Common use of Description of problem Clause in Contracts

Description of problem. Die interfacial delamination occurs due to excessive shear strength breaking the interfacial bond between the die or die coating and the molding compound. Factors governing delamination include, the net thermal displacement during thermal excursion, the gap between the epoxy and the device surface after separation, the topography of the device and the adhesion strength of the molding compound. The resultant effect of these factors can be device failure. Package cracking, or popcorning, occurs during assembly operations. In this case the hygroscopic molding compound absorbs moisture when exposed to typical manufacturing conditions. If moisture has accumulated past a package- dependent critical concentration, the solder reflow conditions (230-260 deg C) cause water to vaporize. Pressure builds up inside the package and eventually, steam is released along the path of least resistance causing cracking of the compound. To avoid popcorning today, Packages are baked and then shipped in drybags which is very costly.

Description of problem. Die interfacial delamination occurs due to excessive shear strength breaking the interfacial bond between the die or die coating and the molding compound. Factors governing delamination include, include the net thermal displacement during thermal excursion, the gap between the epoxy and the device surface after separation, the topography of the device device, and the adhesion strength of the molding compound. The resultant effect of these factors can be device failure. Package cracking, or popcorning, occurs during assembly operations. In this case the hygroscopic molding compound absorbs moisture when exposed to typical manufacturing conditions. If moisture has accumulated past a package- dependent critical concentration, concentration the solder reflow conditions (230-260 deg C) cause water to vaporize. Pressure builds up inside the package and eventually, steam is released along the path of least resistance causing cracking of the compound. To avoid popcorning today, Packages packages are baked and then shipped in drybags which is very costly.