Transmeta Corp Sample Contracts

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FORM OF SUBORDINATED INDENTURE Between
Transmeta Corp • July 17th, 2003 • Semiconductors & related devices • New York
BETWEEN
Rights Agreement • January 16th, 2002 • Transmeta Corp • Semiconductors & related devices • Delaware
WITNESSETH:
Lease Agreement • August 17th, 2000 • Transmeta Corp
SUBLEASE
Transmeta Corp • August 17th, 2000
SUBLEASE
Transmeta Corp • August 17th, 2000
Attachment F
Transmeta Corp • October 26th, 2000 • Semiconductors & related devices • New York
WITNESSETH:
Transmeta Corp • August 17th, 2000
WITNESSETH:
Lease Agreement • August 17th, 2000 • Transmeta Corp
RECITALS
Indemnity Agreement • October 2nd, 2000 • Transmeta Corp • Semiconductors & related devices • California
WITNESSETH:
Lease Agreement • August 17th, 2000 • Transmeta Corp
INCENTIVE RETENTION AGREEMENT
Incentive Retention Agreement • January 4th, 2008 • Transmeta Corp • Semiconductors & related devices • California

Transmeta Corporation, a Delaware corporation (the “Company”), and John O’Hara Horsley (“Employee”) have entered into this Incentive Retention Agreement (this “Agreement”), dated as of February 27, 2007 (the “Effective Date”), on the basis of the following facts:

AGREEMENT AND PLAN OF MERGER among: Novafora, Inc., a Delaware corporation; Transformer Acquisition LLC, a Delaware limited liability company; and Transmeta Corporation, a Delaware corporation Dated as of November 17, 2008
Agreement and Plan of Merger • November 20th, 2008 • Transmeta Corp • Semiconductors & related devices • Delaware

This Agreement and Plan of Merger (“Agreement”) is made and entered into as of November 17, 2008, by and among: Novafora, Inc., a Delaware corporation (“Parent”); Transformer Acquisition LLC, a Delaware limited liability company and a wholly owned subsidiary of Parent (“Merger Sub”); and Transmeta Corporation, a Delaware corporation (the “Company”). Certain capitalized terms used in this Agreement are defined in Exhibit A.

TRANSMETA CORPORATION EQUITY SECURITIES UNDERWRITING AGREEMENT STANDARD PROVISIONS
Underwriting Agreement • July 11th, 2007 • Transmeta Corp • Semiconductors & related devices • New York

From time to time, Transmeta Corporation, a Delaware corporation (“Transmeta”), may enter into one or more underwriting agreements that provide for the sale of certain equity securities (the “Securities”), to the purchaser or purchasers named therein (the “Underwriters”). The standard provisions set forth herein may be incorporated by reference in any such underwriting agreement (the “Underwriting Agreement”). The Underwriting Agreement, including the provisions incorporated therein by reference, is herein referred to as “this Agreement.” Unless otherwise defined herein, terms defined in the Underwriting Agreement are used herein as therein defined. Capitalized terms not otherwise defined in this Agreement shall have the meaning ascribed thereto in the Indenture (as hereinafter defined).

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RECITALS
Stock Repurchase Agreement • March 27th, 2002 • Transmeta Corp • Semiconductors & related devices • California
SUBLEASE
Sublease • August 17th, 2000 • Transmeta Corp
TECHNOLOGY TRANSFER SERVICES AND TECHNOLOGY LICENSE AGREEMENT
Technology Transfer Services and Technology License Agreement • March 29th, 2005 • Transmeta Corp • Semiconductors & related devices • California

This Technology Transfer Services and Technology License Agreement (“Agreement”) is made and entered into as of March 25, 2004 (“Effective Date”), by and between Transmeta Corporation, a Delaware corporation having its principal place of business at 3990 Freedom Circle, Santa Clara, CA 95054, U.S.A. (“Transmeta”) and NEC Electronics Corporation, a Japanese corporation having its principal place of business at 1753, Shimonumabe, Nakahara-ku, Kawasaki, Kanagawa 211-8668, Japan (“NECEL”).

CONFIDENTIAL TREATMENT REQUESTED Technology License Agreement
Technology License Agreement • November 17th, 2008 • Transmeta Corp • Semiconductors & related devices • Delaware

This Technology License Agreement (“Agreement”) is made and entered into as of September 22, 2008 (“Effective Date”), by and between Transmeta Corporation, a Delaware corporation having an office at 2540 Mission College Blvd., Santa Clara, CA 95054 (“Transmeta”), and Intel Corporation (“Intel”), a Delaware corporation having an office at 2200 Mission College Blvd., Santa Clara, CA 95052 (each of Transmeta and Intel being a “Party” and together the “Parties”).

