SERVICE AGREEMENTService Agreement • June 28th, 2001 • Ase Test LTD • Semiconductors & related devices
Exhibit 4(i) Land Lease AgreementLease Agreement • June 30th, 2004 • Ase Test LTD • Semiconductors & related devices
ANDAse Test LTD • June 28th, 2001 • Semiconductors & related devices
BETWEEN DELL ASIA PACIFIC SDN. (Company No.330298-M) ("LESSOR") AND ASE ELECTRONICS (M) SDN. BHD. (Company No.212592-H) ("LESSEE")Agreement • June 30th, 2004 • Ase Test LTD • Semiconductors & related devices
BETWEENSale and Purchase Agreement • June 28th, 2001 • Ase Test LTD • Semiconductors & related devices
Exhibit 4(e) LICENCE AGREEMENT THIS LICENCE AGREEMENT is made this 16th day of January, 2001. BETWEEN 1st Silicon (Malaysia) Sdn Bhd (Company No. 456668-U), a company incorporated and registered in Malaysia and having its registered office at 1,...Licence Agreement • June 28th, 2001 • Ase Test LTD • Semiconductors & related devices
AGREEMENTCommission Agreement • June 28th, 2001 • Ase Test LTD • Semiconductors & related devices
BetweenSub-Lease Agreement • June 30th, 2004 • Ase Test LTD • Semiconductors & related devices
Exhibit 4(h) Land Lease AgreementLand Lease Agreement • June 30th, 2004 • Ase Test LTD • Semiconductors & related devices
Exhibit 4(r) Lease Agreement for Factory Building This lease agreement (hereinafter referred to as the "Agreement") is made and entered into by and between Advanced Semiconductor Engineering Inc. (hereinafter referred to as "Party A") and ASE Test...Lease Agreement • June 28th, 2001 • Ase Test LTD • Semiconductors & related devices
RECITALSSublease Agreement • June 28th, 2001 • Ase Test LTD • Semiconductors & related devices
SERVICE AGREEMENTService Agreement • June 28th, 2001 • Ase Test LTD • Semiconductors & related devices
Exhibit 4(t) Plant Building Lease AgreementBuilding Lease Agreement • June 30th, 2004 • Ase Test LTD • Semiconductors & related devices
Exhibit 4(j) First Amendment to Lease Agreement This First Amendment to Lease Agreement (the "Amendment") is made and entered into as of June 7, 2000, by and between RND Funding Company, Inc., a Delaware corporation ("Landlord"), and ISE Labs, Inc., a...Lease Agreement • June 28th, 2001 • Ase Test LTD • Semiconductors & related devices
COMMISSION AGREEMENTCommission Agreement • June 19th, 2006 • Ase Test LTD • Semiconductors & related devices
COMMISSION AGREEMENTCommission Agreement • June 19th, 2006 • Ase Test LTD • Semiconductors & related devices
COMMISSION AGREEMENTCommission Agreement • June 19th, 2006 • Ase Test LTD • Semiconductors & related devices
ASSET PURCHASE AGREEMENT by and among FLEXTRONICS MANUFACTURING (M) SDN BHD as Buyer, ASE ELECTRONICS (M) SDN. BHD. as Company Dated as of October 3, 2005Asset Purchase Agreement • June 19th, 2006 • Ase Test LTD • Semiconductors & related devices
THIS ASSET PURCHASE AGREEMENT (the “Agreement”) is made as of October 3, 2005 (the “Agreement Date”), by and among Flextronics Manufacturing (M) Sdn Bhd (Company Registration No. 206755A, a Malaysia corporation (the “Buyer”) with its registered address at Level 14, Uptown 1, 1 Jalan SS21/58, Damansara Uptown, 47400 Petaling Jaya, Selangor Darul Ehsan, Malaysia and ASE Electronics (M) Sdn. Bhd. (Company registration No. 212592-H), a Malaysia corporation with its place of business at Phase 4, Bayan Lepas Free Industrial Zone, 11900 Penang, Malaysia and its registered address at Suite 2-1, 2nd Floor, Menara Penang Garden, No.42A Jalan Sultan Abmad Shah, 10050 Penang, Malaysia (the “Company”).
ARTICLE 1Sublease Agreement • June 28th, 2001 • Ase Test LTD • Semiconductors & related devices
COMMISSION AGREEMENTCommission Agreement • June 19th, 2006 • Ase Test LTD • Semiconductors & related devices
English Translation] SYNDICATED LOAN AGREEMENT BORROWER: ADVANCED SEMICONDUCTOR ENGINEERING INC. AGENT: CITIBANK, N.A., TAIPEI BRANCH AMOUNT: NT$24,750,000,000 Date: March 3, 2008Syndicated Loan Agreement • March 6th, 2008 • Ase Test LTD • Semiconductors & related devices
WHEREAS, to facilitate the Borrower’s funding needs in respect of the Acquisition (defined below), the Borrower has requested the Arrangers to arrange, and the Banks to extend to the Borrower, a term loan facility in an aggregate principal amount of NT$24,750,000,000 as more detailed described below (the “Facility”); and
Land Lease AgreementLease Agreement • June 19th, 2006 • Ase Test LTD • Semiconductors & related devices
This Land Lease Agreement (the “Agreement”) made and entered into by and between the Lessor, Nantze Export Processing Zone Administration of Ministry of Economic Affairs (hereinafter referred to as “Party A”) and the Lessee, ASE Test Inc. (hereinafter referred to as “Party B”).
Exhibit 4(p) Lease No. The lease is made between the landlord SHINANO KENSHI (HK) CO., LTD. (hereinafter called "Party A") and the tenant ISE LABS HONG KONG LTD. (hereinafter called "Party B"). Both parties hereby agree to enter into and abide by all...Ase Test LTD • June 28th, 2001 • Semiconductors & related devices
Exhibit 4(q) Lease No. The lease is made between the landlord Chiang Sui Lun (hereinafter called "Party A") and the tenant ISLAM Md, Rabbi-ul (hereinafter called "Party B"). Both parties hereby agree to enter into and abide by all the terms and...Ase Test LTD • June 28th, 2001 • Semiconductors & related devices
Land Lease AgreementLand Lease Agreement • June 19th, 2006 • Ase Test LTD • Semiconductors & related devices
This Land Lease Agreement (the “Agreement”) made and entered into by and between the Lessor, Nantze Export Processing Zone Administration of Ministry of Economic Affairs (hereinafter referred to as “Party A”) and the Lessee, ASE Test Inc. (hereinafter referred to as “Party B”).
