CREDIT AGREEMENT dated as of October 27, 2006, among TTM TECHNOLOGIES, INC., as Borrower, THE GUARANTORS PARTY HERETO, as Guarantors, THE LENDERS PARTY HERETO and UBS SECURITIES LLC, as Sole Lead Arranger and Sole Bookrunner, BANK OF AMERICA, N.A.,...Credit Agreement • November 2nd, 2006 • TTM Technologies Inc • Printed circuit boards • New York
This CREDIT AGREEMENT (this “Agreement”), dated as of October 27, 2006, among TTM TECHNOLOGIES, INC., a Delaware corporation (“Borrower”), the Guarantors (such term and each other capitalized term used but not defined herein having the meaning given to it in Article I), the Lenders, UBS SECURITIES LLC, as sole lead arranger (in such capacity, “Arranger”) and sole bookrunner, BANK OF AMERICA, N.A., COMERICA BANK and SILICON VALLEY BANK, as co-documentation agents (in such capacities, “Co-Documentation Agents”), JPMORGAN CHASE BANK, N.A., as syndication agent (in such capacity, “Syndication Agent”), UBS LOAN FINANCE LLC, as swingline lender (in such capacity, “Swingline Lender”), and UBS AG, STAMFORD BRANCH, as issuing bank (in such capacity, “Issuing Bank”), as administrative agent (in such capacity, “Administrative Agent”) for the Lenders and as collateral agent (in such capacity, “Collateral Agent”) for the Secured Parties and Issuing Bank.