TRANSMETA CORPORATION STANDARD STOCK WARRANT AGREEMENT PROVISIONS
Transmeta Corp • July 11th, 2007 • Semiconductors & related devices • California

From time to time, Transmeta Corporation, a Delaware corporation (the “Company”), may enter into one or more warrant agreements that provide for the issuance and sale of warrants (“Warrants”) to purchase shares of the Company’s [Common Stock, $0.00001 par value][Preferred Stock, $0.00001 par value] (collectively “Shares”). The standard provisions set forth herein may be included or incorporated by reference in any such warrant agreement (a “Warrant Agreement”). The Warrant Agreement, including the provisions incorporated therein by reference, is herein referred to as this “Agreement.” The person named as the “Warrant Agent” in the first paragraph of the Warrant Agreement is herein referred to as the “Warrant Agent.” Unless otherwise defined in this Agreement or in the Warrant Agreement, as the case may be, terms defined in the Warrant Agreement are used herein as therein defined and terms defined herein are used in the Warrant Agreement as herein defined.

SEPARATION AGREEMENT AND RELEASE
Separation Agreement and Release • May 15th, 2007 • Transmeta Corp • Semiconductors & related devices • California

This Separation Agreement and Release (together with its attachments, the “Agreement”) is made and entered into as of February 1, 2007 by and between Transmeta Corporation, a Delaware corporation (together with its subsidiaries, successors and assigns, the “Company”), and Arthur L. Swift (the “Executive”).

EXHIBIT 10.16 FULL RECOURSE, UNSECURED PROMISSORY NOTE Santa Clara, California
Transmeta Corp • March 27th, 2002 • Semiconductors & related devices • California
Settlement, Release and License Agreement Between Transmeta Corporation And Intel Corporation
Settlement, Release and License Agreement • March 17th, 2008 • Transmeta Corp • Semiconductors & related devices • Delaware

This Settlement, Release and License Agreement (“Agreement”) is entered into as of December 31, 2007 (“Effective Date”) by and between Transmeta Corporation, a Delaware corporation having an office at 2540 Mission College Blvd., Santa Clara, CA 95054, (“Transmeta”) and Intel Corporation, a Delaware corporation having an office at 2200 Mission College Blvd., Santa Clara, California 95052, U.S.A. (“Intel”) (each of Transmeta and Intel being a “Party” and together the “Parties”).

LongRun And LongRun2 Technology License Agreement
Longrun2 Technology License Agreement • March 17th, 2008 • Transmeta Corp • Semiconductors & related devices • Delaware

This LongRun and LongRun2 Technology License Agreement (“Agreement”) is made and entered into as of December 31, 2007 (“Effective Date”), by and between Transmeta Corporation, a Delaware corporation having an office at 2540 Mission College Blvd., Santa Clara, CA 95054 (“Transmeta”), and Intel Corporation (“Intel”), a Delaware corporation having an office at 2200 Mission College Blvd., Santa Clara, CA 95052 (each of Transmeta and Intel being a “Party” and together the “Parties”).

VOTING AGREEMENT
Voting Agreement • November 20th, 2008 • Transmeta Corp • Semiconductors & related devices • Delaware

This VOTING AGREEMENT (this “Agreement”) is entered into effective as of November ___, 2008, by and between Novafora, Inc., a Delaware corporation (“Acquiror”), and the undersigned stockholder (“Stockholder”) of Transmeta Corporation, a Delaware corporation (the “Company”). Terms not otherwise defined herein shall have the respective meanings ascribed to them in the Merger Agreement (as defined below).

VOTING AGREEMENT
Voting Agreement • November 20th, 2008 • Transmeta Corp • Semiconductors & related devices • Delaware

This VOTING AGREEMENT (this “Agreement”) is entered into effective as of November ___, 2008, by and between Novafora, Inc., a Delaware corporation (“Acquiror”), and the undersigned stockholder (“Stockholder”) of Transmeta Corporation, a Delaware corporation (the “Company”). Terms not otherwise defined herein shall have the respective meanings ascribed to them in the Merger Agreement (as defined below).

LONGRUN2 TECHNOLOGY LICENSE AGREEMENT
Longrun2 Technology License Agreement • May 10th, 2006 • Transmeta Corp • Semiconductors & related devices • California

This LongRun2 Technology License Agreement (“Agreement”) is made and entered into as of February 22, 2006 (“Effective Date”), by and between Transmeta Corporation, a Delaware corporation having its principal place of business at 3990 Freedom Circle, Santa Clara, CA 95054, U.S.A. (“Transmeta”), and Toshiba Corporation, a Japanese corporation having its principal place of business at 1-1, Shibaura 1-Chome, Minato-Ku, Tokyo 105-8001, Japan, including its wholly owned subsidiaries (“Toshiba”).

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