Common use of LEADTIMES Clause in Contracts

LEADTIMES. After the bring-up of the baseline process: --------- (a) MEC/MEI will complete mask sets for any PI Product within ten (10) working days after the receipt by MEC/MEI of a final database tape for such PI Product. PI will bear all the costs of mask tooling. (b) MEC/MEI will deliver to PI (ex the Fab) prototype Wafers of any PI Products within forty-four (44) working days after availability of mask sets for such PI Product. MEC/MEI and PI will negotiate in good faith the possibility of making available to PI fast-turn lots for certain prototype Wafers. PI will pay for those prototype wafers. (c) MEC/MEI will deliver (ex the Fab) the first (1st) shipment of the Wafers ordered by PI for that month no later than fifty-four (54) working days after the start of the production as per PI's purchase order for such PI Products, unless PI's purchase order specifies a later delivery date. The rest of the ordered Wafers for that month will be shipped so that PI receives all such Wafers, in equal weekly quantities to the extent practicably possible, within twenty (20) working days after the first (1st) shipment. MEC/MEI shall use its reasonable and best efforts to improve actual leadtime for the production of Wafers. (d) In the event the production of new Products (including Updates of the Products) requires more complicated manufacturing process to MEC, including the case, but not limited to, where the increase of the number of masks used for such production, or the manufacturing processes of the Products are transferred from the present Fab. to another qualified Fab., the leadtime stated in Section 3.5(c) may be changed according to such different conditions if both parties agree to such change.

Appears in 1 contract

Sources: Wafer Foundry Agreement (Power Integrations Inc)

LEADTIMES. After the bring-up of the baseline process: --------- (a) MEC/MEI will complete mask sets for any PI Product within ten seven (107) working days after the receipt by MEC/MEI of a final database tape for such PI Product. PI will bear all the costs of mask tooling. (b) MEC/MEI will deliver ship to PI (ex the Fab) prototype Wafers of any PI Products within forty-four forty (4440) working days after availability of mask sets for such PI Product. MEC/MEI and PI will negotiate in good faith the possibility of making available to PI fast-turn lots for certain prototype Wafers. PI will pay for those prototype wafers. (c) MEC/MEI will deliver (ex the Fab) ship the first (1st) shipment of the Wafers ordered by PI for that month no later than fifty-four forty (5440) working days after the start of the production as per PI's purchase order for such PI Products, unless PI's purchase order specifies a later delivery date. The rest of the ordered Wafers for that month will be shipped so that PI receives all such Wafers, in equal weekly quantities to the extent practicably possible, within twenty forty (2040) working days after the first (1st) shipment. MEC/MEI shall use its reasonable and best efforts to improve actual leadtime for the production of Wafers. (d) In the event the production of new Products (including Updates of the Products) requires more complicated manufacturing process to MEC, including the case, but not limited to, where the increase of the number of masks used for such production, or the manufacturing processes of the Products are transferred from the present Fab. Fab to another qualified Fab., the leadtime stated in Section 3.5(c3.4(c) may be changed according to such different conditions if both parties agree to such change.

Appears in 1 contract

Sources: Wafer Foundry Agreement (Power Integrations Inc)