delaware corporation (“Parent”), LPAD CO., a Wisconsin corporation and a direct wholly owned Subsidiary of Parent (“Merger Sub”), PADL LLC, a Wisconsin limited liability company and a direct wholly owned Subsidiary of Parent (“Merger Sub 2”), and LADISH CO., INC., a Wisconsin corporation (the “Company”). Certain terms used in this Agreement are defined in Section 8.11.
CREDIT AGREEMENT Dated as of August 30, 1996 By and AmongCredit Agreement • November 14th, 1996 • Allegheny Teledyne Inc • Semiconductors & related devices
